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Isola is a leader in global material sciences. We design, develop, manufacture, and qualify copper-clad laminates and dielectric prepregs used to fabricate multilayer printed circuit boards (PCBs).

Isola has manufacturing, research and development, technical support and sales teams across Asia, Europe, and the United States. Why is that important? It allows us to service customers all around the world from start to finish. Knowledge sharing and collaboration is at the heart of our values, and our global teams work closely together to deliver our very best solutions, every single time.

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ASTRA

TERRAGREEN

I-TERA

TACHYON

I-SPEED

P95/P25 consist of an HB flammability rated polyimide resin system suitable for military, commercial or industrial electronic applications requiring superior performance and the utmost in thermal properties. These products utilize a polyimide and thermoplastic blend resin, fully cured without the use of MDA (Methylenedianiline). This results in a polymer with a high Tg without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset polyimides.


Isola P95/P25

IS420 laminate and prepreg products are manufactured with a unique high performance multifunctional epoxy resin, reinforced with electrical grade (E-glass) glass fabric. This system provides improved thermal performance and low expansion rates in comparison to traditional FR-4 while retaining FR-4 processability. In addition to this superior thermal performance, the mechanical, chemical and moisture resistance properties all equal or exceed the performance of traditional FR-4 materials. The IS420 system is also laser fluorescing and UV blocking for maximum compatibility with Automated Optical Inspection (AOI) systems, optical positioning systems and photo imageable solder mask imaging.

Isola IS420

Isola’s IS410 has a glass transition temperature (Tg) of 180°C and is specially formulated for superior performance through multiple thermal excursions, passing 6X solder tests at 288°C. IS410 is optimized for enhanced drilling performance allowing high aspect ratio holes of ≤10 mils. Its unique resin chemistry provides CAF resistance with the benefit of long-term reliability of boards built with small feature designs.

Isola IS410

P25N consist of a polyimide resin system suitable for military, commercial or industrial electronic applications requiring superior performance and the utmost in thermal properties. These products utilize a polyimide and thermoplastic blend resin, fully cured without the use of Methylenedianiline (MDA). This results in a polymer with a high Tg without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset polyimides.


Isola P25N

I-Tera MT40 is suitable for many of today’s high speed digital and RF/microwave printed circuit designs. I-Tera MT40 features a dielectric constant (Dk) that is stable between - 55°C and +125°C up to W-band frequencies. In addition, I-Tera MT40 offers a lower dissipation factor (Df) of 0.0031 making it a cost effective alternative to PTFE and other commercial microwave and high-speed digital laminate materials. I-Tera MT40 laminate materials are currently being offered in both laminate and prepreg form in typical thicknesses and standard panel sizes. This provides a complete materials solution package for high-speed digital multilayer, hybrid, RF/microwave, multilayer and double-sided printed circuit designs. I-Tera MT40 does not require any special through hole treatments commonly needed when processing PTFE-based laminate materials.

I-TERA® MT40

I-Speed® laminate and prepreg products are manufactured with Isolas' patentable high performance multi-functional resin system, reinforced with electrical grade (E-glass) glass fabric. This system delivers a 15% improvement in Z-axis expansion and offers 25% more electrical bandwidth (lower loss) than competitive products in this space. These properties coupled with superior moisture resistance at reflow, result in a product that bridges the gap from both a thermal and electrical perspective. The I-Speed® resin system is laser fluorescing and UV blocking for maximum compatibility with Automated Optical Inspection (AOI) systems, optical positioning systems and photo imageable solder mask imaging.

I-SPEED®

TerraGreen® is engineered for such high-performance applications as power amplifier boards for LTE base stations, internet infrastructure and cloud computing. TerraGreen ® features a Dielectric Constant (Dk) that is stable between -55°C and 125°C, up to 20 GHz. TerraGreen® is a lead-free assembly material and is easy to process. This high-performance material utilizes a short-lamination cycle; the product is easy to drill, does not require plasma desmear, and the prepreg shelf life is similar to FR-4 materials. TerraGreen® is suitable for high-layer count, high-speed digital backplanes and is compatible with Isola’s FR-4 materials for hybrid designs. TerraGreen® meets UL 94 V-0 and is halogen free.

TERRAGREEN®

IS550H was developed in conjunction with a consortium of industry experts for high power &amp; high voltage applications and PEV &amp; HEV automotive electrification. The resulting solution addresses critical application needs for use in a harsh environment where very demanding, long term thermal reliability performance, extreme thermal cycling and very high voltage CAF &amp; electro-migration resistance is required.

Isola IS550H

FR408HR laminate and prepreg products are manufactured with Isola’s patented high performance multifunctional resin system, reinforced with electrical grade (E-glass) glass fabric. This system delivers a 30% improvement in Z-axis expansion and offers 25% more electrical bandwidth (lower loss) than competitive products in this space. These properties coupled with superior moisture resistance at reflow, result in a product that bridges the gap from both a thermal and electrical perspective. The FR408HR system is also laser fluorescing and UV blocking for maximum compatibility with Automated Optical Inspection (AOI) systems, optical positioning systems and photo-imageable solder mask imaging.

Isola FR408HR

Isola

Isola is a leader in global material sciences. We design, develop, manufacture, and qualify copper-clad laminates and dielectric prepregs used to fabricate multilayer printed circuit boards (PCBs).

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Isola A11 products bring the fabricator specific thermal characteristics appropriate for use in heat sink bonding, die cavity board (direct chip attachment) and multilayer rigid-flex applications.

A11 Technical Data Sheet

A11 Technical Data Sheet - Isola

Isola A11

A11 products bring the fabricator specific thermal characteristics appropriate for use in heat sink bonding, die cavity board (direct chip attachment) and multilayer rigid-flex applications.

Isola A11 - Laminate - Glass Fibers - Knowde

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	Value	Units	Test Method / Conditions
Cure Temperature Recommended for Full Cure	171.0	°C	-
Decomposition Temperature (Td) by TGA (5% weight loss)	300.0	°C	IPC-TM-650
Dielectric Breakdown	80.0	kV	IPC-TM-650
Dk, Loss Tangent(1 GHz)	0.033	-	IPC-TM-650
Dk, Permittivity(1 GHz)	4.5	-	IPC-TM-650
Flammability (Laminate & laminated prepreg)	HB	Rating	UL 94
Glass Transition Temperature (Tg) by DSC	100.0	°C	IPC-TM-650
Min. for Functional Bonding	149.0	°C	-
Modified Circle Flow 104	0.010 - 0.100	-	-
Modified Circle Flow 108	0.010 - 0.100	-	-
Peel Strength (1 oz. EDC foil)	9.0	N/mm (lb/inch)	IPC-TM-650
Pressed Thickness 104	2.0	mm	-
Pressed Thickness 108	3.7	mm	-
Resin Content 104	75.0	%	IPC-TM-650
Resin Content 108	65.0	%	IPC-TM-650
Resin Flow Testing 104	2.0	-	IPC-TM-650
Resin Flow Testing 108	2.0	-	IPC-TM-650
Thermal Conductivity	0.25	W/m·K	ASTM E1952
X/Y-Axis CTE	18/16	ppm/°C	IPC-TM-650
Z-Axis CTE	80.0	ppm/°C	IPC-TM-650

Isola A11

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