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Farboset® 2270

1 of 35 products in this brand
Farboset® 2270 is a granular epoxy molding compound that contains a combination of glass and mineral fillers. It is based on a novolac epoxy resin and is designed for encapsulating various electrical and electronic components, including capacitors, resistors, hybrids, and more. This compound is known for its good moldability and fast cure rates, especially at lower molding temperatures. It offers excellent performance and reliability for applications where these characteristics are crucial.

Polymer Name: Epoxy Resins & Compounds

End Uses: Capacitors, Encapsulant, Resistor

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Knowde Enhanced TDS

Identification & Functionality

Fillers Included
Plastics & Elastomers Functions
Technologies

Features & Benefits

Applications & Uses

Plastics & Elastomers End Uses
Product Applications

It is designed for the encapsulation of capacitors, resistors, hybrids and other electrical and electronic components.

Properties

Physical Form
Mechanical Properties
ValueUnitsTest Method / Conditions
Flexural Strength16000.0psi-
Flexural Strength1125.0kg/cm²-
Compressive Strength40000.0psi-
Compressive Strength2800.0kg/cm²-
Tensile Strength10000.0psi-
Tensile Strength700.0kg/cm²-
Hardness (Shore D)90.0--
Impact Strength (Izod Notched)0.022kg-m/cm-
Impact Strength (Izod Notched)0.4ft-Ib/inch-
Thermal Properties
ValueUnitsTest Method / Conditions
Glass Transition Temperature (Tg)145.0°C-
Linear Thermal Expansion (Alpha 1)35x 10⁻⁶cm/cm/°C-
Linear Thermal Expansion (Alpha 2)80x 10⁻⁶cm/cm/°C-
Thermal Conductivity22 x 10⁻⁴cal/cm-sec-°C-
Maximum Intermittent Operating Temperature200.0°C-
Hot Plate Cure Time (at 150 °C)39.0seconds-
Electrical Properties
ValueUnitsTest Method / Conditions
Arc Resistance180.0seconds-
Dissipation Factor (1 KHz)0.004-ASTM 150
Dielectric Constant (1 KHz)4.0--
Dielectric Strength (Short Time, 125 mils)min. 400volts/mil-
Loss Factor (1 KHz)0.016-ASTM 150
Volume Resistivity2.0x 10¹⁵Ohm - cm-
Surface Resistivity1.0 x 10¹⁶ohm-cm-
Processing Information (Molding)
ValueUnitsTest Method / Conditions
Bulk Density1.0gm/cc-
Molding Pressure14 - 70kg/cm²-
Molding Pressure200 - 1,000psi-
Molding Temperature302 - 356°F-
Molding Temperature150-180°C-
Post Cure (at 180°C)4 - 16hours-
Cure Time (at 150°C)1 - 2minutes-
Molded Density1.9gm/cc-
Spiral Flow102.0cmEMMI 1-66A

Regulatory & Compliance

Certifications & Compliance

Storage & Handling

Shelf Life
6 months
Storage and Shelf life Conditions
Storage Specification Data
Recommended Storage Temperature °C 4
Storage Life (Not more than 40% loss of spiral flow based on original values.) 5 °C , months 6