Products in Thermoset Resins: Heat Resistance

jER™ YX4000 is a biphenol-type solid epoxy resin with significantly low melt viscosity, low water absorption and a good balance between adhesiveness and rigidity against stress. It can be used for electrical and electronic applications. jERTM YX4000 is an adduct formed from the reaction of epichlorohydrin and tetramethylbiphenol FeaturesAbrasion, heat and water resistanceElectrical insulationWear resistanceProduct HighlightsSignificantly low melt viscosity (melting point: 108°C)Low chroline contentLow water absorption ApplicationsElectrical and electronic applications (EMC, solder resist, PCB)Potting and encapsulation materialsPowder coatings for ship bottomsAdhesivesComposites *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ 1750 is a very low viscosity Bisphenol F-type liquid epoxy resin. It can be used in sealants, casting agents and adhesives in electrical and electronic applications and fiber reinforced plastics, and for liquid underfill and adhesives for semiconductor manufacturing.FeaturesChemical, heat and water resistanceElectrical insulation*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YL980 is is a Bisphenol A-type liquid epoxy resin with very low chlorine content. It can be used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). Benefits Excellent adhesiveness Maintains high electrical reliability Features Chemical, heat and water resistant Electrical insulating properties Significantly low chlorine content (below 500 ppm) Applications Electrical and electronic applications Potting & encapsulation materials Adhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YL983U is a Bisphenol F-type liquid epoxy resin with very low chlorine content and low viscosity. It is used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). BenefitsExcellent adhesivenessGood elastic recovery FeaturesChemical, heat and water resistantElectrical insulating propertiesSignificantly low chlorine content (below 500 ppm)Low viscosityApplicationsElectrical and electronic applications Potting & encapsulation materialsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

Esschem EMA Bead Copolymers are a range of bead polymers synthesized from ethyl methacrylate (EMA) that offers the strength of polymethyl methacrylate (PMMA) with slightly different properties.The copolymers exhibit a slightly lower glass transition temperature, resulting in a softer and more flexible final product compared to PMMA.By controlling the molecular weight, Esschem can customize the heat resistance and strength of the polymer, making it suitable for various applications across multiple industries.The smaller particle size of the beads enhances surface properties like adhesion, while larger particles contribute to a more robust and rigid material.

Esschem MMA - Styrene Bead Copolymers are a versatile range of copolymers combining methyl methacrylate (MMA) and styrene. These bead copolymers offer a wide array of properties and applications. With increased MMA content, the resulting materials exhibit remarkable strength and transparency. Conversely, a higher proportion of styrene enhances hydrophobicity, hardness, and impact resistance. The molecular weight plays a crucial role in determining the characteristics of the copolymers. Higher molecular weights, often associated with increased styrene content, yield stronger and more heat-resistant materials. Esschem's ability to manipulate the molecular weight distribution allows for customized properties such as durability, elasticity, and processing ease. Additionally, the particle size of the copolymers influences surface properties and rigidity.

DAP K66/6230F is a versatile diallyl iso-phthalate molding compound that incorporates long glass fibers for enhanced strength and flame retardant properties. Supplied in flake form, it is designed for ease of use in molding applications. This compound can be readily preformed and molds easily using standard compression or transfer equipment, making it a flexible choice for various applications. Notably, it has passed NASA outgassing tests, indicating its suitability for applications with stringent outgassing requirements, particularly in industries like aerospace where such standards are critical.

Esschem incorporates sustainable plant-based plasticizers into methyl methacrylate MMA bead polymers. These innovative additives are designed to enhance the flexibility and workability of methacrylate-based polymers. By incorporating bio-plasticizers into MMA bead copolymers, the resulting materials exhibit increased flexibility and reduced glass transition temperature, melting points, and tensile strengths.The inclusion of higher molecular weight components contributes to stronger and more heat-resistant materials.Furthermore, the particle size plays a crucial role in surface properties, where smaller particles enhance adhesion while larger particles contribute to robustness and rigidity.

DAP K77/6220F is a high-quality diallyl iso-phthalate molding compound that combines short glass fibers and flame retardant properties. Supplied in granular form, it is designed for ease of use in molding applications. This compound has excellent flow characteristics, making it easy to pour and mold in standard compression, transfer, or injection equipment. Its flame retardant properties make it suitable for applications where fire resistance is a critical factor, such as in the production of components for fire safety equipment or other high-temperature environments.

DAP K31/6220 is a versatile diallyl iso-phthalate molding compound, filled with short glass fibers and supplied in granular form. This compound offers excellent heat resistance and is suitable for a wide range of applications. It is easy to work with, pouring easily and allowing for preforming. Additionally, it molds readily using standard compression, transfer, or injection equipment. One notable feature of K31/6220 is its FDA approval for direct food contact use, making it a reliable choice for applications in the food industry where heat resistance and safety standards are essential.

DAP K61/6230 is a general-purpose diallyl iso-phthalate molding compound that contains long-glass fiber fillers. It is supplied in flake form, making it suitable for various molding applications. This compound can be preformed and easily molded using standard compression and transfer equipment. It offers good moldability and is designed to meet the requirements of general-purpose molding applications where a balance of mechanical strength and ease of processing is essential.

DAP K43/6260 is a versatile diallyl iso-phthalate molding compound that is filled with minerals and supplied in granular form. This compound is designed for ease of use and versatility. It pours easily, can be preformed, and molds readily using standard compression, transfer, or injection equipment. What sets K43/6260 apart is its exceptional heat resistance, high arc resistance, and ease of molding around inserts. These features make it an ideal choice for applications that demand high-temperature performance and electrical insulation properties, while still allowing for straightforward processing and customization.

ALNOVOL® UF 410 RPC, a carbamic resin on silica, demonstrates compatibility with various synthetic and natural rubbers. Notably, its composition prevents the formation of a clear solution in solvents due to the silica carrier. Primarily functioning as a crosslinking agent and binder, this resin is specifically designed for applications in tires. Its elastomeric functions contribute as a resin within this context.

TUFFALLOY 4270 is a series of Liquid Molding Compounds with thermoplastic properties such as high impact, high heat distortion, and low viscosity. This unique chemistry developed by Hapco to meet today's market demands for prototype and low production parts needs.THE TUFFALLOY 4270 Series are available in (4) speeds.The user has the ability to use different speeds of TUFFALLOY 4270, typically using a slower speed initially and increasing to a fast set, 1 minute working life.PROCESSING: TUFFALLOY 4270 Series can be pressure cast, vacuum cast, or open cast. For best results, TUFFALLOY 4274/75 should be used with Hapco's metering/dispensing equipment, RAPIDFIL, MINI FIL, and RAPIDSHOT.

RIGIDDI-PAK R-4528 SeriesA black, flame retardant, thermally conductive, high performance series that can be used in all types of electrical components. Combined with its ability to dissipate heat, DI-PAK R-4528 also provides low linear thermal expansion, low shrinkage, and low exothermic heat while curing. Meets UL requirements.

HPX-850 is a light weight, heat resistant, two component epoxy backfill system. Like BC 7020, the filler portion is pre-blended into the resin and hardener components for easier handling, thus simplifying the mixing process. HPX-850 features advantages such as low cost, long pot life, machineability, and low shrinkage. It is ideally suited for numerous applications involving mold and core constructions.HPX-850 can be removed from the mold after allowing to set 24 hours @ room temperature (75°F). Post cure for applications requiring temperatures above 150°F can be accomplished in an oven or in use by a gradual heat rise; 2 hours @ 150°F, plus 2 hours @ 250°F, plus 2 hours at 300°F.

RIGIDDI-PAK R-4307A high performance, long working life potting compound for potting/encapsulating units requiring high physical strength and excellent electricals. DI-PAK R-4307 is a holds its mechanical and electrical properties while under the most severe conditions. This is due to its low water absorption, thermal shock resistance, and retention of strength at elevated temperatures.

RIGIDDI-PAK R-4242/4243Low cost, fast set potting compounds with excellent properties and FAST TURNOVER. R-4242/4243 are 1:1 by weight or volume, making them ideal for hand pour or automatic metering systems.

SWANCOR 2596 is a hot-melt epoxy resin, without Diuron and volatile ingredients in the formula. It is special-purpose high-rigidity and toughening product, which has better toughening properties than 2556 with light weight, excellent mechanical strength, heat resistance and corrosion resistance, etc.

RIGIDDI-PAK R-4528 SeriesA black, flame retardant, thermally conductive, high performance series that can be used in all types of electrical components. Combined with its ability to dissipate heat, DI-PAK R-4528 also provides low linear thermal expansion, low shrinkage, and low exothermic heat while curing. Meets UL requirements.

Fudow Company F5636F is a glass fiber.

Fudow Company F5770F is glass fiber.

BC 5114 is a gray low viscosity laminating system. This heat resistant resin exhibits excellent wet out, reasonable working time and may be used at room temperature without postcuring. For use above 150°F a post-cure is required. Post cure for applications requiring temperatures above 150°F can be accomplished in an oven or in use by a gradual heat rise; 2hours @ 150°F, plus 2 hours @ 250°F, plus 2 hours at 300°F. BC 5105 can afford consistent use to 300°F if required. Does not contain VCHD or MDA. Typical uses include constructing vacuum form tools, Injection and compression molds, RTM and RIM molds, and matched dies.

Fudow Company F900 is an organic filler.

BC 6004 is a white thixotropic epoxy surface coat that had the ability to cure and bond to freshly poured wet plaster. This formulated resin compound can be applied with a brush or troweled to a thickness of 1/8" or less on vertical surfaces or over sharp radii without sag or fear of run-off. BC 6004 features moderate heat resistance and tracing hardness.Procedure for Plastic Faced Plaster Applications:BC 6004 should be applied over a properly mold-released surface so that positive removal of the surface coated plaster casting is assured. For best results, two coats approximately 1/16" thick should be used. The first coat should be brushed over the entire surface and then allowed to cure to a gelled or very tacky state. The second coat should be applied over the first. If hemp, glass or other fibrous plaster reinforcements are to be used, they should be placed in the freshly applied second coat immediately. Plaster can then be poured against the wet, second coat of BC 6004. To achieve good adhesion of the epoxy to the plaster, it is recommended that the plaster be poured immediately. The application of two coats of BC 6004 will eliminate surface porosity that sometimes occurs when fast setting, "hot" plaster compounds are cast over a single coat of epoxy.

SWANCOR 2559 is a high Tg hot-melt epoxy resin. The formula does not contain Diuron and volatile ingredients. It has the characteristics of light weight, excellent mechanical strength, heat resistance and corrosion resistance.

RIGIDDI-PAK R-4525 SeriesA general purpose series of low viscosity, strong, potting and encapsulating compounds. DI-PAK R-4525 has excellent electrical insulating properties and bonds well to many substrates. By varying the curing agents, the desired cure and working life can be obtained.

BC 5105 is a clear, unfilled, low viscosity laminating system. This heat resistant resin exhibits excellent wet out, reasonable working time and may be used at room temperature without postcuring. For use above 150°F a post-cure is required. Post cure for applications requiring temperatures above 150°F can be accomplished in an oven or in use by a gradual heat rise; 2hours @ 150°F, plus 2 hours @ 250°F, plus 2 hours at 300°F. BC 5105 can afford consistent use to 300°F if required. Does not contain VCHD or MDA. Typical uses include constructing vacuum form tools, Injection and compression molds, RTM and RIM molds, and matched dies.

Dynafoam 60% Reduction is a Thermoset, Unspecified (TS, Unspecified) product. It can be processed by foam processing and is available in North America. Applications of Dynafoam 60% Reduction include foam and sealing applications.Characteristics include: Heat Resistant Chemical Resistant Good Dimensional Stability

Fudow Company F5772F is glass fiber.

RIGIDDI-PAK R-4545 SeriesA very low viscosity potting and encapsulating system with excellent flow and penetration into the most intricate electronic components, without voids or porosity. The R-4545 Series cure to a hard, shiny, high gloss, plastic finish that is free from "blushing" under all humidity conditions. The R-4545 Series is ideal for electrical applications where surface finish and appearance are critical.

BC 8405 is an unfilled, low viscosity, quick setting two component urethane system. An easy to use 1 to 1 mix ratio (Part A/Part B), BC 8405 offers the user a rationable working time of 15 minutes with parts demoldable in as little as 2 hours. When properly cured, BC 8405 will exhibit high impact strength and yield thermoplastic-like parts. Some outstanding features include the following: mercury free, moderate heat resistance, 1 to 1 mix ratio, turn white upon cure, longer mold life, high impact strength, no objectionable odor, excellent finishing properties, thermoplastic appearance, more parts per day.

BC 7136 is a gray, low toxicity, aluminum filled, epoxy casting resin. This heat resistant system may be used at room temperature without post-curing. May be cast to a thickness of ¾ inch in non-conductive molds. For use above 150°F a post-cure is required. Post cure for applications requiring temperatures above 150°F can be accomplished in an oven or in use by a gradual heat rise; 2 hours @ 150°F, plus 2 hours @ 250°F, plus 2 hours at 300°F. BC 7136 can afford consistent use to 300°F if required. This product was engineered to replace VCHD and MDA systems while retaining excellent heat resistance and low viscosity. Typical uses include constructing vacuum form tools, Injection and compression molds, RTM and RIM molds, and matched dies.

RIGIDDI-PAK R-4525 SeriesA general purpose series of low viscosity, strong, potting and encapsulating compounds. DI-PAK R-4525 has excellent electrical insulating properties and bonds well to many substrates. By varying the curing agents, the desired cure and working life can be obtained.

SWANCOR 2551 is a hot-melt epoxy resin that can be cured at low temperature. The formula does not contain Diuron and volatile ingredients. It has the characteristics of light weight, excellent mechanical strength, heat resistance and corrosion resistance.