Products in Adhesives & Sealants: Solvent free (100% Solids) Adhesive

WACKER® HA - Hybrid Adhesive is a high-strength, silicone-free all-purpose adhesive suitable for bonding or repairing many different substrates. It cures at room temperature in the presence of atmospheric moisture to form a permanent hard rubber. The adhesive is almost odorless, non-corrosive, and non-staining. It can be painted over and is weatherable, making it highly resistant to various media such as mineral oils, solvents, acids, and alkalis.

DEHESIVE® PSA 765 KR is a solvent-free, addition-curing silicone pressure-sensitive adhesive designed for low adhesion levels. It serves as a general-purpose adhesive, primarily intended for coating films but also suitable for other substrates. This product utilizes a thermal-curing system and achieves curing at a web temperature range of 100-200 °C.

CHT Group QSil 216 is a transparent and colorless silicone formulation that is ideal for optical applications. Its viscosity profile enables excellent flow around components, and it is excellent for potting complex parts. The chemical composition results in a cured product that is hydrolytically stable as well as reversion-resistant. The silicone elastomer provides electrical insulation and physical shock resistance for components and enables environmental protection.

CHT Group QSil 550LV A&C is a 100% silicone solids elastomer designed for electronic potting applications. This addition-cure potting elastomer is a two-component system that offers a hard, thermally conductive, low-modulus material that is readily repairable. It cures at room temperature.

CHT Group QSil 553 is a 2-component silicone elastomer system specially designed for electronic potting and encapsulation applications. It offers good protection against chemicals, environmental contamination, mechanical shock, vibration, and impact damage. It can be employed in areas where low flammability is a prerequisite. The cured elastomer can be repaired. The component parts have relatively low viscosities and are readily mixed, either by hand or machine.

CHT Group QSil 559 is a 100% silicone solid elastomer designed for electrical potting applications. This addition-cure potting material is a two-component system that has a long gel time. It offers a hard, thermally conductive, low-modulus material that is readily repairable.

CHT Group QSil 573 is a 100% silicone solid elastomer designed for electronic potting applications. This addition-cure potting elastomer is a two-component system that offers a hard, thermally conductive, low-modulus material that is readily repairable. This product has excellent thermal conductivity.

DEHESIVE® PSA 765 is a solvent-free, addition-curing silicone pressure-sensitive adhesive specifically designed for low adhesion levels. It is primarily intended for coating films but can also be used on other substrates. This product utilizes a thermal-curing system that achieves curing at a web temperature of 100-200 °C.

CHT Group SilSo Clear 21002 is a transparent and colorless silicone formulation that is ideal for optical injection molding applications. Its viscosity profile enables excellent flow around components, and it is excellent for potting complex parts. The chemical composition results in a cured product that is hydrolytically stable as well as reversion-resistant. The silicone elastomer provides electrical insulation and physical shock resistance for components and enables environmental protection.

ARCOR® 2213 Stick is a convenient, solvent-free, two-component epoxy paste packaged in an easy-to-use stick form, combining both the Activator and Base components. With a simple cut or twist, a desired amount can be easily extracted and kneaded using gloved fingers. This rapid-curing epoxy is particularly well-suited for emergency repairs, allowing for quick fixes when time is of the essence. ARCOR® 2213 exhibits corrosion resistance and is reinforced with steel for excellent wear resistance. It can be further modified to meet specific requirements as it can be sanded, drilled, tapped, filed, and machined. Furthermore, it is compatible with epoxy, urethane, or acrylic paints, offering versatility in the choice of final finishes. Choose ARCOR® 2213 Stick for its convenience, durability, and efficiency in handling emergency repairs with excellent wear resistance and a wide range of applicability. ARCOR Epoxy Technologies can tailor make or reformulate the product to suit customer needs. Please reach out if you need a custom formulated product!

ARCOR® 25551 Quick-Set is a solvent-free, two-component epoxy adhesive that is moisture insensitive. Designed for emergency repairs or bonding applications, it is suitable for use on metals, glass, concrete, or wood surfaces. With its quick-setting formula, ARCOR® 25551 Quick-Set sets in just 5 minutes and can be put into service within 1 hour, regardless of the ambient temperature. This adhesive exhibits good resistance to a wide variety of chemical environments and offers heat resistance up to 450ºF. Its easy-to-use 1:1 mix ratio simplifies the application process, and it can be applied overhead or vertically. For convenient use, ARCOR® 25551 Quick-Set is packaged in two tubes containing resin and hardener. To achieve optimal results, simply squeeze equal portions onto a nonporous surface and thoroughly mix them together. ARCOR Epoxy Technologies can tailor make or reformulate the product to suit customer needs. Please reach out if you need a custom formulated product!

127-31 is an extremely flexible one-component, syringe dispensable, 100% solids, thermally conductive, electrically insulating soft epoxy adhesive, encapsulant, and potting compound. This system features excellent thermal stability, chemical resistance and excellent high temperature properties. Unlike conventional thermally conductive epoxy adhesives, 127-31 features a low durometer and is highly flexible allowing it to absorb stress when bonding mismatched CTE substrates. 127-31 even displays some elastomeric properties. Applications include die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding.Features Elastomeric Flexible thermally conductive adhesive/potting compound

125-35C is a syringe dispensable, 100 % solids, thermally conductive, electrically insulating, precatalyzed, epoxy adhesive. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Unlike conventional thermally conductive epoxy adhesives, 125-35C is flexible and is able to absorb stress when bonding mismatched CTE substrates. Applications include die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding. This is an electrically insulating, thermally conductive version of 124-08C.Features Highly thermally conductive epoxy adhesive

125-31FPC is a syringe dispensable, 100 % solids, thermally conductive, electrically insulating, pre-catalyzed epoxy adhesive. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Unlike conventional thermally conductive epoxy adhesives, 125-31FPC is flexible and is able to absorb stress when bonding mismatched CTE substrates. Applications include die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding. 125-31FPC is a finer particle version of 125-31C.Features Highly thermally conductive epoxy adhesive B-Stageable Low temperature curing

122-39(SD) is a syringe dispensable, thermally conductive, electrically insulating, one component, 100% solids epoxy adhesive. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Applications include adhesion to gold plated substrates and tin/lead solder terminated components, die attach and thermal management operations, printed circuit board fabrication, advanced material composites, sealing and high performance coatings. 122-39(SD) is a thermally conductive version of 122- 38(SD).Features Ionically clean die attach adhesive

122-38(SD) is a single component, silver filled, syringe dispensable, 100% solid, electrically conductive, epoxy adhesive. 122-38(SD) provides for fine pitch resolution, when syringe dispensed, stencil printed, or screen-printed. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Applications include adhesives, die attachment, printed circuit board fabrication, advanced material composites, sealing and high performance coatings. 122-38(SD) provides excellent adhesion to gold plated substrates, as well as tin/lead solder terminated components.Features Ionically clean die attach adhesive

TerraMax 925 is an all-in-one, single step, advanced polymer floor adhesive. The high performance formula drastically reduces the installation time. It delivers superb bond & shear strength in an easy spread, easy clean-up product that requires no mixing or set up time. TerraMax 925 High Performance Wood Floor Adhesive contains no water or solvents and very low VOCs, so it’s easy on installers and the environment. This is the product of choice when the application demands the highest performance adhesive available.

ME 8630-SSC is a ultra-fast curing with extra fine silver filled for finer pitch application. It is a low stress, low temperature curable die-attach adhesive paste. This single component, silver filled paste is electrically and thermally conductive. It is highly thixotropic with outstanding compatibility for bonding different adherends. The relatively medium Tg and modulus made it suitable for bonding both smaller and relatively large devices. Wire-bonding at temperatures as high as 250°C is easily achievable. ME 8630-SSC has been designed to eliminate bleeding on both silver plated copper and alloy 42 leadframes.

XtraBond® 9550 is a high performance, permanently flexible, easy-to-use advanced polymer sealant. The product cures rapidly when exposed to atmospheric moisture to form a durable bond and can be applied in a wide range of temperature and weather conditions (-40°F to 140°F.) It is ideal for high performance applications that require accommodation for joint movement, such as fiber cement.

Chicago Glue & Machine HMM9932 is a high performance general purpose hot melt designed for increased mileage, improved run ability and good adhesion to a variety of paper and paperboard surfaces for case, carton and tray sealing packaging and paper converting applications.

ME8630-DA is an extra fine silver filled 100% solid low viscosity die-attach for finer pitch application. It is a low stress, low temperature curable die-attach adhesive paste. This single component, silver filled paste is electrically and thermally conductive. It is highly thixotropic with outstanding compatibility for bonding different adherends. The relatively medium Tg and modulus made it suitable for bonding both smaller and relatively large devices. ME8630-DA has been designed to eliminate bleeding on both silver plated copper and alloy 42 leadframes. It maintains more than 300 psi bond strength at 250°C for high temperature wire-bonding.

SL738 A / SL738 C is a solvent free two component polyurethane laminating adhesive.

ME 8418-SC is a rapid curing version of ME 8418-FP-LV. This silver filled paste is solvent free, electrically and thermally conductive. It is designed for automated, online die attach processing.

Chicago Glue & Machine HME0736 is a high performance general purpose hot melt designed for increased mileage, improved run-ability and good adhesion to a variety of paper and paperboard surfaces for case, carton and tray sealing packaging and paper converting applications.

SL740 A / SL740 C is a solvent free two component polyurethane laminating adhesive.

MEB650-DA is a low viscosity silver filled flexible epoxy paste. This low ionic silver-filled paste is reworkable, solvent free, and electrically and thermally conductive. It is ideal for automatic dispensing in die- attach application with fine definition. Absolutely solvent-free and diluent free composition with low ionic impurities for high reliability. It exhibits outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). This stress free adhesive shows consistent medium bond strength up to 250°C at 200 psi.

ME7635-RC is an thermally conductive insulating epoxy adhesive for die-attach applications. This thixotropic paste is solvent free. It is designed for automated, inline bonding processing ME7635-RC is low in ionic impurities (<60 ppm total) and meets all requirements for MIL-Std 883D 5011.4 specification for dielectric adhesive. Fast curing can be achieved from 80°C and higher temperatures.

ME8452-A is an accelerated version of ME8452 for snap-curing applications.This novel silver-filled paste is reworkable, solvent free, and electrically and thermally conductive. It exhibits outstanding flexibility for bonding materials having highly mismatched CTE'S (i.e., alumina to aluminum, silicon to copper). It can be readily reworked from 80°C to 100°C and is ideal for applications such as large area die attach and substrate attach because of its ability to bond materials with highly mismatched CTE.

ME8512 is designed for automated, inline processing. This single component, silver filled paste is solvent free, electrically and thermally conductive. It is highly thixotropic with minimal sag. ME8512 has been designed to eliminate bleeding on both silver plated copper and alloy 42 leadframes.

ME 8452 is a reworkable, solvent free, pure silver filled, electrically and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). It can be readily reworked from 80°C to 100°C. It is ideal for applications such as large area die attach and substrate attach because of its ability to bond materials with highly mismatched CTE.

ME7863 is a one part, quartz filled cyanate ester die attach adhesive. It was designed for solder-sealed ceramic packages. It can withstand temperatures up to 300°C without thermal degradation. ME7863 has processing characteristics required in high speed automation. Its unique chemistry results in very low moisture absorption, high adhesive strength and low CTE.

ME 8418 is designed for automated, inline processing. This single component, silver filled paste is solvent free, and electrically and thermally conductive. It is highly thixotropic with outstanding compatibility for bonding different adherends. The higher Tg and modulus made it more suitable for bonding smaller devices only. Wire- bonding at temperatures as high as 250°C is permissible. ME 8418 has been designed to eliminate bleeding on both silver plated copper and alloy 42 leadframes.

SL737 A / SL737 C is a solvent free two component polyurethane laminating adhesive.

ME 8155-M is a version of ME 8155 modified to provide extra flexibility while maintaining all electrical and bond strength. It is a reworkable, solvent fsilver-filledilled paste that is electrically and thermally conductive. It exhibits outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). This paste can be used for screen printing and it can be readily reworked at 80-100°C.