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DAP D69/6130 is a versatile diallyl ortho-phthalate molding compound with the advantage of being long-glass fiber filled. Supplied in flake form, this compound is convenient to work with. It can be easily molded using compression or transfer equipment and can be preformed for improved handling. Notably, it maintains its performance even when stored at room temperature for up to one year. This makes it a reliable choice for a wide range of applications where long-term performance and ease of use are essential.

Polymer Name: Diallyl Phthalate

Processing Methods: Compression Molding, Transfer Molding

End Uses: Housings, Insulators, Structural Parts, Terminal Blocks

Density: 1720.0 - 1720.0 kg/m³

Tensile Strength: 0.0414 - 69.0 MPa

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Identification & Functionality

Polymer Name
Plastics & Elastomers Functions
Technologies

Features & Benefits

Key Features

D69 / 6130 combines the advantages of high impact strength, high insulation resistance, excellent compressive and flexural strength, and easy moldability.

Applications & Uses

Plastics & Elastomers Processing Methods
Product Applications

Structural parts, housings, terminals and insulators, or other applications requiring strength.

Properties

Physical Form
Mechanical Properties
ValueUnitsTest Method / Conditions
Flexural Strength13 - 17,000psi-
Compressive Strength24 - 30,000psi-
Tensile Strength6 - 10,000psi-
Impact Strength (Izod Notched)3.0 - 6.0ft-lb / inch-
Thermal Properties
ValueUnitsTest Method / Conditions
Dimensional Stabilitymax. 0.01%-
Thermal Expansion (at -40 °C to 100 °C)2.410⁻⁵ / °C-
Heat Distortion Temperature (at 18.6 kg/cm²)260°C-
Electrical Properties
ValueUnitsTest Method / Conditions
Arc Resistance180seconds-
Dielectric Strength (Kv Step-by-Step, Dry)400volts/mil-
Dielectric Strength (Kv Step-by-Step, Wet)360volts/mil-
Dielectric Breakdown (Step-by-Step, Dry)62Kv-
Dielectric Breakdown (Step-by-Step, Wet)60Kv-
Dielectric Constant (at 1 KHz, Dry)4--
Dielectric Constant (at 1 KHz, Wet)4.2--
Dissipation Factor (at 1KHz, Dry)0.006--
Dissipation Factor (at 1KHz, Wet)0.009--
Surface Resistance Megaohms (As is)min. 10¹⁰--
Surface Resistance, megaohms (at 70 °C, 30 Days, at 100% RH)50000--
Dielectric Constant (at 1 MHz, Dry)3.9--
Dielectric Constant (at 1 MHz, Wet)4.1--
Dissipation Factor (at 1MHz, Dry)0.013--
Dissipation Factor (at 1MHz, Wet)0.015--
Moisture Properties
ValueUnitsTest Method / Conditions
Water Absorption (at 50 °C,48 hours)0.3%-
Water Extract Conductance30 x 10⁻⁶Mhos / cm-
Processing Information (Molding)
ValueUnitsTest Method / Conditions
Specific Gravity1.72--
Bulk Factor6--
Molding Pressure500 - 8,000psi-
Molding Temperature135 - 190°C-
Mold Shrinkage0.001 - 0.004In / In-

Regulatory & Compliance

Certifications & Compliance