company tower banner
Ovation Polymers Company Logo

Nemcon™ H ES DP110/X3

1 of 28 products in this brand
Nemcon™ H-series products are designed for use in high performance electronic assemblies where heat removal is critical to system performance. Nemcon™ H ES DP110/X3 is a thermally conductive polycarbonate alloy, combining good thermal conductivity with improved HDT and processability relative to conventional polycarbonate compounds.

Polymer Name: Polycarbonate Alloy (PC Alloy)

Processing Methods: Injection Molding

Density: 1490.0 - 1490.0 kg/m³

Flexural Modulus: 7350.0 - 7350.0 MPa

    Knowde Enhanced TDS

    Identification & Functionality

    Chemical Family
    Plastics & Elastomers Functions
    Technologies

    Features & Benefits

    Applications & Uses

    Plastics & Elastomers Processing Methods

    Properties

    Physical Form
    Mechanical Properties
    ValueUnitsTest Method / Conditions
    Tensile Strength at Break47MPaASTM D 638
    Elongation at Break1.7%ASTM D 638
    Tensile Modulus3175MPaASTM D 638
    Flexural Modulus7350MPaASTM D 790
    Izod Impact notched (1/8 in)18.7J/mASTM D 256
    Physical Properties
    ValueUnitsTest Method / Conditions
    Density1490kg/m3ASTM D 792
    Thermal Properties
    ValueUnitsTest Method / Conditions
    Deflection Temperature Under Load (264 psi)113°CASTM D 648
    Electrical Properties
    ValueUnitsTest Method / Conditions
    Surface Resistivity8.00E+12ohmASTM D 257

    Packaging & Availability

    Country Availability
    Regional Availability
    • Canada
    • North America
    • USA