jER™ YX7105 is a liquid-type epoxy resin with toughness, flexibility, and high stretchability. It is used as an impact modifier for semiconductor, printed electronics and wearable devices to avoid bending and warpage. jER™ YX7105 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol.FeaturesExcellent adhesionGood toughnessGood mechanical, impact and crack resistanceExcellent elasticity and flexibilityApplicationsPrinted electronics (resist ink, build-up wire board, flexible printed wire board, metal core printed circuit board)Semiconductor manufacturing (liquid mold compound, underfill, sidefill, diebonding, ACF, NCF, ACP, NCP)Base film and sheet for wearable devicesCoatingsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

DYTEK® DCH-99 (1,2-diamainecyclohexane) is a cyclic aliphatic diamine made of 100% reclaimed material that is used primarily in epoxy coatings and composites. It provides chemical resistance over a broad range of chemicals, which makes it a superior choice for industrial and marine coatings. Other applications include mining, oil & gas, and pharmaceutical intermediates.

WARADUR® E is an ester wax consisting of esters of montanic acids with multihydroxyl alcohols. Montanic acids are straight-chained monocarboxylic acids with a chain length in the range of C28 – C32. The corresponding esters exhibit chain length in the range of C58 – C66 and provide this wax with a low volatility, good thermostability and low migration rates.

Epoxy functional silane used used to improve dry and wet strength in cured composites reinforced with glass fiber rovings. Silanes are used in a variety of industrial applications. Organofunctional Silanes have an organic functional end group and an alkoxy functional end group which allow the silane to act as a bridge between organic materials and inorganic substrates. The organic functional group is matched to the resin system while the alkoxy group provides the reactive site for crosslinking. These materials are useful as adhesion promoters, crosslinking agents, surface modifiers and hydrophobizing agents.

MoldX® P18 is for pultrusion, resin infusion, CIPP and vacuum bag molding applications. It's particle size distribution with top size particles of less than 18 microns gives superb processing performance at fiberglass contents greater than 50% by weight.

MoldX® S45 is engineered to allow higher loadings versus standard alumina trihydrate (ATH) products and offers excellent processing from 180 phr to as high as 240 phr.

FR Eco-Additive™ 20 is Bromine, antimony, and magnesium free fire retardant and smoke suppressing, polymeric additive. Provides an effective thermal barrier upon exposure to open flame or high radiant heat. This additive is a mixture comprised of TSWB™ and crystalline graphite.

TSWB® is a general purpose fire retarding and smoke suppressing polymeric additive. TSWB® is bromine, antimony and hydrated mineral free.

UPRENE UXA-307 is a polyurethane emulsion used for adhesion. Especially, this product is suitable for production of decorated plywood because it excels in adhesion with polyvinylchloride sheet and plywood/canvas, and has excellent creep resistance. And this product is able to be used as an adhesion (creep resistance) improver by blending it to resin emulsion type adhesion such as anion/nonionic type EVA, acryl, SBR and vinyl acetate.