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Designer Molecules U-835

Designer Molecules U-835 is a urethane resin functionalized with an acrylate and a methacrylate. This low viscosity urethane makes it an ideal candidate for a base resin in an adhesive formulation. The urethane linkages help to form a very tough cross-linked film with excellent adhesion on a variety of substrates including metal, polyimide, silicon, and ceramic. The acrylate/methacrylates curable ends make it ideal for both thermal cure via peroxides or UV cure through photo initiators.

Chemical Family: Polyurethanes (PU), Urethanes

Compatible Substrates & Surfaces: Ceramic, Metal

Features: Excellent Adhesion, Good Toughness, Improved Flexibility, Low Viscosity, Multi-Substrate Adhesion, Thermal Resistance, Water Resistance

End Uses: Radiation Curable Coating

Technical Data SheetSafety Data Sheet
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Identification & Functionality

Chemical Family

Polyurethanes (PU),

Urethanes

CASE Ingredients Functions

Binder & Resin

Technologies

CASE Ingredients

Product Families

CASE Ingredients — Resins & Binders

Other Resins & Binders,

Polyurethanes (PU)

Features & Benefits

CASE Ingredients Features

Excellent Adhesion,

Good Toughness,

Improved Flexibility,

Low Viscosity,

Multi-Substrate Adhesion,

Thermal Resistance,

Water Resistance

Product Highlights
  • Excellent toughener
  • Hydrophobic
  • Fast cure
  • Good thermal stability
  • Flexible

Applications & Uses

Markets

Adhesives & Sealants,

Healthcare & Pharma,

Paints & Coatings

Applications

Healthcare & Pharma — Medical

Dental

Adhesives & Sealants — Other Adhesives & Sealants Applications

Paints & Coatings — Other Paints & Coatings Applications

Compatible Polymers & Resins

Other Compatible Resins,

Polyimides (PI)

Compatible Substrates & Surfaces

Ceramic,

Metal

Cure Method

Heat Cure,

Radiation Cure

Coating Type

Radiation Curable Coating

RECOMMENDED FORMULATION USE

U-835 is recommended for use as a base resin or additive for adhesives designed for metal substrates. The acrylate/methacrylate end groups allow for fast cure with excellent toughness. The resin has shown to have superior electrical and thermal conductivity in various conductive formulations.

Properties

Physical Form

Liquid

Appearance
Light tan liquid
Typical Properties
ValueUnitsTest Method / Conditions
Viscosity at 25°C (typical)3000cPHaake Rheometer
Density1g/cc-
Functionality2--
Molecular Weight835daltons-
Weight Loss at 300°Cmax. 5.0%%TGA
Decomposition Temperature350°CTGA
Recommended Storage Temp10°C or below--
Glass Transition Temperature (cured with 2% Dicumyl Peroxide)18°CTMA (DMA)
Coefficient of Thermal Expansion (cured with 2% Dicumyl Peroxide)α1 103 (α2 201)ppm/°CTMA
Dynamic Tensile Modulus Cured with 2% Dicumyl Peroxide -65°C2400MpaRheometrics Rheometer
Dynamic Tensile Modulus Cured with 2% Dicumyl Peroxide 25°C620MpaRheometrics Rheometer
Dynamic Tensile Modulus Cured with 2% Dicumyl Peroxide 150°C132MpaRheometrics Rheometer