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Nexa3D xPBT

Nexa3D xPBT is the first-ever PBT powder commercially available for selective laser sintering. The material is the ideal solution for small series production via additive manufacturing in industrial applications such as automotive electronics.

Polymer Name: Polybutylene Terephthalate (PBT)

Processing Methods: 3D Printing, Selective Laser Sintering

End Uses: Automotive Electronics, Connectors, Electrical/Electronic Applications, Lighting Applications

Features: Dimensional Stability, Excellent Dielectric Properties, Good Printability, Low Moisture Absorption, Recyclable

    Knowde Enhanced TDS

    Identification & Functionality

    Technologies

    Features & Benefits

    Key Benefits
    • A well-known material that can be adopted quickly
    • Excellent dielectric properties
    • Extremely easy to print
    • Improved dimensional stability due to lower moisture uptake
    • PBT powder for selective laser sintering
    • Less waste due to >60% reuse rate
    • Recyclable: non-reusable material can be brought back to the powder bed process
    Product Highlights

    xPBT is the fi rst material from DSM’s powder platform,offering customers a widely-known material in the industrial sector which can now be considered for small series production of end use parts.

    As 3D printing evolves from prototyping to industrial manufacturing, customers need materials such as xPBT tomeet their stringent demands. Current solutions do not meet application requirements for industrial applications,such as automotive electronics or applications that need to perform under high temperatures. xPBT has the same dielectric properties as material used in injection molding processes, making it a material engineers are familiar with and prepared to use.

    Developed for a wide sinter window, the powderis extremely easy to print. Additionally, xPBT is environmentally friendly with a high reuse rate and is recyclable to the extent that the material can be brought back to the powder bed process.

    Applications & Uses

    Plastics & Elastomers Processing Methods
    Applications
    • Connectors
    • Automotive Electronics
    • Electrical
    • Lighting

    Properties

    Physical Form
    Mechanical Properties
    ValueUnitsTest Method / Conditions
    Tensile Modulus XY2600MPaISO 527-1/-2
    Tensile Modulus Z2600MPaISO 527-1/-2
    Tensile Stress at Break XY47MPaISO 527-1/-2
    Tensile Stress at Break Z30MPaISO 527-1/-2
    Strain at Break XY4%ISO 527-1/-2
    Strain at Break Z1.2%ISO 527-1/-2
    Thermal Properties
    ValueUnitsTest Method / Conditions
    Melting Temperature (10°C/min)225°CISO 11357-1/-3
    Temperature of Deflection Under Load (1.80 MPa)55°CISO 75-1/-2
    Temperature of Deflection Under Load (0.45 MPa)165°CISO 75-1/-2
    Typical Properties
    ValueUnitsTest Method / Conditions
    Water Absorption0.45%Sim. to ISO 62
    Humidity Absorption0.18%Sim. to ISO 62
    Density1300kg/mISO 1183