Products in Prepregs & Molding Compounds: Medical Devices

Plenco® 00755 is a melamine-phenolic copolymer molding compound offering excellent electrical and flame resistant properties. UL recognized under component file E40654. 00755 is available only in brown. 00755 was qualified under military specification MIL-M-14 (superseded by ASTM D-5948) TYPE CMG and batches can, if requested and paid for, be tested for certification to the standard.

Plenco® 00714 is a melamine-phenolic copolymer molding compound, offering excellent arc resistance and comparative track index values. UL recognized under component file E40654. 00714 is available in brown. 00714 was qualified under military specification MIL-M-14 (superseded by ASTM D-5948) Type CMG and batches can, if requested and paid for, be tested for certification to the standard.

Toray E726 is a toughened epoxy resin system with controlled flow for cures at 120°C (248°F), pre-impregnated into high performance fibers such as carbon, glass and aramid. It is designed for use within medical and industrial Applicationss and would also suit a wide range of engineering Applicationss. Toray E726 is compatible for co-cure with Toray EF72, a 120°C (248°F) cure resin film and Toray MicroPly™ SC72A syntactic core.

FR408 low dielectric constant (Dk) and low dissipation factor (Df) make it an ideal candidate for broadband circuit designs requiring faster signal speeds or improved signal integrity. FR408 is compatible with most FR-4 processes. This feature allows the use of FR408 without adding complexity to current fabrication techniques.

Toray RS-1 is an epoxy prepreg resin that provides an excellent balance of mechanical properties, toughness, and modulus. RS-1 has been evaluated and qualified in areas ranging from marine to aerospace and dielectric structures. RS-1 is also available in a lower temperature curing formulation 80°C (176°F).

Toray E720 is a 120°C (248°F) cure toughened epoxy prepreg. E720 offers excellent adhesive properties, allowing direct lamination to honeycomb without the use of a film adhesive. E720 is designed for structural Applicationss in motorsport and marine industries. E720 would also suit general aircraft fittings, sporting equipment, and a wide range of engineering Applicationss. Toray E720 is compatible for co-cure with Toray’s 120°C (248°F) cure resin film MicroPly™ EF72 and syntactic core Toray MicroPly™ SC72A. If fire retardant properties are required, refer to Toray E721-FR. 120°C (248°F) Cure Toughened Epoxy Resin System

Toray E650 is a low temperature curing toughened resin system pre-impregnated into high performance fibers such as carbon, glass and aramid. It is designed for the production of composite structures in the leisure and sporting industries and also for a range of engineering Applicationss. Toray E650 is compatible for co-cure with Toray’s low temperature cure resin film, Toray EF44, and Toray’s low temperature cure syntactic core, Toray MicroPly™ LT64.

Toray 8020 is a new generation of toughened epoxy resin systems offering a balance of mechanical properties and excellent surface finish. The resin system has been developed to offer a long out life and flexible cure schedules and can be applied to a wide range of high performance fibers. Toray 8020 is compatible for co-cure with Toray’s resin film, Toray 8020, and Toray’s syntactic core, Toray MicroPly™ SC8020A.

I-Speed® laminate and prepreg products are manufactured with Isolas' patentable high performance multi-functional resin system, reinforced with electrical grade (E-glass) glass fabric. This system delivers a 15% improvement in Z-axis expansion and offers 25% more electrical bandwidth (lower loss) than competitive products in this space. These properties coupled with superior moisture resistance at reflow, result in a product that bridges the gap from both a thermal and electrical perspective. The I-Speed® resin system is laser fluorescing and UV blocking for maximum compatibility with Automated Optical Inspection (AOI) systems, optical positioning systems and photo imageable solder mask imaging.

P25N consist of a polyimide resin system suitable for military, commercial or industrial electronic applications requiring superior performance and the utmost in thermal properties. These products utilize a polyimide and thermoplastic blend resin, fully cured without the use of Methylenedianiline (MDA). This results in a polymer with a high Tg without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset polyimides.

Toray E721-FR is a modified epoxy resin system of medium viscosity for cures at 120°C (248°F), pre-impregnated into high performance fibers such as carbon, glass, and aramid. Toray E721-FR offers excellent structural properties, flame retardancy, and exceptional toughness allowing direct lamination to honeycomb without the use of resin film. Toray E721-FR is designed for structural Applicationss in the motor racing, marine industries, and for a wide range of engineering Applicationss. If fire-retardant properties are not required, consult separate data sheet for Toray E720.

FR408HR laminate and prepreg products are manufactured with Isola’s patented high performance multifunctional resin system, reinforced with electrical grade (E-glass) glass fabric. This system delivers a 30% improvement in Z-axis expansion and offers 25% more electrical bandwidth (lower loss) than competitive products in this space. These properties coupled with superior moisture resistance at reflow, result in a product that bridges the gap from both a thermal and electrical perspective. The FR408HR system is also laser fluorescing and UV blocking for maximum compatibility with Automated Optical Inspection (AOI) systems, optical positioning systems and photo-imageable solder mask imaging.

8020 Rapi-Ply is a Outstanding vacuum-bag-only (out-of-autoclave) processing capability. No debulking required off Bi-layer form facilitates fast lay-up

I-Tera MT40 is suitable for many of today’s high speed digital and RF/microwave printed circuit designs. I-Tera MT40 features a dielectric constant (Dk) that is stable between - 55°C and +125°C up to W-band frequencies. In addition, I-Tera MT40 offers a lower dissipation factor (Df) of 0.0031 making it a cost effective alternative to PTFE and other commercial microwave and high-speed digital laminate materials. I-Tera MT40 laminate materials are currently being offered in both laminate and prepreg form in typical thicknesses and standard panel sizes. This provides a complete materials solution package for high-speed digital multilayer, hybrid, RF/microwave, multilayer and double-sided printed circuit designs. I-Tera MT40 does not require any special through hole treatments commonly needed when processing PTFE-based laminate materials.

Toray 8020-FR is a modified epoxy resin system suitable for curing between 70°C (158°F) and 120°C (248°F). The medium viscosity resin is pre impregnated into high performance fibers such as carbon, glass and aramid. Toray 8020-FR offers excellent structural properties, flame retardance and toughness. Toray 8020-FR is designed for structural Applicationss in the motor racing, general industrial fabrications and marine industries and is suitable for a wide range of engineering Applicationss.

Tufnol Grade 10G/50 is a laminated plastics material made from woven glass fabric, bonded with silicone resin. It is a rigid sheet material with good resistance to high temperatures and very good electrical insulation properties, especially in applications involving very high frequencies. Note, however, that silicone bonded laminates have mechanical strength properties somewhat lower than some other glass fabric laminates.

Isola’s IS410 has a glass transition temperature (Tg) of 180°C and is specially formulated for superior performance through multiple thermal excursions, passing 6X solder tests at 288°C. IS410 is optimized for enhanced drilling performance allowing high aspect ratio holes of ≤10 mils. Its unique resin chemistry provides CAF resistance with the benefit of long-term reliability of boards built with small feature designs.

Toray E722 is a 120°C (248°F) cure toughened epoxy component prepreg. E722 is designed for structural Applicationss in the motorsport and marine industries. Toray E722 would also suit general aircraft fittings, sporting equipment, and a wide range of engineering Applicationss. Toray E722 is compatible for co-cure with Toray MicroPly™ EF72, a 120°C (248°F) cure resin film, and Toray MicroPly™ SC72A syntactic core. 120°C (248°F) Cure Toughened Epoxy Resin System

370HR laminates and prepregs, deigned by Polyclad, are made using a patented high performance 180°C Tg FR-4 multifunctional epoxy resin system that is designed for multilayer Printed Wiring Board (PWB) applications where maximum thermal performance and reliability are required. We manufacture 370HR laminates and prepregs with high quality E-glass glass fabric for superior Conductive Anodic Filament (CAF) resistance. 370HR provides superior thermal performance with low Coefficient of Thermal Expansion (CTE) and the mechanical, chemical and moisture resistance properties that equal or exceed the performance of traditional FR-4 materials. 370HR is used in thousands of PWB designs and has proven to be best in class for thermal reliability, CAF performance, ease of processing and proven performance on sequential lamination designs.

185HR laminate and prepreg materials are manufactured using Isola’s patented technology, reinforced with electrical grade (E-glass) glass fabric. This system delivers a 340°C decomposition temperature, a lower Z-axis expansion and offers lower loss compared to competitive products in this space. The 185HR system is also laser fluorescing and UV blocking for maximum compatibility with Automated Optical Inspection (AOI) systems, optical positioning systems and phot imageable solder mask imaging.