Products

Fielco Adhesives FCO 9510 is a low viscosity, unfilled, fast setting, two-part epoxy adhesive designed for bonding plastic to plastic.

Fielco Adhesives Odyssey 6850 is an ambient curing potting compound that allows for the complete impregnation of small coils and components.

Fielco Adhesives Odyssey 3125 is an epoxy potting compound with excellent humidity, impact and abrasion resistance with service temperatures of 300°F.

Fielco Adhesives Odyssey 6840 is a tough, heat-curing anhydride-based potting compound with excellent electrical properties and adhesion to metal coils and enclosures.

Fielco Adhesives Odyssey 6870 is an impact-resistant, fast-setting electronic potting compound well suited for high humidity environments.

Fielco Adhesives FCO 9501 is a general purpose, flexible, long potlife, two-part epoxy adhesive designed for applications requiring excellent adhesion to metals and plastics.

Fielco Adhesives Odyssey 14146 is a semi-flexible, heat curing anhydride-based electronic potting compound for Class B electrical applications with excellent thermal shock and impact resistance.

Fielco Adhesives FCO 9509 is a multipurpose, high cohesive strength, two-part structural epoxy adhesive which provides superior adhesion to metals and plastics.

Fielco Adhesives Odyssey 6835 is a semi-flexible, heat-curing anhydride-based potting compound for Class B electrical applications with excellent thermal shock and moisture resistance.

Fielco Adhesives Odyssey 13915 is a fast-setting, ambient curing epoxy potting compound for the encapsulation of small circuit assemblies.

Fielco Adhesives Odyssey 1220 is a general purpose, ambient curing, two-part epoxy potting compound for various electrical applications.

Fielco Adhesives FCO 9513 is a high chemical resistant, long potlife, heat curing, two-part epoxy adhesive providing excellent bond strength to a variety of materials.

Fielco Adhesives Odyssey 174 is a tough, two-part, epoxy encapsulate and transducer mounting adhesive.

Fielco Adhesives FCO 9502 is a flexible, two-part epoxy adhesive with excellent wetting characteristics for applications requiring metal-metal, metal-plastic, or plastic-plastic bonding.

Fielco Adhesives Odyssey 6800 is a heat curing, fast setting, one-part epoxy adhesive designed for bonding applications requiring heat dissipation.

Fielco Adhesives Odyssey 6860 is a rapid setting, ambient curing epoxy potting compound for encapsulation of small circuit assemblies.