Knowde Enhanced TDS
Identification & Functionality
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
- Characteristics
ET 1608 is a thermally conductive epoxy adhesive for electronic applications. It is two components with 2:1 mixing ratio, and can be cured at room temperature or elevated temperature after mixing. It provides strong bonding to metals such as aluminum, copper, plastics, FR4 PCBs, ceramics, glass, etc, with excellent thermal conductivity. The cured material also has very low CTE that can provide better thermal cycle performances. ET 1608 is dispensable.
- Special Features & Benefits
- Room temperature curable
- High thermal conductivity
- High temperature stability
- Low CTE for stress compliance
- Low bleeding, low volatile
- Low ionic content
Applications & Uses
- Applications
- Application Area
- Cure Method
- Typical Applications
- Aerospace electronics
- Automotive electronics
- Semiconductor and Telecommunications
- Bonding while dissipating heat
- Bonding of power devices to heat sinks
- Thermally conductive structural bonding
- Thermally conductive vibration
- Processing Instruction
- Important! Only components A and B with the same lot number may be processed together! For the package in a container (not in a cartridge), to ensure homogeneity of the material, the components must be stirred thoroughly before they are removed or processed in order to uniformly disperse any fillers that might have settled during storage. For long-term storage, it is recommended to store the material in –40°C freezer to prevent filler from settling.
- We recommend running preliminary tests to optimize conditions for the particular application. Comprehensive processing instructions can be obtained by contacting directly to United Adhesives, Inc.
Properties
- Color
- Typical Properties
- Typical Cured Properties
| Value | Units | Test Method / Conditions | |
| Density (As Mixed) | 2.6 | Gram /cc | ASTM D792 |
| Mixing Ratio (A :B) | 2:1 | By weight | — |
| Viscosity (As Mixed At 25°) | 50 to 130 | Pa.s | ASTM D2196 |
| Value | Units | Test Method / Conditions | |
| Adhesion (Avai Lap Shear) | min. 900 | Psi | ASTM D1002 |
| Coefficient Of Thermal Expansion (Greater Tha Tg) | 120.0 | ppm/°C | IPC-TM-650 |
| Coefficient Of Thermal Expansion (Less Than Tg) | 28.0 | ppm/°C | IPC-TM-650 |
| Cure Time (125°C) | 10.0 | Min | DSC |
| Cure Time (25°C) | 3 - 5 | hr | DSC |
| Cure Time (80°C) | 30.0 | Min | DSC |
| Dielectric Strength | min. 400 | Volt/mil Ac | ASTM D149 |
| Heat Capacity (25°C) | 1.0 | J/g-K | ASTM D1269 |
| Pot / Work Life (25°C) | 30.0 | Min | Viscosity double |
| Temperature Usage | -80 to 200 | °C | TGA |
| Glass Transmission | 55 - 75 | °C | DMA |
| Thermal Conductivity | 1.7 | W/m-K | ASTM D5470 |
| Volume Resistivity | min. 10E+10 | Ohm-cm | ASTM D257 |
| Young's Modulus | 5.5 | GPa | DMA |
Safety & Health
- Safety
General hygiene regulations should be observed.
Storage & Handling
- Storage
ET 1608 has a shelf life of at least 6 months when stored below 25°C in the originally sealed container. The 'Best use before end' date of each batch appears on the product label. Storage beyond the date specified on the label does not necessarily mean that the product is no longer usable. In this case however, the properties required for the intended use must be checked for quality assurance reasons.