- Chemical Family:Epoxy & Epoxy Derivatives
- Ready to Use Product Type:Encapsulant
- Application Areas:Power Transformers, Semiconductors, Integrated Circuits, Electrical Components
EB-430-1HT is a highly versatile epoxy adhesive formulated for semiconductor industry. An easy to dispense liquid paste, it offers high heat transfer, low shrinkage and a coefficient of thermal expansion comparable to that of copper and aluminum. This adhesive is designed for protecting IC's in TAB, as well as glob-top encapsulant for COB placement. Other applications include fabricating heat sinks, bonding semiconductors and transistors to heat sinks and general-purpose bonding of electronic components.