Products

APPLI-TEC 5336 Epoxy is a black, electrically isolating, thermally conductive epoxy designed specifically for staking and encapsulating electronics on circuit boards as well as potting and encapsulating power supplies, transformers, and coils. This material is ideal for applications requiring a thermally conductive epoxy with resistance to solvents and chemicals. 5336 is supplied in frozen syringes.

APPLI-TEC 0543 Polysulfide is a one‐component, gray, thermally conductive, precision mixed, degassed, and frozen polysulfide adhesive. A fuel resistant material that is flexible when cured, 0543 is compliant with HMS 16‐1985, Compound II, Class 2, Grade 1. 0543 can be cured at either room or elevated temperatures. This material is thixotropic when applied and features a very low glass transition temperature as well as having a thermal conductivity of 0.7 (W/mK). It has a long pot life of 2 hours and is an ideal filet material. Along with fuels, 0543 is resistant to lubricants, oils, water, and weather and adheres well to most metals.

APPLI-TEC 5200 Epoxy is a silver-filled, electrically conductive, low outgassing epoxy, Appli-Tec’s 5200 is specifically designed to cure with low shrinkage at room temperature or cure quickly at elevated temperatures. The material is ideal for applications such as electrical bonding, EMI shielding, and room temperature soldering. 5200 exhibits a high thermal conductivity of 2.5 W/mK and a low volume resistivity of 0.002 ohm-cm, delivering excellent thermal and electrical conductivity across the bond line. Appli-Tec 5200 silver epoxy is available in bulk kits or two-part mixer pouches that can be stored at room temperature and mixed on site. We can also pre-mix, test, pre-pack and then flash freeze the material in manual or pneumatic dispense syringes, which are easily thawed at room temperature. The material is listed on NASA’s Low Outgassing website.

APPLI-TEC 6207 UV Acrylate is a gray, one‐component, UV/heat dual cure, precision mixed, degassed, and frozen acrylate adhesive that bonds well to most substrates (metals, ceramic, glass, and most plastics). It has the capabilities of both a deep UV cure and full shadow cure with heat and is ideal for fiber optic applications. It is a free‐flowing material with a long work life, able to be dispensed up to 24 hours after thaw. 6207 can be tacked with UV, removed from the fixture, and post cured with heat later in the assembly process. It offers a low coefficient of thermal expansion to minimize part movement during thermal cycling.

APPLI-TEC 0709 Urethane is a dark gray, thermally conductive, precision mixed, degassed, and frozen polyurethane adhesive compound for advanced electronic assembly. 0709 (Hacthane 121 B‐1) is HMS‐2353, Type IV certified. This thixotropic compound is suitable for electronic bonding, staking, and may be used as a filet as well. 0709 has a thermal conductivity of 0.9 W/mK, ideal for heat dissipation of components. 0709 cures to a tough and flexible material with low modulus and a very low Glass Transition Temperature (Tg). The cured material’s ability to not crack or harm bonded rigid components during thermal cycling provides a major advantage, as it will not compromise the integrity of the component. The CTE of 0709 is lower than conventional polyurethane elastomers, while retaining relatively low modulus. 0709 provides thermal conductivity and strain relief for many staking applications.

5302 Epoxy was designed specifically for potting circuit board connectors. With its 4-hour pot life, the material is ideal for automated dispensing and features controlled flow – making it easy to deposit. 5302 meets NASA’s outgassing requirements and has a wide range of curing options. The material bonds well with most substrates.

APPLI-TEC 5308 Epoxy is an electrically isolating material, 5308 was designed specifically for underfilling, staking and encapsulating electronics on circuit boards, as well as potting and encapsulating power supplies, transformers, and coils. Featuring a 3-hour pot life, 5308 has good flowability, making it ideal for applications requiring a self-leveling material. The material meets NASA’s outgassing requirements, is resistant to solvents and chemicals, and is considered non-hazardous per D.O.T. regulations.

APPLI-TEC 7300 Urethane is ideal for aerospace applications as it meets NASA’s outgassing requirements. The cured material’s ability to not crack or harm bonded rigid components during thermal cycling is a major plus. Appli-Thane® 7300 is also used in manufacturing and automated dispensing applications due to its 4-hour pot life. Provides best-in-class thermal conductivity for applications requiring aggressive heat dissipation of components.

APPLI-TEC 0121 Epoxy is a one-component, silver-filled, electrically conductive, precision mixed, degassed, and frozen epoxy. It has a long work life, high electrical and thermal conductivity (2.2 W/mK), and a volume resistivity of 6.0E -4 (ohm-cm). These features make it ideal for microelectronic, optoelectronic, and thermal management applications. This material has a long pot life, which maintains its dispensability for 2 days, making it suitable for automated dispensing; it can also be cured quickly at elevated temperatures. 0121 also has a high thixotropic index of 3.7. User-friendly packaging allowing for easy dispensing.

APPLI-TEC 0720 Polysulfide is a one‐component, gray, thermally conductive, precision mixed, degassed, and frozen polysulfide adhesive. It is fuel resistant material that is flexible when cured and is compliant with HMS 16‐1985, Compound V, Class 3 and HP 16‐103, Type VII, Class 3 specifications. 0720 can be cured at either room or elevated temperatures followed by a room temperature cure. This material is thixotropic when applied and features a very low glass transition temperature as well as having a thermal conductivity of 0.8 (W/mK). It has a long pot life of 2 hours and is an ideal filet material. Along with fuels, 0720 is resistant to lubricants, oils, water, and weather and bonds well to most substrates including aluminum, magnesium, titanium, and steel.