Products

Acculam™ Epoxyglas HT-ESD comprised of an epoxy resin binder and a woven glass substrate. Surface properties are Electro Static Dissipative on 1 or 2 sides.Static dissipative properties are embedded in surface layer(s) making this ideally suited as test fixture material for printed circuit boards. Examples: Solder pallets, Assembly fixtures, Automated test equipment, ATE fixtures, and Electronic assembly workstation surfaces.

45NK is a woven Kevlar® aramid fiber reinforced multifunctional epoxy laminate and prepreg systemengineered to provide in-plane CTE values as low as 6 ppm/°C for compatibility with leadless alumina ceramic chip carriers (LCCC's) and other low expansion SMT devices where control of laminate expansion is critical for solder joint reliability. 45NK exceeds the requirements of IPC 4101/50 (Type AFG).

Acculam™ Epoxyglas G10/FR4 is a laminate sheet comprised of a flame retardant epoxy resin and a woven fiberglass substrate. This grade qualifies to NEMA FR4 and MIL-I-24768/27.This material has high mechanical strength and excellent electrical insulating qualities in both dry and humid conditions. These attributes along with good fabricating characteristics allow this grade to be used in a wide variety of electrical and mechanical applications.

Acculam™ Epoxyglas G11 nonFR comprised of heat resistant/halogen free epoxy resin and a woven fiberglass substrate. It qualifies to NEMA G11 and MIL-I-24768/3This material exhibits extremely high mechanical strength at elevated temperatures and has good dielectric loss and electric strength properties under both dry and humid conditions. It is resistant to flow, dimensional change, chemicals and has low moisture absorption.

Acculam™ Epoxyglas G11/FR5 comprised of flame retardant/heat resistant epoxy resin and a woven fiberglass substrate. It qualifies to NEMA FR5 and MIL-I-24678/28.This material exhibits extremely high mechanical strength at elevated temperatures. It shows good dielectric loss and electric strength properties under both dry and humid conditions. It has good chemical resistance and low moisture absorption.

55NT is an epoxy laminate and prepreg system, reinforced with a non-woven aramid substrate. This system combines compatibility with lead-free processing, using a hightemperature epoxy resin, with the low in-plane (x,y) expansion and outstanding dimensional stability of non-woven aramid reinforcement.

Acculam™ Epoxyglas G10 nonFR comprised of a halogen free epoxy resin binder and a woven fiberglass substrate. It qualifies to NEMA G10 and MIL-I-24768/2.This material exhibits high mechanical strength and electrical insulating qualities under both dry and humid conditions. Its ease of fabrication allows its use in many structural and cryogenic applications where halogenated compounds may be undesirable.

55LM is an epoxy laminate and prepreg system, reinforced with non-woven aramid fiber, with substantially lower moisture absorption compared with conventional epoxy/aramid products, even in high-humidity environments.

Acculam™ Siliglas G7 comprised of a high performance silicone resin and a woven fiberglass substrate. It qualifies to NEMA G-7 and MIL-I-24768/17.This material has high heat resistance, low dissipation factor, and excellent arc resistance. It is flame resistant with low smoke evolution, and meets the needs of Class "H" insulation. It is used in high frequency telecom equipment, transformers and items subjected to high heat.

Acculam™ Epoxyglas Cowskin comprised of an epoxy resin binder, woven glass substrate and tough outer skins for improved surface wear resistance.This material has high mechanical strength in both dry and wet conditions. It is engineered as a carrier material in the polishing of hard disk drives and silicone chips. Its tough outer skins protect against exposing abrasive glass fibers and extend normal carrier life by more than five times.