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SABIC's Specialties Business Brand

449 Products found on SABIC's Specialties Business

LNP™ THERMOCOMP™ Compound JF004RXP banner

LNP™ THERMOCOMP™ Compound JF004RXP

Polymer Name:Polyethersulfone (PES)
Processing Methods:Injection Molding
Fillers Included:Glass Fiber, PTFE
Additives Included:Mold Release Agent, Flame Retardant
Flexural Modulus:6000.0 - 6000.0 MPa

LNP THERMOCOMP JF004RXP compound is based on Polyethersulfone (PES) resin containing glass fiber. Added features of this grade include: Mold Release.

LNP™ THERMOCOMP™ Compound EC006E banner

LNP™ THERMOCOMP™ Compound EC006E

Polymer Name:Polyether Imide (PEI)
Processing Methods:Injection Molding
Fillers Included:Carbon Fiber
Flexural Modulus:19160.0 - 19160.0 MPa

LNP THERMOCOMP EC006E compound is based on Polyetherimide (PEI) resin containing 30% carbon fiber. Added features of this grade include: Easy Molding, Electrically Conductive.

LNP™ THERMOCOMP™ Compound KF006 banner

LNP™ THERMOCOMP™ Compound KF006

Polymer Name:Polyacetal Copolymer (POM)
Processing Methods:Injection Molding
Fillers Included:Glass Fiber
Flexural Modulus:10270.0 - 10270.0 MPa

SABIC's Specialties Business LNP THERMOCOMP KF006 compound is based on POM (Acetal) copolymer resin containing 30% glass fiber. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

LNP™ THERMOCOMP™ Compound PB006EQ banner

LNP™ THERMOCOMP™ Compound PB006EQ

Polymer Name:Polyamide 6 (PA 6)
Processing Methods:Injection Molding
Fillers Included:Glass Bead, Glass Fiber
Additives Included:Impact Modifier
Flexural Modulus:2400.0 - 2400.0 MPa

LNP THERMOCOMP PB006EQ compound is based on Nylon 6 resin containing 30% glass bead. Added features of this grade include: Reduced Moisture.

LNP™ THERMOCOMP™ Compound MB006SXP banner

LNP™ THERMOCOMP™ Compound MB006SXP

Polymer Name:Polypropylene (unspecified)
Processing Methods:Injection Molding
Additives Included:Mold Release Agent, Heat Stabilizer
Fillers Included:Glass Bead, Glass Fiber

SABIC's Specialties Business LNP THERMOCOMP MB006SXP compound is based on Polypropylene (PP) resin containing 30% glass bead. Added features of this grade include: Heat Stabilized. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

LNP™ THERMOCOMP™ Compound DF002FVQ banner

LNP™ THERMOCOMP™ Compound DF002FVQ

Polymer Name:Polycarbonate (PC)
Processing Methods:Laser Sintering (SLS), Injection Molding
Fillers Included:Glass Fiber
Additives Included:Mold Release Agent, Flame Retardant, Heat Stabilizer
Flexural Modulus:4100.0 - 4100.0 MPa

SABIC's Specialties Business LNP™ THERMOCOMP™ DF002FVQ compound is based on Polycarbonate (PC) resin containing 10% glass fiber and available in black color only. Added features of this grade include: Improved Plating Surface and Mechanical Performance suitable for Laser Direct Structuring (LDS) applications, Good Adhesion Strength, UL94 V0@0.8mm (black).

LNP™ THERMOCOMP™ Compound DX05477 banner

LNP™ THERMOCOMP™ Compound DX05477

Polymer Name:Polycarbonate (PC)
Processing Methods:Injection Molding
Fillers Included:Glass Fiber
Additives Included:Mold Release Agent, Flame Retardant

SABIC's Specialties Business LNP™ THERMOCOMP™ DX05477 compound is based on Polycarbonate (PC) resin containing 10% glass fiber. Added features of this grade include: Easy Molding, Mold Release, Flame Retardant.

LNP™ THERMOCOMP™ Compound LF008EX1 banner

LNP™ THERMOCOMP™ Compound LF008EX1

Polymer Name:Polyetheretherketone (PEEK)
Processing Methods:Injection Molding
Fillers Included:Glass Fiber
Flexural Modulus:12700.0 - 12700.0 MPa

SABIC's Specialties Business LNP™ THERMOCOMP™ LF008EX1 compound is based on Polyetheretherketone (PEEK) resin containing 40% glass fiber. Added features of this grade include: High Modulus and Strength, Easy Molding and Low Warpage.

LNP™ THERMOCOMP™ Compound MFB82I banner

LNP™ THERMOCOMP™ Compound MFB82I

Polymer Name:Polypropylene (unspecified)
Processing Methods:Injection Molding
Fillers Included:Glass Bead, Glass Fiber

SABIC's Specialties Business LNP THERMOCOMP MFB82I compound is based on Polypropylene (PP) resin containing 10% glass fiber, 40% glass bead. Added features of this grade include: Improved Impact. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

LNP™ THERMOCOMP™ Compound LX04015 banner

LNP™ THERMOCOMP™ Compound LX04015

Polymer Name:Polyetheretherketone (PEEK)
Processing Methods:Injection Molding
Fillers Included:Carbon Fiber
Additives Included:Mold Release Agent
Flexural Modulus:11100.0 - 11100.0 MPa

LNP THERMOCOMP LX04015 compound is based on Polyetheretherketone (PEEK) resin containing 15% carbon fiber. Added features of this grade include: Electrically Conductive, Easy Molding.

LNP™ THERMOCOMP™ Compound HF006EU banner

LNP™ THERMOCOMP™ Compound HF006EU

Polymer Name:Polyamide 11 (PA 11)
Processing Methods:Injection Molding
Fillers Included:Glass Fiber
Additives Included:UV Stabilizer, Mold Release Agent, Heat Stabilizer
Flexural Modulus:5600.0 - 5600.0 MPa

LNP THERMOCOMP HF006EU compound is based on Nylon 11 resin containing 30% glass fiber. Added features of this grade include: Easy Molding, UV-Stabilized.

LNP™ THERMOCOMP™ Compound AX02749 banner

LNP™ THERMOCOMP™ Compound AX02749

Polymer Name:Acrylonitrile Butadiene Styrene (ABS)
Fillers Included:Glass Fiber
Processing Methods:Injection Molding

LNP THERMOCOMP AX02749 compound is based on Acrylonitrile Butadiene Styrene (ABS) resin containing 20% glass fiber.

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