- Ready to Use Product Type:Potting Compound, 1K (1 component) Adhesive, Epoxy Adhesive
- Application Areas:Semiconductors, Semiconductor Die Attach, Telecommunications Applications, Aerospace Applications, Heat Sink
- Compatible Substrates & Surfaces:Aluminum, Metal, Silicon, Stainless Steel, Copper, Ceramic
- Cure Method:Heat Cure
United Adhesives EP1641 is a low coefficient of thermal expansion epoxy adhesive.