- Polymer Name:Polycarbonate (PC)
- Processing Methods:Injection Molding
- Flexural Modulus:2950.0 - 2950.0 MPa
Nemcon™ H-series products are designed for use in high performance electronic assemblies where heat removal is critical to system performance. Nemcon™ H PC DP113/X5 is a thermally conductive, electrically insulating polycarbonate compound, combining good thermal conductivity with high HDT and good processability.