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Valtron® AD1846A-AD1851B Epoxy System

1 of 48 products in this brand

Valtron® AD1846A-AD1851B Epoxy System is a temporary adhesive system for mounting monocrystalline and multicrystalline ingots for the photovoltaic and LED wafer slicing process. It has good water resistance. Applicable for diamond wire saw with selected debonding solutions.

Product Type: 2K (2 component) Adhesive

Application Area: LEDs, Photovolatics

Chemical Family: Epoxy & Epoxy Derivatives

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Identification & Functionality

Features & Benefits

Applications & Uses

Application Area
Applications
  • Water-based slurry / coolant applications

Properties

Component A
ValueUnitsTest Method / Conditions
Viscosity (25°C)80000cps-
Specific Gravity1.3--
Mixing Ratio (By Weight)2--
Component B
ValueUnitsTest Method / Conditions
Viscosity (25°C)30000cps-
Specific Gravity1.2--
Mixing Ratio (By Weight)1--
Mixed System Properties
ValueUnitsTest Method / Conditions
Gel Time¹20minutes-
Cure Time²min. 4hrs-
Working Time⁴10minutes-
Hardness82Shore D-
Bond Strength⁵ (4 hrs)min. 1,000psi-
Bond Strength⁵ (8 hrs)min. 1,500psi-
Glass Transition Temperature³45°C-
Slurry CompatibilityPEG/Water--
Slurry CompatibilityDEG/Water--
Slurry CompatibilityAqueous--
Note

¹Gel Time condition 100 g @ 77ºF (25ºC). Setup time, solidification time.
²Cure Time conditions @ 77ºF (25ºC) Time needed prior to ingot slicing, recommended as starting point.
³Glass Transition Temperature using DSC Method
⁴Working Time, 50g @ 77ºF (25ºC), recommended maximum time.
⁵Typical minimum value only applicable to Valtech test method, not as specification, not to compare to other test methods.

Technical Details & Test Data

Demounting
Epoxy System Debonding Solution Temperature(°C) Time Required
AD1846-A
AD1851-B
Acetic Acid min. 30 max. 30
Citric Acid (>10% by wt.) min. 45 max. 30
VALTRON® DP164 (>12% by vol.) min. 45 max. 10