Valtron AD5038A-AD5038B Epoxy System

Identification & Functionality

Chemical Family: Epoxy & Epoxy Derivatives
Product Type: 2K (2 component) Adhesive
Technologies: Ready-to-Use Products
Product Families: Ready-to-Use Products — Adhesives & Sealants
Other Adhesives & Sealants

Features & Benefits

Ready-to-Use Product Features: Chipping Resistance,
Cleanable,
Consistent Performance,
Excellent Substrate Adhesion,
Fast Curing,
Good Bonding Strength,
Good Strength,
Low Viscosity,
Water Resistant

Applications & Uses

Markets: Electrical & Electronics,
Industrial
Applications: Electrical & Electronics — Devices & Assemblies
Displays
Industrial — Power, Water & Utilities
Renewable Energy
Application Area: LEDs,
Photovolatics
Application: Maintains bond strength after 24 hr. cure, resists wafer drop & chipping

Properties

Color: White,
Yellow
Component A
Component B
Mixed System Properties
Note: ¹Gel Time condition 100 g @ 77ºF (25ºC). Setup time, solidification time.
²Cure Time conditions @ 77ºF (25ºC) Time needed prior to ingot slicing, recommended as starting point.
³Glass Transition Temperature using DSC Method
⁴Working Time, 50g @ 77ºF (25ºC), recommended maximum time.
⁵Typical minimum value only applicable to Valtech test method, not as specification, not to compare to other test methods.

	Value	Units	Test Method / Conditions
Gel Time¹	12	minutes	-
Cure Time²	min. 4	hrs	-
Working Time⁴	min. 5	minutes	-
Hardness	82	Shore D	-
Bond Strength⁵ (4 hrs)	1000	psi	-
Bond Strength⁵ (8 hrs)	1800	psi	-
Glass Transition Temperature³	30	°C	-
Slurry Compatibility	PEG	-	-
Slurry Compatibility	PEG/Water	-	-
Slurry Compatibility	DEG/Water	-	-
Slurry Compatibility	Aqueous	-	-

Technical Details & Test Data

Demounting: Epoxy System Debonding Solution Temperature(°C) Time Required

AD5038-A
AD5038-B Acetic Acid min. 30 max. 30

Citric Acid (>10% by wt.) min. 50 max. 30

VALTRON® DP164 (>12% by vol.) min. 50 max. 30

Valtron® AD5038A-AD5038B Epoxy System