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Farboset® 1708

1 of 35 products in this brand
Farboset® 1708 is a specialized epoxy molding compound that combines mineral and short glass fillers, making it well-suited for the encapsulation of coils and other electrical and electronic components. It offers excellent moldability, which is important for achieving precise shapes during the encapsulation process. One of its standout features is its extreme resistance to thermal shock, meaning it can withstand rapid changes in temperature without cracking or degrading.

Polymer Name: Epoxy Resins & Compounds

End Uses: Coils, Encapsulant

Technical Data Sheet
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Knowde Enhanced TDS

Identification & Functionality

Fillers Included
Plastics & Elastomers Functions
Technologies

Features & Benefits

Applications & Uses

Plastics & Elastomers End Uses
Product Applications

It is designed for the encapsulation of coils, and other electrical and electronic components requiring superior hot strength in thin sections.

Properties

Mechanical Properties
ValueUnitsTest Method / Conditions
Flexural Strength18000.0psi-
Flexural Strength1315.0kg/cm²-
Compressive Strength40000.0psi-
Compressive Strength2810.0kg/cm²-
Tensile Strength12000.0psi-
Tensile Strength850.0kg/cm²-
Hardness (Shore D)80.0--
Impact Strength (Izod Notched)0.028kg-m/cm-
Impact Strength (Izod Notched)0.52ft-Ib/inch-
Thermal Properties
ValueUnitsTest Method / Conditions
Thermal Conductivity25 x 10⁻⁴cal/cm-sec-°C-
Heat Distortion Temperature (at 18.6 kg/cm²)110.0°C-
Heat Distortion Temperature (at 264 psi)230.0°F-
Maximum Intermittent Operating Temperature200.0°C-
Hot Plate Cure Time (at 150 °C)32.0seconds-
Electrical Properties
ValueUnitsTest Method / Conditions
Arc Resistance190.0seconds-
Dissipation Factor (1 KHz)0.004-ASTM 150
Dielectric Constant (1 KHz)4.0--
Dielectric Strength (Short Time, 125 mils)700.0volts/mil-
Loss Factor (1 KHz)0.016-ASTM 150
Volume Resistivity6.0x 10¹⁵Ohm - cm-
Surface Resistivity1x 10¹⁶ohm-cm-
Processing Information (Molding)
ValueUnitsTest Method / Conditions
Bulk Density1.0gm/cc-
Molding Pressure3.5 - 70kg/cm²-
Molding Pressure50 - 1.000psi-
Molding Temperature150 - 180°C-
Molding Temperature302 - 356°F-
Mold Shrinkage0.005cm/cm-
Cure Time (at 150°C)1 - 3minutes-
Molded Density1.99gm/cc-
Spiral Flow58.0cmEMMI 1-66A

Regulatory & Compliance

Certifications & Compliance

Storage & Handling

Shelf Life
12 months
Storage and Shelf life Conditions
Storage Specification Data
Recommended Storage Temperature °C 4
Storage Life (Not more than 40% loss of spiral flow based on original values.) 5 °C , months 12