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Creative Materials 111-27

111-27 is an electrically insulating coating and encapsulant suitable for application by spraying, dipping, syringe dispensing, pouring, and screen printing. This product features excellent adhesion to Kapton, Mylar, glass, and a variety of other surfaces. Unlike conventional insulating materials, this product is very resistant to flexing and creasing when used as a coating. Some applications for 111-27 include, but are not limited to, insulating polyimide flexible circuits, polymer thick film circuitry, environmental and humidity protection of surface mount components, insulating and diffusive layers of LEDs, and membrane switches. 111-27 also protects components from moisture, salts, and abrasion and features a high surface hardness with good toughness which reduces the risk of stress-fracturing bonded components. 111-27 is suitable for UV inspection.

Features

  • High dielectric strength coating

Product Type: Encapsulant, Insulating Coating

Application Area: Electrical Components, Flexible Circuits, LEDs, Membrane Touch Switch

Application Method: Dip Coating, Injection, Pour, Screen Coating, Spray

Compatible Substrates & Surfaces: Glass, Plastics, Polyimide

Technical Data Sheet
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Knowde Enhanced TDS

Identification & Functionality

Features & Benefits

Applications & Uses

Compatible Substrates & Surfaces

Properties

Physical Form
Typical Properties
ValueUnitsTest Method / Conditions
Optical TransmissionHigh--
Fungus ResistanceNon-nutrient--
Useful Temperature Range-55 to 110ºC-
Thermal Stability200°C-
Electrical Properties
ValueUnitsTest Method / Conditions
Insulation Resistance Cycle 1 (1 to 3 mil film, 25°C, 50% R.H.)1 x 10^15ohms-
Insulation Resistance Cycle 4 (1 to 3 mil film, 65°C, 95% R.H)4 x 10^10ohms-
Insulation Resistance Cycle 7 (1 to 3 mil film, 65°C, 95% R.H.)5 x 10^10ohms-
Insulation Resistance Cycle 10 (1 to 3 mil film, 65°C, 95% R.H.)2 x 10^10ohms-
Insulation Resistance Cycle 10 (1 to 3 mil film, 25°C, 50% R.H., after 24 hours)2 x 10^13ohms-
Leakage Rate (Before thermal shock, microamperes)max. 10--
Leakage Rate (After thermal shock, microamperes)max. 10--
Volume Resistivity1.1 x 10^14ohm-cm-
Dielectric strength1300volts/mil-
Dissipation Factor (100 Hz) 0.011--
Dielectric Constant (at 100 Hz)4.1--
Chloridemax. 40ppm-
Brominemax. 5ppm-
Sulfate (SO4)max. 10ppm-
Phosphate (PO4)max. 30ppm-
Nitrogen (NOx)max. 5ppm-
Thermo-Mechanical Properties
ValueUnitsTest Method / Conditions
Tensile Modulus (-40°C)4000MPa-
Tensile Modulus (+25°C)2000MPa-
Tensile Modulus (+80°C)670MPa-
Glass Transition Temperature103°C-
Coefficient of Thermal Expansion100ppm/°C-
Hardness (at 25°C cure) 55Shore D-

Regulatory & Compliance

Certifications & Compliance

Safety & Health

Safety & Handling
  • Use with adequate ventilation.
  • Keep away from sparks and open flames.
  • Avoid prolonged contact with skin and breathing of vapors.
  • Wash with soap and water to remove from skin.

Storage & Handling

Shelf Life
6 months at 21°C
Suggested Handling

111-27 can be used as-is but further thinning for spray and/or dip coating may be accomplished by adding MEK or acetone for faster drying or xylene or 127-22 for slower drying. Thinned material should be used within 12 - 16 hours.

Suggested Curing

111-27 features a quick setup time at elevated temperatures but also can be cured at ambient temperatures. For good, cured properties one of the following cure schedules will be a good starting profile but end user is advised to experimentally determine temperature and time best suited for individual applications.

Condition Time Temp.
Tack-free time (0.001 - 0.003") 30 - 90 min.

25°C (@30- 50% RH)

Bulk properties develop 24 hr.

25°C (@30- 50% RH)

Full cure 7 days

25°C (@30 50% RH)

Full cure 2 hr. 60°C
Full cure 3 min. 130°C*1

*1-When used as an encapsulant bubbles may form using 130°C cure

Shelf Life

Shelf Life: 6 months at 21°C. Product is moisture sensitive so keep containers closed to avoid contamination. It is highly recommended to purge opened containers with an inert gas blanket (N2, Ar, etc.) before resealing to preserve shelf life as moisture may cause polymerization.