EpoxySet Inc. EC-1030FL

Identification & Functionality

Chemical Family

Epoxy & Epoxy Derivatives

Product Type

2K (2 component) Adhesive,

Encapsulant,

Potting Compound

Technologies

Ready-to-Use Products

Product Families

Ready-to-Use Products — Adhesives & Sealants

Encapsulants

Features & Benefits

Ready-to-Use Product Features

Flexible,

High Temperature Performance,

High Temperature Strength,

Low Temperature Flexibility,

Low Temperature Strength

Applications & Uses

Markets

Electrical & Electronics

Applications

Electrical & Electronics — Packaging & Assembly

Potting Compounds

Properties

Component A

	Value	Units	Test Method / Conditions
Resin Viscocity (at 25°C)	60000 - 100000	cPs	-
Resin Specific Gravity (at 25°C)	1.95	-	-

Component B

	Value	Units	Test Method / Conditions
Hardner Viscocity (at 25°C)	1800	cPs	-
Hardener Specific Gravity (at 25°C)	1.02	-	-

Typical Properties

	Value	Units	Test Method / Conditions
Mixed Viscocity	10000 - 20000	cPs	-
Mix Ratio (By Weight)	100/50	-	-
Gel Time (at 25°C, 100g)	10 - 15	minutes	-
Cure Schedule (at 100°C)	4	hours	-
Cure Schedule (at 150°C)	1	hours	-
Alternate Cure Schedule (at 125°C)	4	hours	-
Hardness	50	Shore D	-
Tensile Strength	1200	psi	-
Service Temperature Range	-45 to 200	°C	-