Products in Other Printing & Packaging Applications: Release Agent

8 Products found in Other Printing & Packaging Applications

SDSWith SDS

TDSWith TDS

Andisil® EM 350C banner

AB Specialty SiliconesAndisil® EM 350C

Functions:Anti-Static Agent, Release Agent, Conductive Agent, Carrier
Chemical Family:Silicones, Non-Ionics
Labeling Claims:Non-Toxic

Andisil® EM 350C Emulsions are non-flammable, non-toxic, nonionic emulsions of various viscosities of polydimethylsiloxane fluids.

Andisil® EM 350 banner

AB Specialty SiliconesAndisil® EM 350

Functions:Anti-Static Agent, Release Agent, Conductive Agent, Carrier
Chemical Family:Silicones, Non-Ionics
Labeling Claims:Non-Toxic

Andisil® EM 350 Emulsions are non-flammable, non-toxic, nonionic emulsions of various viscosities of polydimethylsiloxane fluids.

Polyvel CM-P03 banner

PolyvelPolyvel CM-P03

Functions:Mold Release Agent, Release Agent, Processing Aid
Processing Methods:Injection Molding
Carrier:Polypropylenes (PP), Resin-based
Features:Faster Cycle Time, Cost Effective, Good Flow

CM-P03 silicone processing aid and mold release masterbatches are comprised of polydimethylsilicone* fluid dispersed in polyethylene, polypropylene, nylon, high impact polystyrene resin, acetal copolymers and others.

Polyvel CM-N02 banner

PolyvelPolyvel CM-N02

Functions:Mold Release Agent, Release Agent, Processing Aid
Processing Methods:Injection Molding
Carrier:Resin-based, Polyamides
Features:Faster Cycle Time, Cost Effective, Good Flow

CM-N02 silicone processing aid and mold release masterbatches are comprised of polydimethylsilicone* fluid dispersed in polyethylene, polypropylene, nylon, high impact polystyrene resin, acetal copolymers and others.

Polyvel CM-S01 banner

PolyvelPolyvel CM-S01

Functions:Mold Release Agent, Release Agent, Processing Aid
Processing Methods:Injection Molding
Carrier:Resin-based, Polystyrenes (PS)
Features:Faster Cycle Time, Cost Effective, Good Flow

CM-S01 silicone processing aid and mold release masterbatches are comprised of polydimethylsilicone* fluid dispersed in polyethylene, polypropylene, nylon, high impact polystyrene resin, acetal copolymers and others.

Yi Mei New Material Technology Polypropylene wax LP101 banner

Yi Mei New Material TechnologyYi Mei New Material Technology Polypropylene wax LP101

Functions:Mold Release Agent, Lubricant (External), Release Agent
Chemical Family:Polyolefins, Waxes, Polypropylenes (PP), Polypropylene Waxes
Compatible Polymers & Resins:Linear Low Density Polyethylene (LLDPE) , High-Density Polyethylene (HDPE), Polypropylenes (PP), Polyethylenes (PE)
Processing Methods:Injection Molding
End Uses:Paper Coating, Fabrics

Yi Mei New Material Technology Polypropylene Wax LP101 is widely used in high-tech fields, such as paper coating toner and film condensation, and also includes pigment d ispersants, lubricants; release agents for various synthetic resin moldings; modifiers for printing inks and coatings; fabric treatment auxiliaries, etc.

Polyvel CM-E02 banner

PolyvelPolyvel CM-E02

Functions:Mold Release Agent, Release Agent, Processing Aid
Processing Methods:Injection Molding
Carrier:Resin-based, Polyethylenes (PE)
Features:Faster Cycle Time, Cost Effective, Good Flow

CM-E02 silicone processing aid and mold release masterbatches are comprised of polydimethylsilicone* fluid dispersed in polyethylene, polypropylene, nylon, high impact polystyrene resin, acetal copolymers and others.

MoldWiz® FFIH banner

AxelMoldWiz® FFIH

Functions:Release Agent, Mold Release Agent
Chemical Family:Chemical Mixtures & Blends
Labeling Claims:Wax-free, Silicone-free
Compatible Polymers & Resins:Polyurethanes (PU)

MoldWiz® FFIH - A film forming combination release agent and barrier coat that dries at room temperature. For use on all types of molds. When used on RTV molds, acts as a protective barrier coat greatly extending the life of the molds. The film which is formed on the mold transfers to the molded foam during the curing cycle and acts as a primer for subsequent painting or can be washed off in a water bath, if desired. Does not contain any silicones or waxes and will not interfere with any secondary operations such as decorating, bonding, plating, etc. No necessity for washing of molds between applications.