Products

Uvikote™ 7504Lm-Pmf is 100% solids, medium viscosity, one component, premixed frozen liquid, electrically insulating, transparent, urethane coating designed for the encapsulation and protection of electrical/electronic components mounted on printed circuit boards. This system provides an excellent combination of flexibility and low modulus for demanding applications where the management of thermomechanical stresses is required. Uvikote™ 7504Lm-Pmf coating will become tack free when exposed to the proper UV light radiation. The coating will fully post cure in both the exposed and shaded areas in 14 days at 25°C and 50% relative humidity. As an alternative, the post cure for the coating in both exposed and shaded areas may be accelerated with low to moderate heat.

Aptek® 2713-A/B is a two component, silver filled, electrically conductive soft paste adhesive. It is designed to bond many dissimilar substrates and dissipate device generated heat. Aptek® 2713-A/B is a 100% solids, solvent free system that will not form voids during cure or outgas after being fully cured.

Aptek® 2503R-A/B is an unfilled, two component, electrically insulating, transparent, flexible urethane coating system designed for the encapsulation and protection of electrical/electronic components mounted on printed circuit boards.

Aptek® 6500-Pmf is a one component, pre-mixed frozen, 100% solids, silver-filled epoxy adhesive specifically designed for microelectronic die attach applications.APTEK 6500-PMF High purity, low outgassing, electrically conductive adhesive.

Aptek® 2554 is a one component, white, semi-rigid, mineral-filled, silicone-based coating/paint designed for very high temperature space applications. A thin coating of Aptek® 2554 was developed to withstand long term exposures up to 500°C (932°F) without cracking or peeling with a good degree of adhesion and flexibility.

Aptek® 2512-A/B is an unfilled, two component, electrically insulating, transparent, flexible urethane coating system designed for the encapsulation and protection of electronic devices mounted on printed circuit boards. For coating applications that require toughness, this system provides a combination of excellent flexibility and optimum tensile strength/elongation characteristics. This product was specifically designed to be resistant to JP-10 jet fuel and meet the rigorous requirements of MIL-I-46058C.

Aptek® 2503-A/B High Solids High Solids is an unfilled, two component, electrically insulating, transparent, flexible urethane coating system designed for the encapsulation and protection of electronic devices mounted on printed circuit boards. For coating applications that require toughness, this system provides a combination of excellent flexibility and optimum tensile strength/elongation characteristics.

Uvikote™ 7503Lmauto-Pmf is a low viscosity, ready to spray, one component, premixed frozen liquid, electrically insulating, transparent, urethane coating designed for the encapsulation and protection of electrical/electronic components mounted on printed circuit boards. This system provides an excellent combination of flexibility and low modulus for demanding applications where the management of thermomechanical stresses is required.Uvikote™ 7503Lmauto-Pmf coating will become tack free when exposed to the proper UV light radiation. The coating will fully post cure in both the exposed and shaded areas in 14 days at 25°C and 50% relative humidity. As an alternative, the post cure for the coating in both exposed and shaded areas may be accelerated with low to moderate heat.

Aptek® 2717-A/B is a two component, black, low modulus, thixotropic, silicone adhesive displaying very low temperature flexibility and good physical strength properties. Aptek® 2717-A/B has been designed to fully cure at room temperature and can be accelerated with a brief low temperature cure. This 100% solids system has been manufactured with highly pure resins to minimize the occurrence of ionic contamination without outgassing during cure or service.

Aptek® 2313-Pmf is a one component, premixed-frozen, silver-filled, electrically conductive polymer paste adhesive. It is designed to bond many dissimilar substrates and dissipate device generated heat. Aptek® 2313-Pmf is a 100% solids, solvent free system that will not form voids during cure or outgas after being fully cured. Aptek® 2313-Pmf has excellent reversion resistance and physical stability when subjected to high heat and humidity environments. This system displays higher ionic purity than epoxy systems minimizing the possibility of corrosion on components and circuitry. Aptek® 2313-Pmf Premixed-frozen, snap-cure, electrically conductive, adhesive

Uvikote™ 7503Lm-Pmf is a low viscosity, one component, premixed frozen liquid, electrically insulating, transparent, urethane coating designed for the encapsulation and protection of electrical/electronic components mounted on printed circuit boards. This system provides an excellent combination of flexibility and low modulus for demanding applications where the management of thermomechanical stresses is required. Uvikote™ 7503Lm-Pmf coating will become tack free when exposed to the proper UV light radiation. The coating will fully post cure in both the exposed and shaded areas in 14 days at 25°C and 50% relative humidity. As an alternative, the post cure for the coating in both exposed and shaded areas may be accelerated with low to moderate heat.

Aptek® 2214-A/B is a carbon-filled, thixotropic, two component, electrically conductive, flexible urethane coating/adhesive designed to dissipate an electrostatic charge. This low-outgassing system provides a combination of high flexibility and good tensile strength/elongation characteristics. Aptek® 2214-A/B Space Grade, Low Modulus Urethane ESD Coating/Adhesive.

Aptek® 2312-Pmf is a one component, premixed-frozen, silver filled, electrically conductive soft paste adhesive. It is designed to bond many dissimilar substrates and dissipate device generated heat. Aptek® 2312-Pmf is a 100% solids, solvent free system that will not form voids during cure or outgas after being fully cured. Aptek® 2312-Pmf Premixed-frozen, electrically conductive, low modulus adhesive

Aptek® 2503-A/B is an unfilled, two component, electrically insulating, transparent, flexible urethane coating system designed for the encapsulation and protection of electronic devices mounted on printed circuit boards. For coating applications that require toughness, this system provides a combination of excellent flexibility and optimum tensile strength/elongation characteristics.

Uvikote™ 7503Lm-A/B is a low viscosity, two component, electrically insulating, transparent, urethane coating designed for the encapsulation and protection of electrical/electronic components mounted on printed circuit boards. This system provides an excellent combination of flexibility and low modulus for demanding applications where the management of thermomechanical stresses is required. Uvikote™ 7503Lm-A/B coating will become tack free when exposed to the proper UV light radiation. The coating will fully post cure in exposed and shaded areas will continue to post cure in 14 days at 25°C and 50% relative humidity. As an alternative, the post cure for the coating in both exposed and shaded areas may be accelerated with low to moderate heat.

Aptek® 6512-Pmf is a one component, 100% solids, silver-filled, electrically conductive epoxy adhesive specifically designed for the attachment of electronic components to printed circuit boards. Aptek® 6512-Pmf displays excellent adhesion to various metal, ceramic, and PC board substrates. Aptek® 6512-Pmf Electronic-grade, conductive adhesive.

Aptek® 2210-A/B is a two component, silver-filled, urethane adhesive designed for application where flexibility and electrical conductivity are required. Aptek® 2210-A/B is a 100% solids adhesive displaying excellent adhesion to plastic metal substrates.