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Farboset® 2472V0

1 of 35 products in this brand
Farboset® 2472V0 is a novolac epoxy molding compound that is mineral-filled for enhanced performance. It offers rapid cure rates, excellent moldability, and exceptional resistance to thermal shock and moisture. This compound has been specially formulated to provide improved resistance to moisture ingress, making it an ideal choice for applications where exposure to moisture is a concern. Additionally, it features a high glass transition temperature, ensuring optimum reliability in performance. Its combination of properties makes it well-suited for a range of applications where resilience to environmental conditions is crucial.

Polymer Name: Epoxy Resins & Compounds

End Uses: Capacitors, Coils, Relay Bases, Resistor, Resistor Network

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Identification & Functionality

Fillers Included
Plastics & Elastomers Functions
Technologies

Features & Benefits

Applications & Uses

Product Applications

It is designed to encapsulate a wide range of devices including capacitors, resistors, resistor networks, relays, and high performance coils. Its low viscosity (long spiral flow) allows the molding of delicate components in large, multi-cavity molds.

Properties

Color
Flame Rating
Physical Form
Mechanical Properties
ValueUnitsTest Method / Conditions
Flexural Strength16000.0psi-
Flexural Strength1125.0kg/cm²-
Flexural Modulus2.25x 10⁶psi-
Flexural Modulus1.58kg/cm²-
Compressive Strength30000.0psi-
Compressive Strength2109.0kg/cm²-
Tensile Strength14000.0psi-
Tensile Strength984.0kg/cm²-
Thermal Properties
ValueUnitsTest Method / Conditions
Glass Transition Temperature (Tg)165.0°C-
Linear Thermal Expansion (Alpha 1)23x 10⁻⁶cm/cm/°C-
Linear Thermal Expansion (Alpha 2)77x 10⁻⁶cm/cm/°C-
Hot Plate Cure Time (at 150 °C)35.0seconds-
Electrical Properties
ValueUnitsTest Method / Conditions
Arc Resistance183.0seconds-
Dissipation Factor (1 KHz)0.003-ASTM 150
Dielectric Constant (1 KHz)3.5--
Dielectric Strength (1/8 Inch Section)350.0volts/mil-
Volume Resistivity8.4x 10¹⁵Ohm - cm-
Surface Resistivitymin. 1.0x 10¹⁶ohm-cm-
Processing Information (Molding)
ValueUnitsTest Method / Conditions
Bulk Density1.0gm/cc-
Molding Pressure14 - 70kg/cm²-
Molding Pressure200 - 1,000psi-
Molding Temperature145 - 180°C-
Molding Temperature293 - 356°F-
Mold Shrinkage0.005gm/cc-
Cure Time (at 150°C)1 - 2minutes-
Molded Density1.89gm/cc-
Spiral Flow114.0cmEMMI 1-66A

Regulatory & Compliance

Certifications & Compliance

Storage & Handling

Shelf Life
6 months
Storage and Shelf life Conditions
Storage Specification Data
Recommended Storage Temperature °C 4
Storage Life (Not more than 40% loss of spiral flow based on original values.) 5 °C , months 6