Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Product Type
- Technologies
- Product Families
Features & Benefits
- Labeling Claims
- Ready-to-Use Product Features
- Benefits
- No electromigration
- Antioxidation
- Good thermal shock
- Room temperature cure
Applications & Uses
- Applications
- Application Area
- Cure Method
- Substrates
Excellent choice aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards.
- How To Use
- Carefully clean and dry all surfaces to be bonded.
- Apply this completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.
- Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.
- Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52°C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.
- Allow the product to cure according to the cure schedule.
- Typical Application
- Adhesive for die attach and SMDs onto the hybrid circuits.
- Resisting oxidation and electro-migration in high-reliability micro-electronics.
Properties
- Thermal Properties
- Typical Properties
- Cured Properties
- Uncured Properties
| Value | Units | Test Method / Conditions | |
| Operating Temperature | (-40) - 175 | °C | - |
| Value | Units | Test Method / Conditions | |
| Cure Type | Room temperature or Heat Cure | - | - |
| Mix Ratio by Weight (Resin: Hardener) | 100:4 | - | - |
| Value | Units | Test Method / Conditions | |
| Hardness | 87.0 | Shore D | - |
| Water Absorption (after 24 hours) | 0.18 | % | - |
| Volume Resistivity | max. 0.0009 | ohm. cm | - |
| Lap Shear Strength (alum to alum) | 1700.0 | psi | - |
| Value | Units | Test Method / Conditions | |
| Specific Gravity (Mixed) | 5.15 | gm/cc | - |
| Reactive Solids Contents | 100.0 | % | - |
| Pot Life (Double the viscosity, 25°C) | 45 | minutes | |
| Particle Size | max. 50 | microns | - |
| Viscosity (25°C) | 600,000±50,000 | cps |
Regulatory & Compliance
- Certifications & Compliance
Technical Details & Test Data
- Cure Schedule
24 hours At 25°C (77°F) 3 hours At 65°C (149°F) 1 hour At 100°C (212°F)
Packaging & Availability
- Availability
This epoxy can be supplied in various different packages.
Size - 1.5gm pouch, 2.5gm pouch, 2.5gm Dual syringe kit, 5gm Dual syringe kit, 5gm pouch, 10gm pouch, 0.5gm Hardener Vial