company tower banner
Yincae Advanced Materials Company Logo

Yincae® SMT 256B

1 of 22 products in this brand
Yincae® SMT 256B is designed to enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA and flip-chip.

Product Type: Encapsulant

Application Area: Ball Grid Array (BGA), Chip Scale Packaging (CSP), Circuit Substrates, Semiconductors

Cure Method: Heat Cure

Application Method: Dip Coating

    Knowde Enhanced TDS

    Identification & Functionality

    Product Type

    Features & Benefits

    Ready-to-Use Product Features
    Features
    • Black Color
    • Easy Storage

    Applications & Uses

    Application Method
    Cure Method
    Applying Method

    Dip

    Properties

    Color
    Typical Properties
    ValueUnitsTest Method / Conditions
    Reflow Peak Temperature230 - 260°C
    Viscosity5 - 20kcp
    Coefficient of Thermal Expansion65.0
    In-Line Curing Peak Temperature230 - 260°C