Products in 3D Printing Polymers: Fused Granulate Fabrication (FGF)

SABIC's Specialties Business LNP™ THERMOCOMP™ 6C004XXAR1 compound is based on Polycarbonate / Polybutylene Terephthalate (PC/PBT) resin containing 20% carbon fiber for Large Format Additive Manufacturing (LFAM) applications. Added features of this grade include: Improved Chemical Resistance, Lower Warp and Good Surface Finish.

SABIC's Specialties Business LNP™ THERMOCOMP™ DC0041XA51 compound is based on PC Copolymer Resin containing 20% carbon fiber for Large Format Additive Manufacturing (LFAM) applications. Added features of this grade include: Higher Stiffness vs. glass fiber, Higher Strength, Higher Temperature Performance and Higher Throughput compared to ABS and PPE, as well as Smooth Surface Finish. This halogen-free flame retardant resin is EN45545 R1 HL3 and R27 HL2 compliant and an ideal candidate for train interior applications (category R1). It also meets requirements of NFPA-130a

SABIC's Specialties Business LNP™ THERMOCOMP™ ZC004XXAR1 compound is based on Polyphenylene Ether / Polystyrene (PPE/PS) blend containing 20% carbon fiber for Large Format Additive Manufacturing (LFAM) applications. Added features of this grade include: Higher Stiffness vs. glass fiber, Lower Thermal Expansion, Improved Hydrolytic Stability, Higher strength to Weight Ratio, Higher Temperature Performance and improved processing vs. ABS based grades.

SABIC's Specialties Business LNP™ THERMOCOMP™ AM DC004XXA11is a compound based on High Heat PC copolymer resin containing 20% carbon fiber for Large Format Additive manufacturing (LFAM) applications, including mid-temperature autoclaving tooling. This compound can offer higher temperature performance than standard PC and avoid some of the processing challenges associated with high temperature materials.

SABIC's Specialties Business LNP™ THERMOCOMP™ EC004XXAR1 is a compound based on Polyetherimide (PEI) resin containing 20% carbon fiber for Large Format Additive manufacturing (LFAM) applications needing higher stiffness vs glass fiber. PEI compounds, based on SABIC's inherently flame-retardant ULTEM™ resins, provide low thermal expansion, high temperature performance, excellent strength-to-weight ratio, high modulus and low creep.

SABIC's Specialties Business LNP™ THERMOCOMP™ EF004XXAR1 is a compound based on Polyetherimide (PEI) resin containing 20% glass fiber for Large Format Additive manufacturing (LFAM) applications. PEI compounds, based on SABIC's inherently flame-retardant ULTEM™ resins, provide low thermal expansion, high temperature performance, excellent strength-to-weight ratio, high modulus and low creep.

SABIC's Specialties Business LNP™ THERMOCOMP™ EC004EXAR1 compound is based on Polyetherimide (PEI) resin containing 20% carbon fiber designed to provide a Wider Process Window and Easier Flow for Large Format Additive Manufacturing (LFAM) applications needing High heat performance. PEI compounds, based on SABIC's inherently flame-retardant ULTEM™ resins, provide Low Thermal Expansion, High Temperature Performance, Excellent Strength-to-Weight Ratio, High Modulus and Low Creep.

SABIC's Specialties Business LNP™ THERMOCOMP™ EZ006EXAR1is a compound based on Polyetherimide (PEI) resin containing 30% milled glass fiber for Large Format Additive manufacturing (LFAM) applications requiring better dimensional stability and low thermal expansion. PEI compounds, based on SABIC's inherently flame-retardant ULTEM™ resins, offer high temperature performance, excellent strength-to-weight ratio, high modulus and low creep.

SABIC's Specialties Business LNP THERMOCOMP AM JC004XXAR1 is a compound based on PESU (Polyethersulfone) resin containing 20% carbon fiber for Large Format Additive manufacturing (LFAM) applications needing an inherent FR, reinforcement, and a high heat amorphous solution. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.