Products

FCT NC676 is no-clean tin-lead solder paste with pin-testable flux residue. NC676 has excellent shelf and stencil life, and responds well to pauses in printing. It prints well through fine pitch and small area ratio apertures. NC676 shows excellent wetting, very low solder balling and graping, and has low voiding potential. It is also halide and halogen free and contains no intentionally added halogens (zero halogen).

FCT WS159 is a high activity water soluble tin-lead solder paste. WS159 shows consistent and repeatable printing, excellent wetting, very low solder balling and graping, and has very low voiding potential. WS159 flux residues are easy to clean using D.I. water. WS159 is also halide free.

FCT NC722 is a low melting no-clean lead-free solder paste with pin-testable flux residue formulated for use with tin-bismuth alloys. NC722 is an excellent choice for applications which require reflow temperatures below that of standard lead-free alloys. NC722 is also halide and halogen free (zero halogens).

FCT NL930PT is no-clean lead-free solder paste with pin-testable flux residue. NL930PT has excellent shelf and stencil life, and responds well to pauses in printing. It prints well through fine pitch and small area ratio apertures. NL930PT shows excellent wetting, very low solder balling and graping, and has low voiding potential. It is also halide and halogen free and contains no intentionally added halogens (zero halogen). High reliability solder joints can be achieved when NL930PT is coupled with SN100CV or LF-C2 solder alloys.

FCT AMP OnePT is redefining the voiding standard for PCB assembly. Combining industry low levels of voiding performance with excellent activity allows AMP OnePT to deliver an unmatched ability for assemblers to amplify their process window while achieving higher yields. AMP OnePT has been formulated to generate flux residues which are pin testable. When coupled with SN100CV or LF-C2 alloys, AMP OnePT provides a high reliability solution for harsh environments. AMP OnePT combined with TempSave B37 alloy (Nihon Superior) is an excellent low temperature solder paste. This lead-free alloy contains 37% Bismuth which eliminates the brittleness issues of standard Sn/Bi57/Ag1 and Sn/Bi58 alloys.

FCT WS889 is a high activity water-soluble lead-free solder paste. WS889 has excellent wetting, very low solder balling and graping, and low voiding potential. WS889 flux residues are easy to clean using warm D.I. water.

FCT WS890 is an excellent all-around water-soluble lead-free solder paste. WS890 has superior wetting, very low solder balling and graping. WS890 has been formulated for environmental stability giving long stencil life and excellent print characteristics. When coupled with SN100CV or LF-C2 alloys, WS890 provides a high reliability solution for harsh environments.

FCT NL932HF is a best in class no-clean lead-free solder paste. NL932HF has excellent shelf and stencil life, and responds well to pauses in printing. It prints well through fine pitch and small area ratio apertures. NL932HF shows excellent wetting, very low solder balling and graping, and has low voiding potential. It is also halide and halogen free and contains no intentionally added halogens (zero halogen). When coupled with SN100CV or LF-C2 alloys, NL932HF provides a high reliability solution for harsh environments.