Products in Tooling & Moldmaking: Amines

VERSALINK® P 1000 is a liquid oligomeric diamine curative that remains in liquid form at room temperature. It is easily mixed, cast, and cured at ambient temperatures. This product serves as a curative for different diisocyanates and their prepolymers. Additionally, it can be utilized as a modifier for amine or anhydride-cured epoxies, enhancing their flexibility.

VERSALINK® P 2000 is an oligomeric diamine that is in the form of a waxy solid at room temperature. It serves as a curative for different diisocyanates and their prepolymers. Additionally, it can be utilized as a modifier for amine- or anhydride-cured epoxies to improve flexibility. Moreover, when blended with other VERSALINK® oligomeric diamines, it can achieve a liquid state at room temperature.

VERSALINK® P 650 is a liquid oligomeric diamine curative that remains in liquid form at room temperature. It can be easily mixed, cast, and cured at ambient temperatures. This product serves as a curative for different diisocyanates and their prepolymers. Additionally, it can be used as a modifier for amine or anhydride-cured epoxies, enhancing their flexibility.

VERSALINK® P 250 is an oligomeric diamine curative that exists as a waxy solid at room temperature. It can be easily mixed, cast, and cured at ambient temperatures. This product serves as a curative for different diisocyanates and their prepolymers. Furthermore, it can function as a modifier for amine or anhydride-cured epoxies, enhancing their flexibility.

T-Mulz® Z 900 is a modified aliphatic amine and a clear to light yellow-colored, low-viscosity epoxy curing additive. The incorporation of T-Mulz® Z 900 into epoxy systems allows for less critical mix ratios and excellent solvent resistance. It can be used across a wide range of applications, including tooling compounds, laminates, automotive body patching compounds, and metal and plastic adhesives.

EPOTUF® 37-601 is a modified cycloaliphatic amine adduct based on isophorone diamine intended for room temperature curing of EPOTUF epoxy resins.