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Optical Fiber & Telecom
Products in Optical Fiber & Telecom: Epoxy & Epoxy Derivatives
19 Products found in Optical Fiber & Telecom
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EpoxySet Inc.
EPOXIBOND™ 142HT-1
Ready to Use Product Type:
Adhesive
Application Areas:
Fiber Optic Cables, Capacitors, Capacitor Bushings, Semiconductors, Medical Devices, Electronic Components
Compatible Substrates & Surfaces:
Metal, Ceramic, Glass
Chemical Family:
Epoxy & Epoxy Derivatives
EB-142HT-1 is unfilled, low viscosity, high temperature resistant epoxy adhesive. It maintains high lap shear strength up to 210°C and has excellent thermal and chemical resistance. It can be used for bonding, coating, and sealing applications where a thin film with high insulating resistance is required, particularly at elevated temperatures. It is recommended for bonding metals, glass, and ceramic substrates.
EpoxySet Inc.
SetWORX™ UV-35G
Chemical Family:
Epoxy & Epoxy Derivatives
Product Type:
Adhesive, 2K (2 component) Adhesive
Cure Method:
Air Dry, Heat Cure
Application Area:
Optical Applications, Medical Applications, Medical Devices, Optoelectronics Devices
Application Method:
Gun
EPOXIBOND™ EB-153 is unfilled, low viscosity, heat curing, high temperature resistant epoxy adhesive. It maintains high lap shear strength up to 210°C and has excellent thermal and chemical resistance. It can be used for bonding, coating, and sealing applications where a thin film with high insulating resistance is required, particularly at elevated temperatures. It is recommended for bonding metals, glass, and ceramic substrates. It has long pot-life and has an amber color change upon cure.
EpoxySet Inc.
EPOXIBOND™ EB-153
Chemical Family:
Epoxy & Epoxy Derivatives
Product Type:
Encapsulant, Adhesive, Potting Compound, 2K (2 component) Adhesive
Cure Method:
Heat Cure
Application Area:
Electronic Components, Medical Applications, Medical Devices, Semiconductors, Optoelectronics Devices
Compatible Substrates & Surfaces:
Glass, Metal, Ceramic
FLASHBOND™ UV-5402 is a low viscosity, flexible, light curing epoxy adhesive that offers excellent strenth and flexibility for reduced cracking. UV-5402 is low viscosity and high elongation. This product requires direct light exposure during cure. Because of the variability of different UV/LED light sources, it is suggested that the user test and specify intensity and exposure time. This product will cure in the presence of visible light (400-415nm) and can also cure down to 365nm.
EpoxySet Inc.
FLASHBOND™ UV-5608DC
Product Type:
Epoxy Adhesive
Application Area:
Electronic Components, Optoelectronics Devices
Cure Method:
Heat Cure, Air Dry
Chemical Family:
Epoxy & Epoxy Derivatives
SetWORX™ 1510 is a fast setting, toughened epoxy adhesive designed for industrial grade applications. This epoxy system has 1:1 mixing ratio by volume & cure fast at room temperature. When cured it is resistant to a wide range of chemicals and solvents, and acts as an excellent electrical insulator. The cured adhesive exhibits high impact resistance and exceptional bond strength. It can be used for bonding glass, metals, woods and some plastics.
EpoxySet Inc.
SetWORX™ 1510
Product Type:
2K (2 component) Adhesive, Adhesive
Application Area:
Optoelectronics Devices, Medical Applications, Optical Applications
Compatible Substrates & Surfaces:
Plastics, Metal, Glass, Wood, Ceramic
Cure Method:
Air Dry
Chemical Family:
Epoxy & Epoxy Derivatives
EPOXIBOND™ EB-119SP is unfilled, low viscosity, heat curing, high temperature resistant epoxy adhesive. It maintains high lap shear strength up to 210°C and has excellent thermal and chemical resistance. It can be used for bonding, coating, and sealing applications where a thin film with high insulating resistance is required, particularly at elevated temperatures. It is recommended for bonding metals, glass, and ceramic substrates. It has long pot-life and has an amber color change upon cure.
EpoxySet Inc.
EPOXIBOND™ EB-119SP
Chemical Family:
Epoxy & Epoxy Derivatives
Product Type:
2K (2 component) Adhesive, Adhesive
Cure Method:
Heat Cure
Application Area:
Sensors, Medical Applications, Semiconductors, Printed Electronics, Photonic Devices, Electronic Components, Optical Applications, Medical Devices, Semiconductor Die Attach, Optoelectronics Devices, Interconnect
Compatible Substrates & Surfaces:
Glass, Metal, Ceramic
EPOXIBOND™ EB-116 is high strength, structural epoxy adhesive. This tough adhesive has an excellent combination of shear and peel strength. It has also excellent impact and vibration resistance and low temperature flexibility. This high-performance epoxy adhesive exhibits very good physical, thermal, and electrical insulation properties and is excellent for cryogenic applications. It is recommended for bonding glass, metal, ceramics, and engineering thermoplastics. Due to its low viscosity, it can be also used for potting and encapsulating electrical/electronic coponents
EpoxySet Inc.
EPOXIBOND™ EB-155
Chemical Family:
Epoxy & Epoxy Derivatives
Product Type:
Encapsulant, Adhesive, Epoxy Adhesive, Potting Compound
Cure Method:
Air Dry, Heat Cure
Application Area:
Electronic Components, Fiber Optic Cables, Medical Applications, Optoelectronics Devices
Compatible Substrates & Surfaces:
Plastics, Metal
EB-155 is an undiluted, unfilled, low viscosity clear epoxy system that exhibits exceptional resistance to impact and thermal shock. This system has low exotherm and long work life. Applications includes, high bond strength adhesive for most similar and dissimilar substrates; LED displays, any fiber optic application. It can also be used for making in-place laminates or for protective coating on metals etc. Also it can be used for semi-rigid, moisture proof, gas tight seals between plastic and metallic or other substrates. This is also recommended for potting devices such as connector shells from which rigid or flexible wires may protrude directly through the epoxy.
EpoxySet Inc.
EPOXIBOND™ EB-119M
Product Type:
Adhesive, 2K (2 component) Adhesive, Potting Compound
Application Area:
Semiconductor Die Attach, Optical Applications, Electronic Components, Optoelectronics Devices, Interconnect, Photonic Devices, Medical Applications, Medical Devices
Compatible Substrates & Surfaces:
Metal, Glass, Wood
Cure Method:
Air Dry, Heat Cure
Chemical Family:
Epoxy & Epoxy Derivatives
EPOXIBOND™ EB-109M-11 is a flexible, two components, low viscosity, clear epoxy adhesive for optical, medical, and semiconductor applications. This long working life adhesive can be cured at room temperature or with moderate heat and provides excellent adhesion to glass, quartz, metals, wood and most plastics.
EpoxySet Inc.
EPOXIBOND™ EB-107LP-1
Product Type:
Adhesive, 2K (2 component) Adhesive, Potting Compound, Encapsulant
Application Area:
Optical Applications, Electronic Components, Optoelectronics Devices, Mirror, Fiber Optic Cables, Medical Applications, Medical Devices
Compatible Substrates & Surfaces:
Metal, Glass, Plastics
Chemical Family:
Epoxy & Epoxy Derivatives
EPOXIBOND™ EB-177 is a low viscosity, high Tg, two part epoxy that can be used for potting, encapsulating, or bonding. It is used highly in the medical, optical, and semiconductor industries.EB-177 has excellent high temperature resistance at 300°C and excellent solvent, chemical, and moisture resistance including gamma rays, autoclave, and ETO. It is an excellent choice for semiconductor applications including capillary under fill or flipchip die attach.
EpoxySet Inc.
EPOXIBOND™ EB-109M-11
Product Type:
Adhesive, 2K (2 component) Adhesive, Potting Compound, Encapsulant
Application Area:
Optical Applications, Electronic Components, Optoelectronics Devices, Semiconductors, Measuring Instruments, Medical Applications
Compatible Substrates & Surfaces:
Metal, Glass, Wood, Plastics
Cure Method:
Air Dry, Heat Cure
Chemical Family:
Epoxy & Epoxy Derivatives
EPOXIBOND™ EB-155 is an undiluted, unfilled, low viscosity clear epoxy system that exhibits exceptional resistance to impact and thermal shock. This system has low exotherm and long work life. Applications includes, high bond strength adhesive for most similar and dissimilar substrates; LED displays, any fiber optic application. It can also be used for making in-place laminates or for protective coating on metals etc. Also it can be used for semi-rigid, moisture proof, gas tight seals between plastic and metallic or other substrates. This is also recommended for potting devices such as connector shells from which rigid or flexible wires may protrude directly through the epoxy.
EpoxySet Inc.
EPOXIBOND™ EB-177
Product Type:
2K (2 component) Adhesive, Potting Compound, Adhesive
Application Area:
Optoelectronics Devices, Medical Applications, Medical Devices, Optical Applications
Cure Method:
Heat Cure
Chemical Family:
Epoxy & Epoxy Derivatives
EPOXIBOND™ EB-107LY is a two-part, low viscosity, clear epoxy adhesive and encapsulating material. EB-107LY is a low yellowing version of EB-107LP-2. It is recommended for bonding and encapsulating where reduced yellowing is preferred. It is recommended for joining transparent materials, such as glass, and where a thin bond line is desired. EB-107LY can be used for bonding most metals, ceramics, and some plastics.
EpoxySet Inc.
EPOXIBOND™ EB-135
Product Type:
Adhesive, 2K (2 component) Adhesive
Application Area:
Optical Applications, Automotive Lighting, Optoelectronics Devices, Medical Applications, Medical Devices
Compatible Substrates & Surfaces:
Plastics, Metal, Glass
Cure Method:
Air Dry, Heat Cure
Application Method:
Gun
Chemical Family:
Epoxy & Epoxy Derivatives
EPOXIBOND™ EB-107LP-2 is a two component - optical, medical, and semiconductor grade epoxy resin, with low viscosity, long pot-life, and good handling characteristics.
EpoxySet Inc.
EPOXIBOND™ EB-135LP
Product Type:
Adhesive, 2K (2 component) Adhesive
Application Area:
Electrical Components, Optical Applications, Electronic Components, Optoelectronics Devices, Semiconductors, Medical Applications, Medical Devices
Compatible Substrates & Surfaces:
Metal, Glass, Wood, Plastics
Cure Method:
Air Dry, Heat Cure
Chemical Family:
Epoxy & Epoxy Derivatives
FLASHBOND™ UV-3700F is a filled, low shrinkage, light curing epoxy adhesive that offers low CTE and high bonds strength. UV-3700F cures to a high Tg, rigid polymer with excellent adhesive to metals, ceramics, and glass. This filled system is excellent for when low viscosity systems are not ideal. Due to the variability of different UV/LED light sources, it is suggested that the user test and specify intensity and exposure time. This product will cure in the presence of visible light (400- 415nm).
EpoxySet Inc.
EPOXIBOND™ EB-107LP-2
Chemical Family:
Epoxy & Epoxy Derivatives
Product Type:
2K (2 component) Adhesive, Adhesive
Cure Method:
Heat Cure, Air Dry
Application Area:
Semiconductors, Photonic Devices, Optical Applications, Medical Devices, Semiconductor Die Attach, Optoelectronics Devices, Interconnect
Compatible Substrates & Surfaces:
Wood, Glass, Plastics, Metal
FLASHBOND™ UV-3607HTis a 1-component, UV/Thermal cure adhesive & sealant. This material can cure under moderate intensity UV light as well as elevated temperatures for shadowed areas. Its low viscosity is ideal for coating, capillary action, and doming applications. Unlike traditional dual cure epoxy systems which need light + heat, UV-3607HT can cure either with UV/LED light or with heat.
EpoxySet Inc.
FLASHBOND™ UV-3607HT
Chemical Family:
Epoxy & Epoxy Derivatives
Product Type:
1K (1 component) Adhesive
Cure Method:
Heat Cure
Application Area:
Printed Electronics, Optoelectronics Devices
Compatible Substrates & Surfaces:
Metal, Ceramic, Glass
FLASHBOND™ UV-5608DC is an innovative light cure epoxy adhesive. It has unique features that allow for fast processing and fixturing of parts. Once the adhesive has been activated with UV light, it has set open time that allows for assembly of parts. The product continues to cure at room temperature or rapidly cures when exposed to low temperature heat. The cured product exhibits low shrinkage and excellent thermal, water and chemical resistance. Typical applications include bonding of optics, connectors, fibers, lenses, prisms and other electronic components where low shrinkage and low outgassing are required.
APPLI-TEC
APPLI-TEC 0121 Epoxy
Applications:
Adhesives & Sealants, Appliances & Electronics, Optical Fiber & Telecom
Product Families:
Conductive Adhesives, Adhesives & Sealants
Chemical Family:
Epoxy & Epoxy Derivatives
APPLI-TEC 0121 Epoxy is a one-component, silver-filled, electrically conductive, precision mixed, degassed, and frozen epoxy. It has a long work life, high electrical and thermal conductivity (2.2 W/mK), and a volume resistivity of 6.0E -4 (ohm-cm). These features make it ideal for microelectronic, optoelectronic, and thermal management applications. This material has a long pot life, which maintains its dispensability for 2 days, making it suitable for automated dispensing; it can also be cured quickly at elevated temperatures. 0121 also has a high thixotropic index of 3.7. User-friendly packaging allowing for easy dispensing.
United Adhesives
United Adhesives SE 1262
Ready to Use Product Type:
Epoxy Adhesive, Encapsulant, 2K (2 component) Adhesive
Application Areas:
Circuit Substrates, Housing, Semiconductors, Semiconductor Die Attach, Telecommunications Applications, Aerospace Applications, Stack Chip Packaging, Encapsulant, Electronic Components, Connectors
Cure Method:
Heat Cure
Chemical Family:
Epoxy & Epoxy Derivatives
United Adhesives SE 1262 is a flexible epoxy coating & encapsulant.
NextGen Adhesives
NGAC P907-01
Ready to Use Product Type:
Epoxy Adhesive
Application Areas:
Fiber Optic Cables
Compatible Substrates & Surfaces:
Glass
Chemical Family:
Epoxy & Epoxy Derivatives
NGAC P907-01 is a heat cured, low viscosity, rapid curing epoxy adhesive system designed specifically for use in the fiber optic industry.
Jubail Chemical Industries
Razeen® LR 2282
Applications:
Wallcoverings & Decorative Laminates, Optical Fiber & Telecom, Wallcovering & Decorative Laminates
Product Families:
Epoxies, Resins & Binders
Chemical Family:
Phenols & Phenolics, Bisphenol Epoxy Resins, Bisphenol F Type Epoxy
End Uses:
2K (2 Component) Adhesive, 2K (2 component) Coating
Razeen® LR 2282 is a general purpose unmodified epoxy resin based on Bisphenol F with medium viscosity.