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DAP D33/6120 is a versatile general purpose diallyl ortho-phthalate molding compound that incorporates short glass fibers for added strength. Supplied in a free-flowing granular form, it is designed for ease of use in molding applications. This compound can be easily molded using compression, transfer, or injection equipment, and it can also be readily preformed to suit the specific requirements of the application. Its blend of properties makes it suitable for a range of molding applications where strength and versatility are essential.

Polymer Name: Diallyl Phthalate

Processing Methods: Compression Molding, Injection Molding, Transfer Molding

End Uses: Cases, Cups, Encapsulant, Insulators, Switches, Terminal Blocks

Density: 1720.0 - 1720.0 kg/m³

Tensile Strength: 0.0414 - 69.0 MPa

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Identification & Functionality

Polymer Name
Plastics & Elastomers Functions
Technologies

Features & Benefits

Key Features

D33 / 6120 has a low water absorption, high dielectric strength, and low dissipation factor along with a fast cure.

Applications & Uses

Plastics & Elastomers Processing Methods
Product Applications

Switches, terminals, insulators, cups, cases and other applications requiring strength. Also useful for encapsulation of electrical and electronic components. Has easy flow and is useful for molding thin parts..

Properties

Physical Form
Mechanical Properties
ValueUnitsTest Method / Conditions
Flexural Strength13 - 15,000psi-
Compressive Strength24 - 26,000psi-
Tensile Strength6 - 10,000psi-
Impact Strength (Izod Notched)0.5 - 1.2ft-lb / inch-
Thermal Properties
ValueUnitsTest Method / Conditions
Dimensional Stabilitymax. 0.01%-
Thermal Expansion (at -40 °C to 100 °C)1.210⁻⁵ / °C-
Heat Distortion Temperature (at 18.6 kg/cm²)260°C-
Electrical Properties
ValueUnitsTest Method / Conditions
Arc Resistance145seconds-
Dielectric Strength (Kv Step-by-Step, Dry)380volts/mil-
Dielectric Strength (Kv Step-by-Step, Wet)340volts/mil-
Dielectric Breakdown (Step-by-Step, Dry)62Kv-
Dielectric Breakdown (Step-by-Step, Wet)60Kv-
Dielectric Constant (at 1 KHz, Dry)4.2--
Dielectric Constant (at 1 KHz, Wet)4.3--
Dissipation Factor (at 1KHz, Dry)0.007--
Dissipation Factor (at 1KHz, Wet)0.011--
Surface Resistance Megaohms (As is)min. 10¹⁰--
Surface Resistance, megaohms (at 70 °C, 30 Days, at 100% RH)10⁴--
Dielectric Constant (at 1 MHz, Dry)4--
Dielectric Constant (at 1 MHz, Wet)4.2--
Dissipation Factor (at 1MHz, Dry)0.013--
Dissipation Factor (at 1MHz, Wet)0.015--
Moisture Properties
ValueUnitsTest Method / Conditions
Water Absorption (at 50 °C,48 hours)0.25%-
Processing Information (Molding)
ValueUnitsTest Method / Conditions
Specific Gravity1.72--
Bulk Factor2.5--
Molding Pressure500 - 8,000psi-
Molding Temperature135 - 190°C-
Mold Shrinkage0.001 - 0.004In / In-

Regulatory & Compliance

Certifications & Compliance