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AI Technology CB 8080

Product Type: Hot Melt Adhesive

Cure Method: Heat Cure

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Knowde Enhanced TDS

Identification & Functionality

Product Type

Features & Benefits

Ready-to-Use Product Features

Applications & Uses

Cure Method

Properties

Physical Form
Typical Properties
ValueUnitsTest Method / Conditions
Electrical Resistivitymax. 4x10⁻⁴Ω-cm
Thermal Conductivity8W/m-°C
Die Shear Strengthmin. 400psi
Glass Transition Temperature-55°C
Reflow Temperaturemin. 80°C

Regulatory & Compliance

Certifications & Compliance