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"Epoxyset is a leading formulator and manufacturer of advanced epoxy, urethane, UV curable, and silicone systems. Since 1997, we have focused on meeting demanding applications through continued innovation and ultimately providing customers with quality products. Our adhesives, potting compounds, coatings, and thermal greases are used extensively in the electronics, medical, and optical industries. We have a complete line of product offerings specially designed for a variety of applications however custom formulations is our specialty. Our experienced chemists work towards a solution in a timely manner and work iteratively with the customer to deliver a high-performance product. 

As an ISO 9001:2015 certified company, we relentlessly endeavor to create a safe and efficient workplace and produce the highest quality products. Our commitment to quality and innovation is at the forefront of our company and leads us into a dynamic world of manufacturing."

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EPOXICAST

EPOXIBOND optical adhesives are low viscosity, optically clear adhesives. Each product has been engineered for use in a variety of industries including fiber-optic, medical, and electronics industries. Epoxyset medical adhesives are designed for use in medical devices such as MRI devices, endoscopes, catheters, ultrasound probes etc. In addition to the products below, we custom manufacture adhesives for use in the medical device industry.


EPOXIBOND

SILCAST

The FLASHBOND™ brand is Epoxyset’s cationic UV/LED cure epoxy adhesives which offer the benefits of traditional UV/LED cure products as well as the chemical strength and high Tg standard epoxy systems offer. Epoxy UV cure adhesives do not succumb to oxygen inhibition and will not stay tacky once fully cured.


FLASHBOND

URACAST

SetWORX™ is a group of one and two component epoxy and urethane adhesives designed to provide the highest performance in bond strength and durability. Innovative SetWORX™ adhesives were developed with an eye on the future with many free of BPA (Bisphenol A) and tin. SetWORX™ is ready for the next generation of adhesive challenges. Available in easy to use “side by side” cartridges and syringes as well as standard bulk packaging.


SetWORX

FLASHBOND™ UV-6502CL is a low viscosity, high clarity, light curing epoxy adhesive that offers excellent strength wetting properties. UV-6502CL cures to a clear polymer and maintains clarity at elevated temperatures. This product requires direct light exposure during cure. Because of the variability of different UV/LED light sources, it is suggested that the user test and specify intensity and exposure time. This product will cures best in the UVA wavelengths (315-365nm).

FLASHBOND™ UV-3610

EC-1012MFR-HT is a pourable, self-extinguishing, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations.

EpoxySet Inc. EC-1012MFR-HT

EB-316TC-2 is a two component, thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors. It may be used as an adhesive, potting, or encapsulation material, for industries such as consumer, medical or optics.

EPOXIBOND™ EB-316TC-2

EB-126HT is two components, clear epoxy system. This long work life, low viscosity resin system is designed for the bonding, coating, sealing, and impregnation of electrical and structural components. The cured system has excellent electrical and physical properties above 250°C with outstanding high temperature stability. It also provides excellent moisture, chemical, and corrosion resistance as well as resistance to thermal and mechanical shock.

EpoxySet Inc. EB-126HT

UXP-052107-1 is a filled, two-part urethane resin system, which combines good handling characteristics with excellent cured properties. Its low viscosity allows good flowability and air release.

URACAST™ UXP-052107-1

EB-316TM is a thixotropic version of EB-316M, a high strength, semi-rigid epoxy adhesive. This tough adhesive has an excellent combination of shear and peel strength. It has also excellent impact and vibration resistance and low temperature flexibility. This high-performance medical grade epoxy adhesive passes 500 thermal cycles from - 50°C to 150°C. EB-316M is excellent for cryogenic temperature applications.

EPOXIBOND™ EB-316TM

EB-142HT-1 is unfilled, low viscosity, high temperature resistant epoxy adhesive. It maintains high lap shear strength up to 210°C and has excellent thermal and chemical resistance. It can be used for bonding, coating, and sealing applications where a thin film with high insulating resistance is required, particularly at elevated temperatures. It is recommended for bonding metals, glass, and ceramic substrates.

EPOXIBOND™ 142HT-1

EPOXICAST-1006/EH-24 is a low viscosity, easily pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations. The cured system provides excellent resistance to moisture, most organic solvents and inorganic chemicals.

EPOXICAST™ EC-1006

UC-2521 is a filled, two-part urethane resin system, which combines good handling characteristics with excellent cured properties. Its low viscosity allows good flowability and air release. The cured elastomer has excellent water resistance and is exceptionally resistant to thermal shock.

URACAST™ UC-2521

EpoxySet Inc.

"Epoxyset is a leading formulator and manufacturer of advanced epoxy, urethane, UV curable, and silicone systems. Since 1997, we have focused on meeting demanding applications through continued innova

EpoxySet - CASE - Urethane - UV Curable - Silicone - Knowde

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STG-41 is a non-reactive, Silicone, Thermally Conductive Grease with a high thermal conductivity and low thermal resistance with a soft, non-flowable consistency. This product is formulated with specialty binding agents to achieve lowest amount of bleed and evaporations. It is designed for applications where a silicone thermal interface material is required and where the device may later need to be easily removed from the heat sink. This compound is ideally suited for use in thin cross-sectional thicknesses down to ≤ 1 mil.

EpoxySet Inc. STG-41

TG-69 compound grease-like NON-SILICONE, NON- FLOWABLE material heavily filled with heat-conductive metal oxides. These combinations provide high thermal conductivity, low bleed and high temperature stability. TG-69 has been engineered to solve the problems of contamination and migration associated with silicone-based products. Unique polysynthetic-based thermal grease used to insure quick, efficient heat transfer and dissipation for the full operational life of your hardware.

EpoxySet Inc. TG-69

FLASHBOND™ UV-5402 is a low viscosity, flexible, light curing epoxy adhesive that offers excellent strenth and flexibility for reduced cracking. UV-5402 is low viscosity and high elongation. This product requires direct light exposure during cure. Because of the variability of different UV/LED light sources, it is suggested that the user test and specify intensity and exposure time. This product will cure in the presence of visible light (400-415nm) and can also cure down to 365nm.

EPOXIBOND™ EB-153

EC-1106 is an electronic grade Optically Clear Epoxy, Encapsulating and Potting Compound. This heat curing system has very low viscosity and long work life.

EpoxySet Inc. EC-1106

SetWORX™ 1510 is a fast setting, toughened epoxy adhesive designed for industrial grade applications. This epoxy system has 1:1 mixing ratio by volume &amp; cure fast at room temperature. When cured it is resistant to a wide range of chemicals and solvents, and acts as an excellent electrical insulator. The cured adhesive exhibits high impact resistance and exceptional bond strength. It can be used for bonding glass, metals, woods and some plastics.

FLASHBOND™ UV-5608DC

HTG-71 is a high temperature resistance thermal grease,, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 300°C, maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.

EpoxySet Inc. HTG-71

UV-8509R is a non-sag, fast curing, urethane acrylate that bonds well to engineered plastics and metal based substrates. This product requires direct UV exposure during cure. Because of the variability of different UV light sources it is suggested that the user test and specify UV intensity and exposure time. This material is specially formulated to have reduced surface tack due to oxygen inhibition.

EpoxySet Inc. UV-8509R

EC-1190 is an epoxy encapsulating system with a very low density for use in the aerospace and medical industries. EC-1190 is low viscosity and can cure at room temperature when used with catalyst EH-21. EC-1190 has excellent chemical resistance and a low coefficient of thermal expansion (CTE).

EPOXICAST™ EC-1190

SETWORX™ UV-35G is an epoxy adhesive and encapsulating compound designed for electronic, optical, medical, and general industrial applications Once mixed, UV-35G will polymerize and gel instantaneously upon exposure to UV light reducing fixture time to seconds. Once gelled, UV-35G will continue to cure at room temperature or at elevated temperature until fully cured. This epoxy system has 2 to 1 mixing ratio by volume and is available in easy to us dual cartridge systems.

SetWORX™ U-47MP

EPOXIBOND™ EB-116 is high strength, structural epoxy adhesive. This tough adhesive has an excellent combination of shear and peel strength. It has also excellent impact and vibration resistance and low temperature flexibility. This high-performance epoxy adhesive exhibits very good physical, thermal, and electrical insulation properties and is excellent for cryogenic applications. It is recommended for bonding glass, metal, ceramics, and engineering thermoplastics. Due to its low viscosity, it can be also used for potting and encapsulating electrical/electronic coponents

EPOXIBOND™ EB-119SP

STG-40 is a non-reactive, Silicone, Thermally Conductive Grease with a high thermal conductivity and low thermal resistance with a soft, non-flowable consistency. This product is formulated with specialty binding agents to achieve lowest amount of bleed and evaporations. It is designed for applications where a silicone thermal interface material is required and where the device may later need to be easily removed from the heat sink. This compound is ideally suited for use in thin cross-sectional thicknesses down to ≤1 mil.

EpoxySet Inc. STG-40

EPOXIBOND™ EB-107LP-1 is a two component, room temperature curing epoxy featuring very low viscosity, and excellent optical-mechanical properties.

EPOXIBOND™ EB-116

FLASHBOND™ UV-8504E is a low viscosity, fast curing, light-curing epoxy adhesive that offers excellent strength wetting properties. UV-8504E cures to a high Tg, rigid polymer with excellent adhesive to metals, ceramics, and glass.This product requires direct light exposure during cure. UV-8504E can cure fully in 30 seconds using optimal cure conditions. Due to the variability of different UV/LED light sources, it is suggested that the user test and specify intensity and exposure time. This product will cures best in the UVA wavelengths (315-365nm). FLASHBOND™ UV-8504E has been tested to and passes ISO-10993-5 standards for cytotoxicity.

FLASHBOND™ UV-5402

SetWORX™ 411HP is a toughened, high strength, industrial grade structural epoxy adhesive. This adhesive has an excellent combination of shear and peel strength. 411HP is a one component, heat cure, conductive epoxy adhesive. It has also excellent impact and vibration resistance and low temperature flexibility. This high-performance epoxy adhesive exhibits very good physical, thermal, and electrical insulation properties. It is recommended for bonding engineering thermoplastics, SMC (sheet molding compounds) in aerospace and automotive applications.

FLASHBOND™ UV-6502CL

HTG-72TC is our highest temperature resistance thermal grease along with very high thermal conductivity. It is a heavily filled system with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 360°C, maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.

EpoxySet Inc. HTG-72TC

CTG-81 is Non-Silicone; Non-curing, silver filled electrically and thermally conductive grease. It can be used as interfacial contact for electrical and thermal transfer for power devices. This material will not dry, harden or melt in normal industrial use and provides long term material stability.

EpoxySet Inc. CTG-81

STG-44 is a non-reactive, Silicone, Thermally Conductive Grease with a high thermal conductivity and low thermal resistance with a soft, non-flowable consistency. This product is formulated with specialty binding agents to achieve lowest amount of bleed and evaporations. It is designed for applications where a silicone thermal interface material is required and where the device may later need to be easily removed from the heat sink. This compound is ideally suited for use in thin cross-sectional thicknesses down to ≤1 mil.

EpoxySet Inc. STG-44

CTG-87NS is non-silicone; non-curing, silver filled electrically and thermally conductive grease. It can be used as interfacial contact for electrical and thermal transfer for power devices. CTG-87NS was specially formulated using various size silver flakes to maximize particle contact resulting in an extremely high thermal conductivity. This material will not dry, harden or melt in normal industrial use and provides long term material stability.

EpoxySet Inc. CTG-87NS

TG-64 is Non-Silicone thermal grease is exceptionally soft, non-silicone thermal grease. In addition to solving the problems of contamination and migration associated with traditional silicone-based thermal grease, this unique material can be spread into an extremely thin film while remaining a homogenous mixture.

EpoxySet Inc. TG-64

SetWORX 90 is a toughened, high strength, structural epoxy adhesive. This adhesive has an excellent combination of shear and peel strength. It has also excellent impact and vibration resistance and low temperature flexibility. This high performance epoxy adhesive exhibits very good physical, thermal, and electrical insulation properties. It is recommended for bonding engineering thermoplastics, SMC (sheet molding compounds) in aerospace and automotive applications. SetWORX 90 is BPA-Free and non-hazardous for shipping.

FLASHBOND™ UV-8701E

FLASHBOND™ UV-3700F is a filled, low shrinkage, light curing epoxy adhesive that offers low CTE and high bonds strength. UV-3700F cures to a high Tg, rigid polymer with excellent adhesive to metals, ceramics, and glass. This filled system is excellent for when low viscosity systems are not ideal. Due to the variability of different UV/LED light sources, it is suggested that the user test and specify intensity and exposure time. This product will cure in the presence of visible light (400- 415nm).

EPOXIBOND™ EB-135LP

EPOXIBOND™ EB-177 is a low viscosity, high Tg, two part epoxy that can be used for potting, encapsulating, or bonding. It is used highly in the medical, optical, and semiconductor industries.EB-177 has excellent high temperature resistance at 300°C and excellent solvent, chemical, and moisture resistance including gamma rays, autoclave, and ETO. It is an excellent choice for semiconductor applications including capillary under fill or flipchip die attach.

EPOXIBOND™ EB-107LP-1

EPOXIBOND™ EB-155 is an undiluted, unfilled, low viscosity clear epoxy system that exhibits exceptional resistance to impact and thermal shock. This system has low exotherm and long work life. Applications includes, high bond strength adhesive for most similar and dissimilar substrates; LED displays, any fiber optic application. It can also be used for making in-place laminates or for protective coating on metals etc. Also it can be used for semi-rigid, moisture proof, gas tight seals between plastic and metallic or other substrates. This is also recommended for potting devices such as connector shells from which rigid or flexible wires may protrude directly through the epoxy.

EPOXIBOND™ EB-109M-11

EPOXIBOND™ EB-107LY is a two-part, low viscosity, clear epoxy adhesive and encapsulating material. EB-107LY is a low yellowing version of EB-107LP-2. It is recommended for bonding and encapsulating where reduced yellowing is preferred. It is recommended for joining transparent materials, such as glass, and where a thin bond line is desired. EB-107LY can be used for bonding most metals, ceramics, and some plastics.

EPOXIBOND™ EB-107LY

HTG-72 – is our highest temperature resistance thermal grease, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 360°C, maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.

EpoxySet Inc. HTG-72

STG-51TC Heat Sink Compound is silicone thermal grease material heavily filled with heat-conductive metal oxides. These combinations provide high thermal conductivity, low bleed and high temperature stability. STG-51TC specially developed to solve the problems of contamination and migration associated with silicone-based products. The compound is a unique synthetic-based thermal grease use to insure quick, efficient heat transfer and dissipation

EpoxySet Inc. STG-51TC

EPOXIBOND™ EB-177

SETWORX™ 60 is a toughened, high strength, structural epoxy adhesive. This adhesive has an excellent combination of shear and peel strength. It has also excellent impact and vibration resistance and low temperature flexibility. This high performance epoxy adhesive exhibits very good physical, thermal, and electrical insulation properties.

FLASHBOND™ UV-8504E

SC-550 Primer is general-purpose primer for use with most silicone elastomer. It is a one- component, solvent-based primer that is available clear or tinted for ease of visual inspection.

EpoxySet Inc. Silicone Primer SC-550

TG-45LV is a specially formulated with low viscosity/screen printable consistency to achieve low BLT and high thermal conductivity for optimum thermal performance. Exhibits excellent resistance to pump out, outgassing and phase separation while eliminating concern of silicone deposition on optics and electronics within any package. TG-45LV is high performance thermal grease designed to meet the thermal, reliability and low-price requirements of high-end chipset, graphic processors trend ever-faster clock speeds. RoHS compliant and halogen -free

EpoxySet Inc. TG-45LV

TG-62M is Non-Silicone thermal grease is exceptionally soft, non-silicone thermal grease. In addition to solving the problems of contamination and migration associated with traditional silicone-based thermal grease, this unique material can be spread into an extremely thin film while remaining a homogenous mixture.

EpoxySet Inc. TG-62M

EPOXIBOND™ EB-135 is a clear epoxy adhesive designed for electronic, optical, medical, and general applications and for casting of small electrical components. This epoxy system has 2 to 1 mixing ratio by volume &amp; cure fast at moderate temperature. The cured adhesive gives high impact and bond strength. It can be used for bonding glass, metals, woods and some plastics

SetWORX™ 60

EPOXIBOND™ EB-119SP is unfilled, low viscosity, heat curing, high temperature resistant epoxy adhesive. It maintains high lap shear strength up to 210°C and has excellent thermal and chemical resistance. It can be used for bonding, coating, and sealing applications where a thin film with high insulating resistance is required, particularly at elevated temperatures. It is recommended for bonding metals, glass, and ceramic substrates. It has long pot-life and has an amber color change upon cure.

SetWORX™ 1510

EPOXIBOND™ EB-107LP-2 is a two component - optical, medical, and semiconductor grade epoxy resin, with low viscosity, long pot-life, and good handling characteristics.

EPOXIBOND™ EB-135

TG-61 is Non-Silicone thermal grease is exceptionally soft, non-silicone thermal grease. In addition to solving the problems of contamination and migration associated with traditional silicone-based thermal grease, this unique material can be spread into an extremely thin film while remaining a homogenous mixture.

EpoxySet Inc. TG-61

EPOXIBOND™ EB-135LP is a clear epoxy adhesive designed for electronic, optical, medical, and general applications and for casting of small electrical components. This epoxy system has 2 to 1 mixing ratio by volume &amp; cure fast at moderate temperature. The cured adhesive gives high impact and bond strength. It can be used for bonding glass, metals, woods and some plastics.

SetWORX™ 90

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