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Farboset® 1160

1 of 35 products in this brand
Farboset® 1160 is a granular, mineral-filled, anhydride epoxy molding compound designed for the encapsulation of various electrical and electronic components. It offers fast cure rates, long flow, and excellent thermal shock resistance. This compound is suitable for applications involving the encapsulation of coils, transformers, capacitors, diodes, relays, and other components that require good hot rigidity during the molding process.

Polymer Name: Epoxy Resins & Compounds

End Uses: Capacitors, Coils, Diodes, Encapsulant, Power Transformers, Relay Bases

Volume Resistivity: 95000000000000.0 - 95000000000000.0 Ohm-m

Flexural Strength: 118.58 - 118.58 MPa

Knowde Enhanced TDS

Identification & Functionality

Fillers Included
Plastics & Elastomers Functions
Technologies

Features & Benefits

Applications & Uses

Product Applications

It is designed for the encapsulation of coils, transformers, capacitors, diodes, relays, and other electrical and electronic components requiring good hot rigidity in molding.

Properties

Color
Flame Rating
Physical Form
Flame Rating
UL 94 HB
Mechanical Properties
ValueUnitsTest Method / Conditions
Tensile Strength11000psi-
Tensile Strength770kg/cm²-
Flexural Strength17000psi-
Flexural Strength1210kg/cm²-
Compressive Strength33000psi-
Compressive Strength2320kg/cm²-
Hardness (Shore D)80--
Impact Strength (Izod Notched)0.022kg-m/cm-
Impact Strength (Izod Notched)0.35ft-Ib/inch-
Thermal Properties
ValueUnitsTest Method / Conditions
Glass Transition Temperature (Tg)130°C-
Thermal Conductivity24x10⁻⁴cal/cm-sec-°C-
Heat Distortion Temperature (at 18.6 kg/cm²)100°C-
Heat Distortion Temperature (at 264 psi)212°F-
Maximum Intermittent Operating Temperature190°C-
Hot Plate Cure Time (at 150 °C)40seconds-
Electrical Properties
ValueUnitsTest Method / Conditions
Surface Resistivitymin. 1.0x 10¹⁶ohm-cm-
Arc Resistance180seconds-
Dissipation Factor (1 KHz)0.004-ASTM 150
Dielectric Constant (1 KHz)3.5--
Dielectric Strength (Short Time, 125 mils)380volts/mil-
Loss Factor (1 KHz)0.014-ASTM 150
Volume Resistivity9.5x 10¹⁵Ohm - cm-
Moisture Properties
ValueUnitsTest Method / Conditions
Water Absorption (at 23 °C, 24 hours)0.026%-
Processing Information (Molding)
ValueUnitsTest Method / Conditions
Bulk Density0.95gm/cc-
Molding Pressure3.5 - 70kg/cm²-
Molding Pressure50 - 1,000psi-
Molding Temperature150 - 180°C-
Molding Temperature302 - 356°F-
Mold Shrinkage0.006cm/cm-
Cure Time (at 150°C)1 - 3minutes-
Molded Density1.97gm/cc-
Spiral Flow89cmEMMI 1-66A

Regulatory & Compliance

Certifications & Compliance

Storage & Handling

Shelf Life
2 days - 6 months
Storage and Shelf life Conditions
Storage Specification Data
Recommended Storage Temperature °C 4
Storage Life (Not more than 40% loss of spiral flow based on original values.) 5 °C , months 6
Storage Life (Not more than 40% loss of spiral flow based on original values.) 25 °C , weeks 1
Storage Life (Not more than 40% loss of spiral flow based on original values.) 35 °C, days 2