- Polymer Name:Polycarbonate Alloy (PC Alloy)
- Processing Methods:Injection Molding
- Density:1490.0 - 1490.0 kg/m³
- Flexural Modulus:7350.0 - 7350.0 MPa
Nemcon™ H-series products are designed for use in high performance electronic assemblies where heat removal is critical to system performance. Nemcon™ H ES DP110/X3 is a thermally conductive polycarbonate alloy, combining good thermal conductivity with improved HDT and processability relative to conventional polycarbonate compounds.