Products in Thermoset Resins: Thermal Shock Resistant

ALBIFLEX® 297 is a bisphenol-A-epoxy-silicone block copolymer resin that excels in crafting high-performance elastomers. This versatile liquid, responsive to epoxy, seamlessly cures when combined with aliphatic and cycloaliphatic epoxy resin curing agents. ALBIFLEX® 297 accommodates various conventional casting and molding techniques for your manufacturing needs.

Farboset® 2460 is a novolac epoxy molding compound filled with minerals. It is designed for encapsulating a variety of electrical and electronic components, including tantalum and ceramic capacitors, resistors, resistor networks, and high-performance coils. This compound is formulated to provide fast cure rates, excellent moldability, and superior resistance to thermal shock and moisture. It has been specifically designed to offer improved resistance to moisture ingress, making it a reliable choice for applications where moisture resistance is crucial.

Farboset® 2472V0 is a novolac epoxy molding compound that is mineral-filled for enhanced performance. It offers rapid cure rates, excellent moldability, and exceptional resistance to thermal shock and moisture. This compound has been specially formulated to provide improved resistance to moisture ingress, making it an ideal choice for applications where exposure to moisture is a concern. Additionally, it features a high glass transition temperature, ensuring optimum reliability in performance. Its combination of properties makes it well-suited for a range of applications where resilience to environmental conditions is crucial.

Farboset® 1707-2 is a mineral and glass-filled, anhydride epoxy molding compound that is engineered for the encapsulation of various electrical and electronic components. It is specifically formulated to provide high thermal shock resistance, making it ideal for protecting components that may be subjected to rapid temperature changes or other harsh environmental conditions. This compound helps ensure the reliability and durability of encapsulated components.

Farboset® 1160 is a granular, mineral-filled, anhydride epoxy molding compound designed for the encapsulation of various electrical and electronic components. It offers fast cure rates, long flow, and excellent thermal shock resistance. This compound is suitable for applications involving the encapsulation of coils, transformers, capacitors, diodes, relays, and other components that require good hot rigidity during the molding process.

Farboset® 2461 is a mineral-filled novolac epoxy molding compound that offers fast cure rates, excellent moldability, and superior thermal shock and moisture resistance. It has been formulated to achieve a high glass transition temperature, making it suitable for applications requiring optimal reliability performance, even in very thin sections. Farboset® 2461 is designed for encapsulating a wide range of electronic devices, including capacitors, resistors, resistor networks, and inductor coils, ensuring their protection and reliability in various operating conditions.

Farboset® 2720 is a mineral-filled epoxy molding compound known for its rapid curing, exceptional moldability, and remarkable resistance to thermal shock and moisture. This compound is tailored to offer enhanced protection against moisture ingress and boasts a high glass transition temperature, making it an ideal choice for ensuring reliability in performance. Its primary purpose is to encapsulate a wide variety of electronic devices, including tantalum and ceramic capacitors, resistors, and resistor networks, providing them with a robust shield against environmental factors and mechanical stress.

Farboset® 1180 is a granular, glass-filled, general-purpose anhydride epoxy molding compound. It is formulated for encapsulation applications where excellent thermal shock resistance and physical strength are required. This compound helps protect electronic and electrical components by providing thermal shock resistance and maintaining their integrity under challenging conditions.

Farboset® 1708 is a specialized epoxy molding compound that combines mineral and short glass fillers, making it well-suited for the encapsulation of coils and other electrical and electronic components. It offers excellent moldability, which is important for achieving precise shapes during the encapsulation process. One of its standout features is its extreme resistance to thermal shock, meaning it can withstand rapid changes in temperature without cracking or degrading.

Farboset® 1190 is a fast-curing epoxy molding compound that is mineral and glass-filled, and it contains improved strength properties. It is specially designed for encapsulating a variety of electrical and electronic components, such as coils, transformers, switches, and more. Farboset® 1190 is known for its excellent thermal shock resistance and superior resistance to cracking, making it a reliable choice for these applications.

USP-EAGLE (GP180-65) is an Unsaturated Polyester resin non-accelerated, non-thixotropic, excellent wetting of filler and low shrinkage.It is used in casting application for sanitary ware.

HK Research R0221 is a resilient, light stabilized acrylic modified polyester casting resin.

Ebalta LH 28-1 / TM is a two components epoxy laminating resin, precuring at room temperature and, depending on postcuring, can be used till 175°C. Since this laminating resin system contains no fillers, it has got good wetting properties and makes a high glass fabric content possible. This leads to a low coefficient of thermal expansion and high strength. Together with aluminum granules, ebalta LH 28-1 is suitable for back filling of heat resistant molds and molding tools. At room temperature the curing takes 7 days and the material can only be used for applications till 60°C.

RIGIDDI-PAK R-4307A high performance, long working life potting compound for potting/encapsulating units requiring high physical strength and excellent electricals. DI-PAK R-4307 is a holds its mechanical and electrical properties while under the most severe conditions. This is due to its low water absorption, thermal shock resistance, and retention of strength at elevated temperatures.

Ebalta GM 727 is a well castable two components polyurethane casting resin, curing slowly at room temperature. This casting resin is particularly suitable for solid casting of dimensionally accurate large-volume models with high temperature resistance. Due to low mixing viscosity of GM 727 you can add 70% filler F-B and about 50% plastic granules to reduce shrinkage to approx. 0.05%.

Duresco NU 505 L is a Mineral filled epoxy molding compound with high temperature resistance and very good dimensional stability. Low and isotropic thermal expansion.

The product group ebalta SG 2000 consists of high-quality, nearly odorless two-component-Polyurethane casting resins without mixed in filler. The filler is stirred in when the components are mixed. There are different resin components available, which are processed with one hardener. The single types differ in potlife and curing time.

Duresco NU 6110 T/NU 6110 V is a Glass fiber reinforced epoxy molding compound with very good mechanical properties for high temperature applications.

Ebalta LH 30 / Resin+Hardener is a two components epoxy laminating resin, precuring at room temperature and, depending on postcuring, can be used till 175°C. Since this laminating resin system contains no fillers, it has got good wetting properties and makes a high glass fabric content possible. This leads to a low coefficient of thermal expansion and high strength. Together with aluminum granules, ebalta LH 28-1 is suitable for back filling of heat resistant molds and molding tools.

SYMPOXY 1225FR-CA561 is a filled, two component epoxy system that is pigmented black.

Ebalta MG 453 GF is processed on a two-component low pressure device. After grinding with a sand paper , grit 280, the surface can be varnished with a commercial lacquer. For better adhesion we recommend the use of a primer coat. Release agent – please see category release agent

Polipol 383-G is an isophthalic/NPG based, acrylic modified, medium reactivity and viscosity, solid surface type unsaturated polyester resin with solid surface filling. It is suitable for the production of solid surface products with its excellent UV resistance, high strength and esthetic properties. The main areas of use are the production of hygienic materials such as kitchen / fast food counters and sinks suitable for food contact. Inner It is used in architecture and decoration, wherever a natural granite look is desired.

Duresco NU 514 K/NU 514 L is a Flame retardant epoxy molding compound with good mechanical properties, excellent chemical and high tracking resistance.

TC-1614 A/B is an unfilled, low viscosity epoxy resin system.It is designed to seal porous to semi-porous substrates developing remarkable strength.TC-1614 A/B also has exceptional adhesive characteristics and is capable of high temperatures.

XPD1278 is a low viscosity, two component, polyurethane casting resin specifically designed for casting transformers, coils and electronic components. The cured product has excellent thermal shock resistance.

CLR1190 is an exceptionally tough epoxy casting system with excellent low temperature thermal and mechanical shock resistance.

Ebalta GM 979 is an easy-to-handle-2components-polyurethane casting compound which shows very low adhesive properties compared to molding sand. Due to its high abrasion resistance, GM 979 is especially suitable for foundry patterns, which have to resist to abrasive wear by molded sand. GM 979 even keeps its high mechanical strength when using molding sands with higher temperatures.

HK Research R0059 is a resilient, light stabilized void free polyester casting resin.

HK Research R0217 is a resilient, light stabilized void free polyester casting resin.

ebalta MG 321 FR is processed on a two-component low pressure device. After grinding with a sand paper , grit 280, the surface can be varnished with a commercial lacquer. For better adhesion we recommend the use of a primer coat. Nitrocellulose lacquers have a better adhesion on polyurethane surfaces than on acryllacquer- systems. As release agent you can use our T 03-01. MG 321 FR beige fire behavior according to UL 94, 3 mm thickness V0 With MG 883 the potlife of MG 321 FR beige can be set up to 120 secs. MG 321 FR-S beige/ black - Approved according to UL 94 - File E191776 Vol. 1 fire behavior based on UL 94, 3 mm thickness V0 and 5VA

HK Research R0220 is a resilient, light stabilized void free polyester casting resin.

Duresco NU 6210 V is a Glass fiber reinforced epoxy molding compound with very good mechanical properties and excellent thermal shock resistance.

Duresco NU 461 R is a Epoxy molding compound with excellent thermal shock and chemical resistance for high temperature applications.

Duresco NU 510-1 F is a Glass fiber reinforced epoxy molding compound with very good mechanical properties for high temperature applications.

ebalta SG 150 is a four component acryl casting resin. It consists of 2 liquid components and a hardener powder. Both liquid components are filled with the 1,5 amount in ppw of special aluminum powder. The resin cures within 20-30 minutes to well heat-conducting, heat-resistant molds. The cured molds are very well workable by machines. The structure is extremely dense and the machined areas have an aluminum-like appearance. It is possible to cast any quantity, which can be mixed in one or more containers. Altercating or casting in layers is not possible. Therefore it is very important to determine the casting volume exactly in order to avoid that the mixed quantity is too small. Since the hardener powder is hygroscopic, always seal it air-tight. We recommend to sieve it before each use. Linear shrinkage as per mixture listed in the data sheet. Room temperature and starting temperature of resin components are 21°C as per measurement. For other temperatures or a different content of aluminum powder, shrinkage might also be different.