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Creative Materials 102-12A/B-187

102-12/B-187 is a black, two component, thermally conductive epoxy potting and encapsulating compound. This product is designed to release entrapped air rapidly during cure, resulting in a smooth, pinhole free surface. 102-12/B-187 exhibits excellent thermal shock resistance and is especially suited to protecting sensitive electronic devices from a range of operating conditions including moisture, vibration, and temperature variation. Other useful applications include, but are not limited to, potting relays, electronic controls, sensors, and inverters and sealing of electronic component housings. Using B-187 allows for faster curing compared to B119-44.

Features

    Same as above, but extended pot life; better resistance to thermal cracking.

Product Type: 2K (2 component) Sealant, Epoxy Sealant, Potting Compound

Cure Method: Air Dry

Chemical Family: Epoxy & Epoxy Derivatives

    Knowde Enhanced TDS

    Identification & Functionality

    Chemical Family

    Epoxy & Epoxy Derivatives

    Product Type

    2K (2 component) Sealant,

    Epoxy Sealant,

    Potting Compound

    Technologies

    Ready-to-Use Products

    Product Families

    Ready-to-Use Products — Adhesives & Sealants

    Encapsulants

    Features & Benefits

    Ready-to-Use Product Features

    Crack Resistant,

    Long Potlife,

    Pinhole-Free,

    Thermally Conductive

    Applications & Uses

    Markets

    Electrical & Electronics

    Applications

    Electrical & Electronics — Packaging & Assembly

    Potting Compounds

    Cure Method

    Air Dry

    Mixing Instructions

    Premix Part A in original container prior to adding curing agent. Add B-187 to Part A and mix until uniform. NOTE: it is not unusual for crystallization of Part A or B-187 to occur. Warm
    materials in 40 - 45°C water bath to return to original viscosity. Repeated crystallization and decrystallization does not affect the performance of the product.

      Part A B-187 Mixed
    Viscosity (cps, 25°C) 500,000 5,000 100,000
    Mix Ratio (w/w) 100 2.5  
    Pot Life (hours)     4
    Specific Gravity (g/cc) 1.76 0.98 1.73

    Properties

    Color

    Black

    Typical Properties
    ValueUnitsTest Method / Conditions
    Pot Life4Hours-
    Typical Cured Properties
    ValueUnitsTest Method / Conditions
    Hardness85Shore D-
    Volume Resistance1x 1015Q-cm, min-
    Dielectric Strength475V/mil-
    Power Factor (at 60 Hz)0.028--
    Dielectric Constant (at 60 Hz)4.4--
    Tensile Strength9600psi-
    CTE14.5ppm/°C-
    Heat Distortion Temperature148°C-
    Thermal Conductivity2.3W/m-K-
    Cure Shrinkage0.171%-
    Water Absorptionmax. 0.22%-
    Fungus ResistanceNon-nutrient--
    Useful Temperature Range-55 to 230ºC-
    Thermal StabilityGood to 280°C-

    Regulatory & Compliance

    Certifications & Compliance

    ISO 14001,

    ISO 9001

    Storage & Handling

    Shelf Life
    12 Months
    Suggested Handling and Curing Instructions

    Material is ready to use as received. Remove product from freezer and allow material to warm to room temperature before opening container. Best results are obtained when product is cured at one of the following schedules, but good properties can be achieved by curing at temperatures between 65 and 200°C. End user is advised to experimentally determine temperature and time best suited for individual applications.

    Time Temp. (°C)
    4 hr. 65
    1 hr. 80
    30 min. 100
    15 min. 125
    5 min. 150

     

    Storage

     Shelf Life: up to 12 months in unmixed, unopened containers.