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DAP 306 is a general-purpose diallyl ortho-phthalate molding compound filled with Orlon and supplied in flake form. It is suitable for a variety of applications, including switches, terminals, insulators, cups, cases, and other components that require strength as well as chemical and moisture resistance. It can also be used for the encapsulation of electrical and electronic components.

Polymer Name: Diallyl Phthalate

End Uses: Cases, Cups, Encapsulant, Insulators, Switches, Terminal Blocks

Density: 1520.0 - 1520.0 kg/m³

Tensile Strength: 24.804000000000002 - 34.45 MPa

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Identification & Functionality

Fillers Included
Polymer Name
Plastics & Elastomers Functions
Technologies

Features & Benefits

Key Features

It has excellent electrical properties and is unaffected by prolonged exposure to elevated temperature and 100% humidity. It is also resistant to solvents, acids, and alkalies.

Applications & Uses

Product Applications

Switches, terminals, insulators, cups, cases or other applications requiring strength and chemical or moisture resistance. Also useful for encapsulation of electrical and electronic components.

Properties

Physical Form
Mechanical Properties
ValueUnitsTest Method / Conditions
Flexural Strength8 - 12,000psi-
Compressive Strength18 - 30,000psi-
Tensile Strength3,600 - 5,000psi-
Impact Strength (Izod Notched)0.60 - 3.0ft-lb / inch-
Thermal Properties
ValueUnitsTest Method / Conditions
Dimensional Stabilitymax. 0.07%-
Thermal Expansion (at -40 °C to 100 °C)4.210⁻⁵ / °C-
Heat Distortion Temperature (at 18.6 kg/cm²)260°C-
Electrical Properties
ValueUnitsTest Method / Conditions
Arc Resistance125seconds-
Dielectric Strength (Kv Step-by-Step, Dry)360volts/mil-
Dielectric Strength (Kv Step-by-Step, Wet)340volts/mil-
Dielectric Breakdown (Step-by-Step, Dry)62Kv-
Dielectric Breakdown (Step-by-Step, Wet)50Kv-
Dielectric Constant (at 1 KHz, Dry)3.2--
Dielectric Constant (at 1 KHz, Wet)3.4--
Dissipation Factor (at 1KHz, Dry)0.02--
Dissipation Factor (at 1KHz, Wet)0.022--
Surface Resistance Megaohms (As is)min. 10¹⁰--
Surface Resistance, megaohms (at 70 °C, 30 Days, at 100% RH)10⁴--
Dielectric Constant (at 1 MHz, Dry)3.1--
Dielectric Constant (at 1 MHz, Wet)3.3--
Dissipation Factor (at 1MHz, Dry)0.013--
Dissipation Factor (at 1MHz, Wet)0.015--
Moisture Properties
ValueUnitsTest Method / Conditions
Water Absorption (at 50 °C,48 hours)0.35%-
Processing Information (Molding)
ValueUnitsTest Method / Conditions
Specific Gravity1.52--
Bulk Factor6--
Molding Pressure500 - 8,000psi-
Molding Temperature135 - 190°C-
Mold Shrinkage0.007 - 0.009In / In-

Regulatory & Compliance

Certifications & Compliance