Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Product Type
- Technologies
Features & Benefits
- Ready-to-Use Product Features
Applications & Uses
- Markets
- Application Area
- Application Method
- Product Applications
This compound is designed for coating resistor networks, hybrid circuits, varistors and ceramic capacitors. It is suitable for use on wheel and fluid bed equipment.
Properties
- Thermal Properties
- Electrical Properties
- Powder Characteristics
- Moisture Properties
Value | Units | Test Method / Conditions | |
Glass Transition Temperature (Tg) | 105.0 | °C | - |
Linear Thermal Expansion (Alpha 1) | 60x 10⁻⁶ | cm/cm/°C | - |
Linear Thermal Expansion (Alpha 2) | 160x 10⁻⁶ | cm/cm/°C | - |
Thermal Conductivity | 7 x 10⁻⁴ | cal/cm-sec-°C | - |
Sag Resistance (at 155°C, 40°angle) | 120.0 | mm | - |
Hot Plate Gel Time (at 150 °C) | 105.0 | seconds | - |
Value | Units | Test Method / Conditions | |
Dissipation Factor (1 KHz) | 0.01 | - | ASTM 150 |
Dielectric Constant (1 KHz) | 3.8 | - | ASTM 150 |
Dielectric Strength | 850.0 | volts/mil | ASTM 149 |
Surface Resistivity | 1x 10¹⁶ | ohm-cm | - |
Volume Resistivity | 8.0x 10¹⁵ | Ohm - cm | - |
Value | Units | Test Method / Conditions | |
Particle Size (U.S. Mesh, +80 max) | 1.0 | % | - |
Particle Size (U.S. Mesh, -325) | 30 - 40 | % | - |
Cure Time (at 125°C) | 60.0 | minutes | - |
Cure Time (at 150°C) | 18.0 | minutes | - |
Cure Time (at 175°C) | 10.0 | minutes | - |
Molded Density | 1.44 | gm/cc | - |
Value | Units | Test Method / Conditions | |
Water Absorption (at 23 °C, 24 hours) | 0.7 | % | - |
Regulatory & Compliance
- Certifications & Compliance
Storage & Handling
- Shelf Life
- 6 months
- Storage and Shelf life Conditions
Storage Specification Data Recommended Storage Temperature °C 18 Storage Life 4 °C , months 6