- Chemical Family:Epoxy & Epoxy Derivatives
- Product Type:2K (2 component) Adhesive, Adhesive
- Cure Method:Heat Cure
- Application Area:Sensors, Medical Applications, Semiconductors, Printed Electronics, Photonic Devices, Electronic Components, Optical Applications, Medical Devices, Semiconductor Die Attach, Optoelectronics Devices, Interconnect
- Compatible Substrates & Surfaces:Glass, Metal, Ceramic
EPOXIBOND™ EB-116 is high strength, structural epoxy adhesive. This tough adhesive has an excellent combination of shear and peel strength. It has also excellent impact and vibration resistance and low temperature flexibility. This high-performance epoxy adhesive exhibits very good physical, thermal, and electrical insulation properties and is excellent for cryogenic applications. It is recommended for bonding glass, metal, ceramics, and engineering thermoplastics. Due to its low viscosity, it can be also used for potting and encapsulating electrical/electronic coponents