Products

NexSil™ 85-40 is an alkaline dispersion of 40 - 60 nm colloidal silica at a 40% SiO2 concentration in water. The particles are negatively charged. The product can be used in paper, steel and precision polishing applications where large particle size colloidal silica is required. NexSil 85-40 is a good choice for sapphire polishing and other specialty wafer polishing applications. NexSil 85-40 provides good balance between removal rate and surface finish. Consult NYACOL® for recommendations on starting conditions.

NexSil 6 is an alkaline dispersion of 6 nm colloidal silica at a 16-18% SiO2 concentration in water. The particles are negatively charged and have a high surface area. NexSil 6 can be used in paper, steel, and precision polishing applications where a very small particle size colloidal silica is required.

NexSil 8 is an alkaline dispersion of 8 nm colloidal silica at 30% SiO2 concentration in water. The particles are negatively charged and have a high specific surface area. The product can be used in a wide variety of applications such as precision investment casting, metal surface treatment, textile treatment, catalyst binder or other applications where a very small particle size colloidal silica is required.

NexSil 12 is an alkaline dispersion of 12 nm colloidal silica at 30% SiO2 concentration in water. The particles are negatively charged and have a high specific surface area. The product can be used in a wide variety of applications such as precision investment casting, precision polishing, metal surface treatment, textile treatment, catalyst binder or other applications where a very small particle size colloidal silica is required.

NexSil 12HS is an alkaline dispersion of 12 nm colloidal silica at 40% SiO2 concentration in water. The particles are negatively charged and have a high specific surface area. The product can be used in a wide variety of applications such as precision investment casting, metal surface treatment, textile treatment, catalyst binder or other applications where a very small particle size colloidal silica is required.

NexSil™ 125-40 is an alkaline dispersion of 70 - 90 nm colloidal silica at a 40% SiO2 concentration in water. The particles are negatively charged. The product can be used in paper, steel and precision polishing applications where large particle size colloidal silica is required. NexSil 125-40 is a good choice as an abrasive for Si wafer stock-polish, sapphire wafer polishing and other hard substrate polishing. NexSil 125-40 is also excellent for paper antiskid and other antiblocking applications where the large particle colloidal silica is used. Consult NYACOL® for recommendations on starting conditions.

NexSil 20 is an alkaline dispersion of 20 nm colloidal silica at 40% SiO2 concentration in water. The particles are negatively charged and have a high specific surface area. The product can be used in a wide variety of applications such as precision investment casting, precision polishing, metal surface treatment, textile treatment, catalyst binder or other applications where a small particle size colloidal silica is required.

NexSil 20NH4 is an ammonia-stabilized alkaline dispersion of 20 nm colloidal silica at 40% SiO2 concentration in water. The particles are negatively charged and have a high specific surface area. NexSil 20NH4 can be used in a wide variety of applications such as precision investment casting, metal surface treatment, textile treatment, catalyst binder or other applications where a very small particle size colloidal silica is required.

NexSil 20A is an acidic dispersion of 20 nm colloidal silica at 30% concentration. The product is a clear liquid composed of highly uniform, spherical silica particles. The product has a slightly negative charge and is essentially free of Cl and sulfate ions.

NexSil 85K-40 colloidal silica is a large-particle product primarily intended as an abrasive for formulated polishing slurries. NexSil 85K-40 is based on high-purity colloidal silica and contains very low levels of trace impurities, minimizing the introduction of impurities in the polishing process.