Products

Aptek® 2713-A/B is a two component, silver filled, electrically conductive soft paste adhesive. It is designed to bond many dissimilar substrates and dissipate device generated heat. Aptek® 2713-A/B is a 100% solids, solvent free system that will not form voids during cure or outgas after being fully cured.

Aptek® 6500-Pmf is a one component, pre-mixed frozen, 100% solids, silver-filled epoxy adhesive specifically designed for microelectronic die attach applications.APTEK 6500-PMF High purity, low outgassing, electrically conductive adhesive.

Aptek® 2717-A/B is a two component, black, low modulus, thixotropic, silicone adhesive displaying very low temperature flexibility and good physical strength properties. Aptek® 2717-A/B has been designed to fully cure at room temperature and can be accelerated with a brief low temperature cure. This 100% solids system has been manufactured with highly pure resins to minimize the occurrence of ionic contamination without outgassing during cure or service.

Aptek® 2313-Pmf is a one component, premixed-frozen, silver-filled, electrically conductive polymer paste adhesive. It is designed to bond many dissimilar substrates and dissipate device generated heat. Aptek® 2313-Pmf is a 100% solids, solvent free system that will not form voids during cure or outgas after being fully cured. Aptek® 2313-Pmf has excellent reversion resistance and physical stability when subjected to high heat and humidity environments. This system displays higher ionic purity than epoxy systems minimizing the possibility of corrosion on components and circuitry. Aptek® 2313-Pmf Premixed-frozen, snap-cure, electrically conductive, adhesive

Aptek® 2214-A/B is a carbon-filled, thixotropic, two component, electrically conductive, flexible urethane coating/adhesive designed to dissipate an electrostatic charge. This low-outgassing system provides a combination of high flexibility and good tensile strength/elongation characteristics. Aptek® 2214-A/B Space Grade, Low Modulus Urethane ESD Coating/Adhesive.

Aptek® 2312-Pmf is a one component, premixed-frozen, silver filled, electrically conductive soft paste adhesive. It is designed to bond many dissimilar substrates and dissipate device generated heat. Aptek® 2312-Pmf is a 100% solids, solvent free system that will not form voids during cure or outgas after being fully cured. Aptek® 2312-Pmf Premixed-frozen, electrically conductive, low modulus adhesive

Aptek® 6512-Pmf is a one component, 100% solids, silver-filled, electrically conductive epoxy adhesive specifically designed for the attachment of electronic components to printed circuit boards. Aptek® 6512-Pmf displays excellent adhesion to various metal, ceramic, and PC board substrates. Aptek® 6512-Pmf Electronic-grade, conductive adhesive.

Aptek® 2210-A/B is a two component, silver-filled, urethane adhesive designed for application where flexibility and electrical conductivity are required. Aptek® 2210-A/B is a 100% solids adhesive displaying excellent adhesion to plastic metal substrates.