Products in Thermoset Resins: Resin

ALBIFLEX® 297 is a bisphenol-A-epoxy-silicone block copolymer resin that excels in crafting high-performance elastomers. This versatile liquid, responsive to epoxy, seamlessly cures when combined with aliphatic and cycloaliphatic epoxy resin curing agents. ALBIFLEX® 297 accommodates various conventional casting and molding techniques for your manufacturing needs.

jER™ 1750 is a very low viscosity Bisphenol F-type liquid epoxy resin. It can be used in sealants, casting agents and adhesives in electrical and electronic applications and fiber reinforced plastics, and for liquid underfill and adhesives for semiconductor manufacturing.FeaturesChemical, heat and water resistanceElectrical insulation*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX7110 is a tough and flexible liquid-type epoxy resin. It can be used as an impact modifier for brittle materials, as an additive to increase impact resistance, and for stress relaxation to avoid cracking and warpage. jER™ YX7110 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol. Features Adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol Crack and impact resistance Excellent flexibility and elasticity High viscosity Low warpage Maintains flexibility even after full-curing Applications Coatings Adhesives Composites Potting and encapsulation materials Base film/sheet for wearable devices *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX8040 is a hydrogenated bisphenol A-type solid epoxy resin, with high molecular weight. It can be used for optical materials such as LED encapsulants and adhesives for displays.FeaturesHigh purityTransparencyLED-curableUV-curable *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX4000 is a biphenol-type solid epoxy resin with significantly low melt viscosity, low water absorption and a good balance between adhesiveness and rigidity against stress. It can be used for electrical and electronic applications. jERTM YX4000 is an adduct formed from the reaction of epichlorohydrin and tetramethylbiphenol FeaturesAbrasion, heat and water resistanceElectrical insulationWear resistanceProduct HighlightsSignificantly low melt viscosity (melting point: 108°C)Low chroline contentLow water absorption ApplicationsElectrical and electronic applications (EMC, solder resist, PCB)Potting and encapsulation materialsPowder coatings for ship bottomsAdhesivesComposites *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ 4250 is a hybrid bisphenol A/bisphenol F-type epoxy resin that is more flexible than conventional polymer-type epoxy resins. It can be used as an additive to add toughness, insulating and vapor barrier properties and resistance to heat, water and chemicals to a variety of applications. FeaturesPolymer-type epoxy resin with epoxy functional groups at the both endsHigh molecular weightHigh softening points Good adhesionApplicationsPCM, CAN and other coatingsPaintThermoplastics Printed electronics Plastic processing *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX7105 is a liquid-type epoxy resin with toughness, flexibility, and high stretchability. It is used as an impact modifier for semiconductor, printed electronics and wearable devices to avoid bending and warpage. jER™ YX7105 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol.FeaturesExcellent adhesionGood toughnessGood mechanical, impact and crack resistanceExcellent elasticity and flexibilityApplicationsPrinted electronics (resist ink, build-up wire board, flexible printed wire board, metal core printed circuit board)Semiconductor manufacturing (liquid mold compound, underfill, sidefill, diebonding, ACF, NCF, ACP, NCP)Base film and sheet for wearable devicesCoatingsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX8000D is a hydrogenated bisphenol A-type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. It can be used for wide variety of optical adhesives and encapsulants.FeaturesExcellent adhesionFast cure timeLow chlorine contentExcellent transparencyLED-curableUV-curableApplicationsConsumer appliances and electronicsElectrical and electronic displaysElectronics adhesivesPotting compoundsSemiconductor manufacturingLEDs*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ 1256 is a solid epoxy resin produced from Bisphenol A epoxy resin. It is a polymer-type epoxy resin with epoxy functional group at the both ends. It can be used to add toughness, insulating and vapor barrier properties, and resistance to heat, water and chemicals in a variety of applications. FeaturesHigh molecular weightHigh softening pointsGood film formerHydrolysis resistanceFlexibilityStrong adhesionApplicationsPCM, CAN, and other coatingsPaintsFiber-reinforced materialsThermoplasticsPrinted electronicsPlastic processing *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YL980 is is a Bisphenol A-type liquid epoxy resin with very low chlorine content. It can be used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). Benefits Excellent adhesiveness Maintains high electrical reliability Features Chemical, heat and water resistant Electrical insulating properties Significantly low chlorine content (below 500 ppm) Applications Electrical and electronic applications Potting & encapsulation materials Adhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YL983U is a Bisphenol F-type liquid epoxy resin with very low chlorine content and low viscosity. It is used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). BenefitsExcellent adhesivenessGood elastic recovery FeaturesChemical, heat and water resistantElectrical insulating propertiesSignificantly low chlorine content (below 500 ppm)Low viscosityApplicationsElectrical and electronic applications Potting & encapsulation materialsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX7400N is an adduct formed from the reaction of epichlorohydrin and an aliphatic polyol.FeaturesAdduct formed from the reaction of epichlorohydrin and an aliphatic polyolExcellent elasticityImpact resistanceApplicationsConsumer appliances and electronicsElectrical devices, assemblies, parts and componentsElectronics adhesivesElectrical and electronic packaging and assemblySpecialty and conformal coatingsPotting compoundsPrinted circuit boards (PCBs)Semiconductor manufacturing*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

SABIC's Specialties Business LNP THERMOCOMP TF002 compound is based on Polyurethane (TPU) resin containing 10% glass fiber. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business LNP STAT-KON TX06488 compound is based on Polyurethane (TPU) resin containing conductive carbon powder. Added features of this grade include: Excellent Ductility, Electrically Conductive. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

MOCOM Compounds ALCOM® LDDC PMMA 1000UV18123 BK1016-11 is a translucent, UV stabilized Polymethylmethacrylate polymer used for Automotive, Lighting, and interior decoration/finishing, light transparent components, and Black Panel-Technology applications such as lamp covers, display elements, and operating elements. Pre-drying conditions involve 80°C in a dry air (dessiccant) dryer for 3-4 hours and 80°C in an air circulating dryer for 4-6 hours with a maximum moisture content of less than 0.02%. For processing injection molding, the melt temperature should be between 220-270°C and the mold temperature should be between 50-80°C. It should be protected from light.

MOCOM Compounds ALCOM® LDDC PMMA 1000 UV 18124 BK1074-11 is a polymethylmethacrylate base polymer with a UV stabilized filler/additive system suitable for applications such as lamp covers, display elements, operating elements, and light transparent components in automotive and lighting markets. Pre-drying conditions include 80°C in a dry air (dessiccant) dryer for 3-4 hours and 80°C in an air circulating dryer for 4-6 hours, with a maximum moisture content of <0.02%. For injection molding, melt temperature should be between 220-280°C and mold temperature should be between 50-80°C.

Farboset® 1160 is a granular, mineral-filled, anhydride epoxy molding compound designed for the encapsulation of various electrical and electronic components. It offers fast cure rates, long flow, and excellent thermal shock resistance. This compound is suitable for applications involving the encapsulation of coils, transformers, capacitors, diodes, relays, and other components that require good hot rigidity during the molding process.

DAP K61/6230 is a general-purpose diallyl iso-phthalate molding compound that contains long-glass fiber fillers. It is supplied in flake form, making it suitable for various molding applications. This compound can be preformed and easily molded using standard compression and transfer equipment. It offers good moldability and is designed to meet the requirements of general-purpose molding applications where a balance of mechanical strength and ease of processing is essential.

GAC Chemical Ammonium Sulfate Reagent/ACS Grade meets reagent/ACS grade specifications, is certified kosher, and boasts high purity. Available in granular form, it is part of their processing, purification, and testing solutions range, specifically within testing solutions for pharmaceuticals and nutraceuticals.

Farboset® 1115 is a granular, mineral-filled, anhydride epoxy molding compound with fast cure rates and excellent hot strength. It is specially designed for encapsulating various electrical and electronic components, including coils, transformers, bushings, switches, and more. The material offers good hot rigidity during the molding process and is commonly used in injection and transfer molding applications.

Cosmic Epoxy EH81 is an iron-filled epoxy molding compound available in a black granular form. It is specifically designed for EMI/RFI shielding applications and can be used in both compression and transfer molding processes to create core rods or encapsulate surface mount and axial leaded inductors. The advantage of this material is its ability to simplify the manufacturing process by eliminating the labor-intensive over/under molding steps.

Farboset® 1115AC is intended for use as a compound in thermoset molding. It is available in a solid form, presented as granules, with a granular appearance and a mild odor. This product is insoluble in water and does not exhibit reactivity under normal conditions, making it suitable for various thermoset molding applications and ensuring safety and reliability in its intended use.

DAP D69/6130 is a versatile diallyl ortho-phthalate molding compound with the advantage of being long-glass fiber filled. Supplied in flake form, this compound is convenient to work with. It can be easily molded using compression or transfer equipment and can be preformed for improved handling. Notably, it maintains its performance even when stored at room temperature for up to one year. This makes it a reliable choice for a wide range of applications where long-term performance and ease of use are essential.

Farboset® 2220 is a granular, mineral-filled, novolac epoxy molding compound known for its excellent moldability, fast cure rate, and strong physical and electrical properties. It is specially designed for high-performance applications that demand enhanced thermal characteristics. These applications include the encapsulation of bushings, insulators, and various electrical and electronic components. The compound's properties make it a reliable choice for protecting and ensuring the performance of critical components in challenging environments.

Cosmic Epoxy E484 is a mineral-filled, glass-reinforced, electrical-grade epoxy molding compound supplied in granular form. It boasts excellent mechanical strength and electrical properties, particularly at high temperatures, and has successfully passed NASA outgassing tests. This compound finds applications in electrical hardware, including underwater connectors and various insulation needs.

Esschem MMA - Styrene Bead Copolymers are a versatile range of copolymers combining methyl methacrylate (MMA) and styrene. These bead copolymers offer a wide array of properties and applications. With increased MMA content, the resulting materials exhibit remarkable strength and transparency. Conversely, a higher proportion of styrene enhances hydrophobicity, hardness, and impact resistance. The molecular weight plays a crucial role in determining the characteristics of the copolymers. Higher molecular weights, often associated with increased styrene content, yield stronger and more heat-resistant materials. Esschem's ability to manipulate the molecular weight distribution allows for customized properties such as durability, elasticity, and processing ease. Additionally, the particle size of the copolymers influences surface properties and rigidity.

Cosmic Epoxy E4920CD is designed for the thermoset molding of electronic encapsulation. It is available in a solid form, offered as granules, preforms, or powders, and is available in various colors. This product has a mild odor and is insoluble in water, making it well-suited for a wide range of electronic applications. Additionally, it does not exhibit reactivity under normal conditions, ensuring safety and reliability in its intended use.

Cosmic Epoxy E4920AT is designed for the thermoset molding of electronic encapsulation. It is available in a solid form, provided as granules, preforms, or powder, and comes in various colors. This product has a mild odor and is insoluble in water, making it well-suited for a wide range of electronic applications. Additionally, it does not exhibit reactivity under normal conditions, ensuring safety and reliability in its intended use.

Cosmic Epoxy C102 is a copper-filled molding compound available in a very fine granular form. It is suitable for various molding processes, including injection molding, compression molding, and transfer molding. This material is designed for fabricating parts that demand high strength and excellent electrical conductivity.

Cosmic Epoxy E484-FDA is a mineral-filled, glass-reinforced, electrical-grade epoxy molding compound supplied in granular form. It has received approval for direct food contact. Notably, it possesses outstanding mechanical strength and electrical properties, especially at high temperatures, and has met the rigorous NASA outgassing standards. This material is used in electrical hardware applications such as underwater connectors and other insulation needs.

Esschem MMA - IBOMA Bead Copolymers are a range of copolymers that combine methyl methacrylate (MMA) with isobornyl methacrylate (IBOMA).These bead copolymers offer exceptional strength and performance for a wide range of industries. With their high glass transition temperature, melting point, and tensile strength, they provide incredibly strong polymers that meet demanding application requirements.By controlling the molecular weight, Esschem ensures that the copolymer beads exhibit enhanced strength and rigidity. Furthermore, the performance characteristics, including adhesion, can be tailored by optimizing the particle size.

DAP D44/6160 is a mineral-filled, special-purpose diallyl ortho-phthalate molding compound supplied in a free-flowing granular form. It can be easily molded using compression, transfer, or injection equipment and can be readily preformed. It surpasses all mineral compounds available today in terms of mechanical and electrical properties. It boasts extremely low water absorption, high dielectric strength, and a low dissipation factor, along with high tensile strength, exceptional arc resistance, and excellent resistance to high temperatures.

Farboset® 2472V0 is a novolac epoxy molding compound that is mineral-filled for enhanced performance. It offers rapid cure rates, excellent moldability, and exceptional resistance to thermal shock and moisture. This compound has been specially formulated to provide improved resistance to moisture ingress, making it an ideal choice for applications where exposure to moisture is a concern. Additionally, it features a high glass transition temperature, ensuring optimum reliability in performance. Its combination of properties makes it well-suited for a range of applications where resilience to environmental conditions is crucial.

Esschem EMA - EHMA Bead Copolymers are a unique combination of ethyl methacrylate (EMA) and 2-ethylhexyl methacrylate (EHMA) that offers exceptional properties.The incorporation of 2-EHMA disrupts the polymer chain packing, resulting in lower glass transition temperatures and enhanced low-temperature flexibility, while significantly improving transparency.With variations in molecular weight, Esschem can further enhance the strength and flexibility of these bead copolymers. The smaller particle size of the beads improves processability and has the potential to enhance transparency, while larger particles contribute to a more rigid material.

Cosmic Epoxy CP7312 is a long-glass-reinforced epoxy molding compound supplied in flake form. It can be compression or transfer-moulded and offers high physical strength. This material has a shelf life of 12 months when stored at 20°C or lower. It is an excellent replacement option for a wide range of aircraft and heavy metal parts, making it a versatile choice for various applications.

DAP ID-50 is a general-purpose diallyl ortho-phthalate molding compound filled with Dacron. It is supplied in a granular form and can be easily molded using standard compression or transfer equipment. This type of compound is versatile and suitable for various molding applications.