Products results

ALBIFLEX® 297 is a bisphenol-A-epoxy-silicone block copolymer resin that excels in crafting high-performance elastomers. This versatile liquid, responsive to epoxy, seamlessly cures when combined with aliphatic and cycloaliphatic epoxy resin curing agents. ALBIFLEX® 297 accommodates various conventional casting and molding techniques for your manufacturing needs.

jER™ YX4000 is a biphenol-type solid epoxy resin with significantly low melt viscosity, low water absorption and a good balance between adhesiveness and rigidity against stress. It can be used for electrical and electronic applications. jERTM YX4000 is an adduct formed from the reaction of epichlorohydrin and tetramethylbiphenol FeaturesAbrasion, heat and water resistanceElectrical insulationWear resistanceProduct HighlightsSignificantly low melt viscosity (melting point: 108°C)Low chroline contentLow water absorption ApplicationsElectrical and electronic applications (EMC, solder resist, PCB)Potting and encapsulation materialsPowder coatings for ship bottomsAdhesivesComposites *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YL980 is is a Bisphenol A-type liquid epoxy resin with very low chlorine content. It can be used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). Benefits Excellent adhesiveness Maintains high electrical reliability Features Chemical, heat and water resistant Electrical insulating properties Significantly low chlorine content (below 500 ppm) Applications Electrical and electronic applications Potting & encapsulation materials Adhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX7105 is a liquid-type epoxy resin with toughness, flexibility, and high stretchability. It is used as an impact modifier for semiconductor, printed electronics and wearable devices to avoid bending and warpage. jER™ YX7105 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol.FeaturesExcellent adhesionGood toughnessGood mechanical, impact and crack resistanceExcellent elasticity and flexibilityApplicationsPrinted electronics (resist ink, build-up wire board, flexible printed wire board, metal core printed circuit board)Semiconductor manufacturing (liquid mold compound, underfill, sidefill, diebonding, ACF, NCF, ACP, NCP)Base film and sheet for wearable devicesCoatingsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX8000D is a hydrogenated bisphenol A-type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. It can be used for wide variety of optical adhesives and encapsulants.FeaturesExcellent adhesionFast cure timeLow chlorine contentExcellent transparencyLED-curableUV-curableApplicationsConsumer appliances and electronicsElectrical and electronic displaysElectronics adhesivesPotting compoundsSemiconductor manufacturingLEDs*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ 1750 is a very low viscosity Bisphenol F-type liquid epoxy resin. It can be used in sealants, casting agents and adhesives in electrical and electronic applications and fiber reinforced plastics, and for liquid underfill and adhesives for semiconductor manufacturing.FeaturesChemical, heat and water resistanceElectrical insulation*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX7110 is a tough and flexible liquid-type epoxy resin. It can be used as an impact modifier for brittle materials, as an additive to increase impact resistance, and for stress relaxation to avoid cracking and warpage. jER™ YX7110 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol. Features Adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol Crack and impact resistance Excellent flexibility and elasticity High viscosity Low warpage Maintains flexibility even after full-curing Applications Coatings Adhesives Composites Potting and encapsulation materials Base film/sheet for wearable devices *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ 4250 is a hybrid bisphenol A/bisphenol F-type epoxy resin that is more flexible than conventional polymer-type epoxy resins. It can be used as an additive to add toughness, insulating and vapor barrier properties and resistance to heat, water and chemicals to a variety of applications. FeaturesPolymer-type epoxy resin with epoxy functional groups at the both endsHigh molecular weightHigh softening points Good adhesionApplicationsPCM, CAN and other coatingsPaintThermoplastics Printed electronics Plastic processing *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX8040 is a hydrogenated bisphenol A-type solid epoxy resin, with high molecular weight. It can be used for optical materials such as LED encapsulants and adhesives for displays.FeaturesHigh purityTransparencyLED-curableUV-curable *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ 1256 is a solid epoxy resin produced from Bisphenol A epoxy resin. It is a polymer-type epoxy resin with epoxy functional group at the both ends. It can be used to add toughness, insulating and vapor barrier properties, and resistance to heat, water and chemicals in a variety of applications. FeaturesHigh molecular weightHigh softening pointsGood film formerHydrolysis resistanceFlexibilityStrong adhesionApplicationsPCM, CAN, and other coatingsPaintsFiber-reinforced materialsThermoplasticsPrinted electronicsPlastic processing *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX7400N is an adduct formed from the reaction of epichlorohydrin and an aliphatic polyol.FeaturesAdduct formed from the reaction of epichlorohydrin and an aliphatic polyolExcellent elasticityImpact resistanceApplicationsConsumer appliances and electronicsElectrical devices, assemblies, parts and componentsElectronics adhesivesElectrical and electronic packaging and assemblySpecialty and conformal coatingsPotting compoundsPrinted circuit boards (PCBs)Semiconductor manufacturing*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YL983U is a Bisphenol F-type liquid epoxy resin with very low chlorine content and low viscosity. It is used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). BenefitsExcellent adhesivenessGood elastic recovery FeaturesChemical, heat and water resistantElectrical insulating propertiesSignificantly low chlorine content (below 500 ppm)Low viscosityApplicationsElectrical and electronic applications Potting & encapsulation materialsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

SABIC's Specialties Business LNP THERMOCOMP TF002 compound is based on Polyurethane (TPU) resin containing 10% glass fiber. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business LNP STAT-KON TX06488 compound is based on Polyurethane (TPU) resin containing conductive carbon powder. Added features of this grade include: Excellent Ductility, Electrically Conductive. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

MOCOM Compounds ALCOM® LDDC PMMA 1000UV18123 BK1016-11 is a translucent, UV stabilized Polymethylmethacrylate polymer used for Automotive, Lighting, and interior decoration/finishing, light transparent components, and Black Panel-Technology applications such as lamp covers, display elements, and operating elements. Pre-drying conditions involve 80°C in a dry air (dessiccant) dryer for 3-4 hours and 80°C in an air circulating dryer for 4-6 hours with a maximum moisture content of less than 0.02%. For processing injection molding, the melt temperature should be between 220-270°C and the mold temperature should be between 50-80°C. It should be protected from light.

MOCOM Compounds ALCOM® LDDC PMMA 1000 UV 18124 BK1074-11 is a polymethylmethacrylate base polymer with a UV stabilized filler/additive system suitable for applications such as lamp covers, display elements, operating elements, and light transparent components in automotive and lighting markets. Pre-drying conditions include 80°C in a dry air (dessiccant) dryer for 3-4 hours and 80°C in an air circulating dryer for 4-6 hours, with a maximum moisture content of <0.02%. For injection molding, melt temperature should be between 220-280°C and mold temperature should be between 50-80°C.

METTON® LMR Flame Retardant Grade M2200-FR Polymers are tough and durable engineering plastics (poly-DCPD). They offer part design freedom with integrated functionality and part consolidation opportunities, similar to injection molding, as a replacement for traditional materials like wood and metal. The low-pressure molding process is ideal for producing large plastic parts used in heavy trucks, agriculture, construction, the military, and other industrial applications.

Farboset® 1707-2 is a mineral and glass-filled, anhydride epoxy molding compound that is engineered for the encapsulation of various electrical and electronic components. It is specifically formulated to provide high thermal shock resistance, making it ideal for protecting components that may be subjected to rapid temperature changes or other harsh environmental conditions. This compound helps ensure the reliability and durability of encapsulated components.

DAP ID-40 is a general-purpose diallyl ortho-phthalate molding compound filled with Orlon. It is supplied in a granular form and can be easily molded using standard compression or transfer equipment. This type of compound is versatile and suitable for various molding applications.

Cosmic Epoxy EH61 is an iron-filled epoxy molding compound provided in a black granular form. It is designed for EMI/RFI shielding applications and can be utilized in compression or transfer molding processes to manufacture core rods or encapsulate surface mount and axial leaded inductors. This single molded compound streamlines the manufacturing process, eliminating the labor-intensive over/under molding steps.

GAC Chemical Ammonium Sulfate S Grade is a product with Kosher certification, ensuring adherence to dietary preferences. Widely utilized in industrial processes, it excels in flame retardant and styrene butadiene manufacturing, making it an essential component in these applications. Its versatility extends to leather tanning and water treatment, meeting the diverse needs of industries.

Farboset® 1180 is a granular, glass-filled, general-purpose anhydride epoxy molding compound. It is formulated for encapsulation applications where excellent thermal shock resistance and physical strength are required. This compound helps protect electronic and electrical components by providing thermal shock resistance and maintaining their integrity under challenging conditions.

DAP D62/6130F is a versatile diallyl ortho-phthalate molding compound, with the added benefits of being flame retardant and long-glass fiber filled. It is supplied in flake form, making it convenient for various applications. This compound can be efficiently molded using compression or transfer equipment and is easily preformed for ease of handling. Notably, it maintains its performance when stored at room temperature for up to one year. Additionally, it has successfully passed NASA outgassing tests, indicating its suitability for a range of applications, including those with stringent requirements.

Farboset® 1708 is a specialized epoxy molding compound that combines mineral and short glass fillers, making it well-suited for the encapsulation of coils and other electrical and electronic components. It offers excellent moldability, which is important for achieving precise shapes during the encapsulation process. One of its standout features is its extreme resistance to thermal shock, meaning it can withstand rapid changes in temperature without cracking or degrading.

METTON® LMR M1539 Polymers are tough and durable engineering plastics (poly-DCPD). They offer part design freedom with integrated functionality and part consolidation opportunities, similar to injection molding, as a replacement for traditional materials like wood and metal. The low-pressure molding process is ideal for producing large plastic parts used in heavy trucks, agriculture, construction, the military, and other industrial applications.

DAP K31/6220 is a versatile diallyl iso-phthalate molding compound, filled with short glass fibers and supplied in granular form. This compound offers excellent heat resistance and is suitable for a wide range of applications. It is easy to work with, pouring easily and allowing for preforming. Additionally, it molds readily using standard compression, transfer, or injection equipment. One notable feature of K31/6220 is its FDA approval for direct food contact use, making it a reliable choice for applications in the food industry where heat resistance and safety standards are essential.

Cosmic Epoxy E4920FC is a mineral-filled epoxy molding compound available either in granular form or preformed in a variety of sizes and weights. It offers excellent moisture resistance, thermal cycling stability, and outstanding moldability. Parts molded from this material also resist fungus growth and are designed for the encapsulation of passive devices such as capacitors, inductors, diodes, and rectifiers.

Farboset® 2471VO is designed for use as a compound in thermoset molding. It is available in a solid form, presented as granules, with a granular appearance and a mild odor. This product is insoluble in water and does not exhibit reactivity under normal conditions. It is well-suited for various thermoset molding applications, ensuring safety and reliability in its intended use.

DAP D33/6120 is a versatile general purpose diallyl ortho-phthalate molding compound that incorporates short glass fibers for added strength. Supplied in a free-flowing granular form, it is designed for ease of use in molding applications. This compound can be easily molded using compression, transfer, or injection equipment, and it can also be readily preformed to suit the specific requirements of the application. Its blend of properties makes it suitable for a range of molding applications where strength and versatility are essential.

Esschem MMA - HPMA Bead Copolymers are a versatile range of copolymers combining methyl methacrylate (MMA) with hydroxypropyl methacrylate (HPMA). These bead copolymers offer exceptional performance and customizable properties for various applications. With increased MMA content, these copolymers exhibit elevated glass transition temperatures, melting points, and tensile strengths, providing enhanced strength and durability. Conversely, higher HPMA content improves adhesion and reduces glass transition temperatures, melting points, and tensile strengths, offering flexibility and tailored characteristics. Esschem further enhances the molecular weight of these copolymers, resulting in more rigid and durable materials. By manipulating the particle size, solubility, dispersion properties, and transparency can be optimized, making them ideal for applications that demand transparency, strength, and toughness.

GAC Chemical Ammonium Sulfate Purified Granular Grade comes with the benefit claim of high purity and is certified Kosher. This product is available in granular form.

METTON® LMR Expanding Grade M1537-XXE Polymers are tough and durable engineering plastics (poly-DCPD). As an alternative to conventional materials like wood and metal, they provide component design flexibility with integrated functionality and part consolidation potential, akin to injection molding. The low-pressure molding process is ideal for producing large plastic parts used in heavy trucks, agriculture, construction, the military, and other industrial applications.

METTON® LMR M1540 Polymers are tough and durable engineering plastics (poly-DCPD). They offer part design freedom with integrated functionality and part consolidation opportunities, similar to injection molding, as a replacement for traditional materials like wood and metal. Large plastic components used in military, agricultural, construction, heavy-duty vehicles, and other industrial applications may be produced with the low-pressure molding technique.

Cosmic Alkyd 3D36 is a specialized alkyd molding compound that incorporates long glass fibers for enhanced impact resistance and flame retardant properties. Supplied in flake form, it is designed for ease of use and versatility in molding applications. This compound molds readily using standard compression or transfer equipment, and it maintains its performance for up to one year when stored at temperatures of 100°C or below. Its unique blend of properties makes it suitable for applications that require both impact resistance and flame retardancy.