Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Reinforcement Material
- Composite Materials Functions
- Technologies
- Product Families
Features & Benefits
Applications & Uses
Properties
- Typical Properties
| Value | Units | Test Method / Conditions | |
| Dielectric Constant at 10GHz | 2.17, 2.20 | - | IPC TM-650 2.5.5.5 |
| Surface Resistivity | 0.29 x 10^7 | MΩ | IPC TM-650 2.5.17.1 |
| Dielectric Constant at 1MHz | 2.17, 2.20 | - | IPC TM-650 2.5.5.3 |
| Volume Resistivity | 1.4 x 10^9 | MΩ-cm | IPC TM-650 2.5.17.1 |
| Dissipation Factor tan d, at 10 GHz | 0.0009 | - | IPC TM-650 2.5.5.5 |
| Dissipation Factor at 1 GHz | 0.0008 | - | IPC TM-650 2.5.5.3 |
| Thermal Coefficient of εr | -160 | ppm/°C | IPC TM-650 2.5.5.5 Adapted |
| Peel Strength | 14 | lb/in | IPC TM-650 2.4.8 |
| Arc Resistance | min. 180 | seconds | ASTM D-495 |
| Tensile Modulus | 267, 202 | kpsi | ASTM D-638 |
| Tensile Strength | 8.1, 7.5 | kpsi | ASTM D-882 |
| Compressive Modulus | 237 | kpsi | ASTM D-695 |
| Flexural Modulus | 357 | kpsi | ASTM D-790 |
| Dielectric Breakdown | min. 45 | kV | ASTM D-149 |
| Density | 2.23 | g/cm3 | ASTM D-792 Method A |
| Water Absorption | 0.02 | % | MIL-S-13949H 3.7.7 and IPC TM-650 2.6.2.2 |
| Coefficient of Thermal Expansion - X Axis | 25 | ppm/°C | IPC TM-650 2.4.24 |
| Coefficient of Thermal Expansion - Y Axis | 34 | ppm/°C | IPC TM-650 2.4.24 |
| Coefficient of Thermal Expansion Z Axis | 252 | ppm/°C | IPC TM-650 2.4.24 |
| Thermal Conductivity | 0.261 | - | ASTM E-1225 |
| Outgassing Total Mass Loss | 0.01 | % | NASA SP-R-0022A |
| Outgassing Collected Volatile Condensable Material | 0.01 | % | NASA SP-R-0022A |
| Outgassing Water Vapor Regain | 0.01 | % | NASA SP-R-0022A |
Technical Details & Test Data
- Dielectric Constant vs. Frequency
Demonstrates the Stability of Dielectric Constant across Frequency. This information was correlated from data generated by using a free space and circular resonator cavity. This characteristic demonstrates the inherent robustness of the Laminates across Frequency, thus simplifying the final design process when working across EM spectrum. The stability of the Dielectric Constant of DiClad over frequency ensures easy design transition and scalability of design.
- Dissipation Factor vs. Frequency
Demonstrates the Stability of Dissipation across Frequency. This characteristic demonstrates the inherent robustness of the laminates across Frequency, providing a stable platform for high frequency applications where signal integrity is critical to the overall performance of the application.