Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Product Type
- Technologies
Features & Benefits
- Ready-to-Use Product Features
- Features
- Thermal Conductive And Electrical Insulating
- Epoxy Only
- High Adhesion,
- High Tg
- Long Shelf And Working Life
- Low Outgas
- Excellent Reliability Performances
- Robust For Solder
- Reflow Process
- Product Highlights
- ACW thermal conductive adhesives contain no metals and are electrically insulating. They are all-epoxy formulations with thixotropic character and a white appearance. The cured adhesives have high Tg and very low out-gas with thermal conductivities of up to 3+ W/m°K in 75 micron films and up to 1.5+ W/m°K in 500 micron films.
- The TCL adhesives are shipped cold (cold pack with NO DRY ICE) and stored at -40 to -20 °C. The have a 2+ day working life time at room temperature and can be cured by heat at temperatures as low as 90 °C. The TCR adhesives are shipped and stored at room temperature and are cured by heat at temperatures of 130-150 °C. The dual cure versions can be cured by light or heat, and heat is required for thick films.
Applications & Uses
- Applications
- Cure Method
- Instructions for Use
- Clean the substrates to remove contamination, dust, moisture, salt and/or oil
- Dispense adhesive on substrates
- Thermal cure: heat is used for cure of adhesive
- Before Use
The cold adhesive needs to reach RT (23-25°C) before use. The container needs to sit at RT, adding heat is not allowed. Room temperature equilibration time is dependent on container size, but a 10-30 gram syringe equilibration time is approximately 30-60 minutes. Condensed water on the container must be removed prior to use
- Uses
- Bonding integrated circuits and components in semiconductor packaging.
- Heat transfer and dissipation
- Bonding of opaque substrates
Properties
- Physical Properties
- Thermal Properties
- Typical Properties
- Cured Properties
- Uncured Properties
| Value | Units | Test Method / Conditions | |
| Elongation (25°C, 50% RH) | 3.0 | % | ASTM D638 |
| Tensile Strength (25°C, 50% RH) | 150.0 | Mpa | ASTM D638 |
| Young's Modulus (25°C, 50% RH) | 16000.0 | Mpa | ASTM D638 |
| Value | Units | Test Method / Conditions | |
| Coefficient of Thermal Expansion [Above Tg (x10⁻⁶)] | 60.0 | °C⁻¹ | ASTM E831 |
| Coefficient of Thermal Expansion [Below Tg (x10⁻⁶)] | 21.0 | °C⁻¹ | ASTM E831 |
| Thermal Conductivity (75μm film) | 2.8 | — | — |
| Thermal Conductivity (500μm film) | 1.2 | — | — |
| Value | Units | Test Method / Conditions | |
| Operating Temperature | -60 to 200 | °C | — |
| Particle Size | 7 - 30 | µm | — |
| Value | Units | Test Method / Conditions | |
| Glass Transition Temperature (DMA) | 183.0 | °C | — |
| Hardness | 85 - 90 | Shore D | — |
| Outgas (Weight, per MIL-STD 883/5011) | 0.11 | % | — |
| Outgas (Weight, per Telcordia GR-1221) | 0.08 | % | — |
| Shrinkage (Linear) | max. 0.3 | % | — |
| Volume Resistivity | min. 10¹³ | ohm-cm | — |
| Value | Units | Test Method / Conditions | |
| Apperance (Uncured Adhesive) | White Paste | — | — |
| Density | 1.3 | g/ml | — |
| Pot Life or Working Life (20 - 25°C) | 48.0 | hours | — |
| Shelf Life (-40 to -20°C) | 6.0 | months | — |
| Thixotropic Index (Shear Rate: 1/s over 10/s) | 3.5 | — | — |
| Viscosity (25 °C, Shear Rate 10/s) | 30,000 - 34,000 | cps | — |
Technical Details & Test Data
- UV Curing Conditions
Heat curing: the adhesive is cured with heat
- 90°C for 60 to 90 minutes or 100°C for 60 minutes or 110°C for 45 to 60 minutes
- The actual heat cure time is dependent on the heating time of the bonded components. The heat time of the components must be added to the total cure time of the adhesive for the process
- The effect of humidity is greater for very thin film, if the adhesive layer is <25 µm, then longer cure time might be needed
- To ensure good curing speed, the humidity should be <60% RH
- Epoxy adhesives have post cure properties. Adhesion strength testing should be conducted at least 24 hrs after part assembly.
Safety & Health
- Safety and Handling
The uncured adhesive can be cleaned from apparatus with isopropyl alcohol (IPA), methyl ethyl ketone (MEK), or commercial alcohol based cleaning solution. Avoid direct skin and eye contact. Use only in well ventilated areas. Use protective clothing, gloves and safety goggles.
Storage & Handling
- Shipment and Storage
- Shipment: adhesive is shipped in “cold pack with ice bricks”, no Dri ice
- Storage: After receipt, cold storage at -20°Cor -40°Cin the original container is required