Products

HexPly® M79/M79-LT is a hotmelt, thermosetting, low-exothermic epoxy resin matrix, specifically designed for prepreg applications at which short cure cycles below 100°C are required. M79/M79-LT can be used for manufacture of large industrial components, suitable for cure of thin and thick sections. M79/M79-LT exhibits a long out-life of 8 weeks at ambient conditions. M79 is supplied as moderate tack and M79-LT as low tack resin matrix.

HexPly® M76 is a versatile curing toughened epoxy resin that can be cured from 275ºF (135ºC) to 350ºF (177ºC), depending on service temperature requirements. HexPly® M76 is formulated for lower temperature autoclave or press mold processing. The recommended lay-up procedure for HexPly® M76 is HSP-L4. The recommended cure procedures are HSP-C5 (275ºF) or HSP-C1 (350ºF).

HexPly® M21 is a high performance, very tough epoxy matrix for use in primary aerospace structures. It exhibits excellent damage tolerance, especially at high energy impacts. HexPly® M21 is a toughened epoxy resin system supplied with unidirectional or woven carbon or glass fibers. HexPly® M21 was developed as a controlled flow system to operate in environments up at 121°C (250°F).

HexPly® 8552 is a high performance tough epoxy matrix for use in primary aerospace structures. It exhibits good impact resistance and damage tolerance for a wide range of applications. HexPly® 8552 is an amine cured, toughened epoxy resin system supplied with unidirectional or woven carbon or glass fibers. HexPly® 8552 was developed as a controlled flow system to operate in environments up to 121ºC (250ºF).

HexPly® M65 is a bismaleimide resin that cures via an addition reaction in a toughened two-phase thermoset matrix with no condensation by-products. HexPly® M65 is a controlled bimaleimide resin system designed for alternative processing capabilities such as co-curing over honeycomb core, compression molding, as well as standard autoclave processing. HexPly® M65 has improved tack levels and performs well for fiber placement applications.

3501-6 is an amine cured epoxy resin system supplied with unidirectional or woven carbon or glass fibers. Typical reinforcement is continuous AS4 carbon filaments. 3501-6 was developed to operate in a temperature environment of up to 350°F (177°C). AS4/3501-6 is recommended for general purpose structural applications.

HexPly® 200 is a phenolic resin used extensively in fire proof components such as engine cowlings, fire walls, rocket nozzles and exit gas cones. The low smoke density and very low toxicity during ignition meet the requirements of FAR 25 and ATS 1000-001 specifications. The HexPly® 200 system has excellent ablative resistance and is available in fabric reinforcements and single tows.

HexPly® M34 is an epoxy system, specifically developed for low temperature curing of large structural components, particularly in industrial markets. HexPly® M34 is a self-extinguishing system, providing excellent fire-resistant properties, and meeting the German and French rail qualifications DIN 5510, S3-SR2-ST2 and NF F 16-101 (M2, F1). HexPly® M34 prepreg is ideal for manufacturing sandwich structures, providing excellent adhesion to PVC foam cores. HexPly® M34 exhibits a good shelf life at Room Temperature for a low temperature curing system.

HexPly® 913 is a proven modified epoxy matrix with a low temperature cure cycle which exhibits outstanding environmental resistance, whilst retaining good hot/wet mechanical performance. This versatile matrix system can be processed using a wide range of techniques according to the application and is capable of co cure with epoxy film adhesives. HexPly® 913 is a highly successful matrix used extensively in the aerospace industry for primary aircraft structures and helicopter blades.

HexPly® 8551-7 is an amine-cured, toughened epoxy resin system supplied with unidirectional graphite fibers. Typical reinforcement is continuous IM7 (intermediate modulus) graphite filaments. HexPly® 8551-7 was developed to operate in a temperature environment of up to 200ºF (93ºC). IM7/8551-7 is an extremely damage-resistant system, recommended for structural applications requiring high strength, stiffness, and damage tolerance. Conventional thermoset resin processing equipment and techniques can be used to process IM7/8551-7 prepreg tape.

HexPly® F155 is a Resin Systems for Advanced Composites

HexPly® F650 is a bismaleimide resin that cures via an additional/free radical mechanism resulting in a crosslinked thermoset system with no condensation by-products. HexPly® F650 was developed by Hexcel to overcome existing limitations for use on complex structures and ducting in advanced military aircraft, helicopters, and many other high temperature applications. HexPly® F650 simplifies fabrications and delivers a more costeffective end product.

HexPly® M47 is a 135°C curing toughened epoxy matrix, self-extinguishing (depending standard used) that has been developed for the high performance car market. The matrix exhibits good strength retention at elevated temperature, good process ability and good surface finish. Its Tg allows HexPly® M47 to be considered as an alternative to 180°C curing matrices when a high loaded part in hot environment (80°C) is required.

HexPly® 250 is a phenolic matrix widely used in honeycomb sandwich components for aircraft interior furnishings. The low smoke and low toxicity properties of 250 during ignition meet the requirements of FAR 25 and ATS 1000. HexPly® 250 prepreg is available in fabric reinforcements and single tows.

HexPly® M35-4 is a epoxy matrix with excellent mechanical and temperature performances combined with wide process flexibility, designed specifically for the high performance car industry. Curing temperature ranges from 80–180°C providing process flexibility.

HexPly® F584™ is a modified epoxy resin combined with novel proprietary converters to give maximum elongation on high strain carbon fibers while retaining a wet service capability of 200°F (93°C). This system offers greater toughness and impact resistance than conventional 350°F (177°C) cure epoxy thermoset resins.

HexPly® 108 is a high temperature resistant epoxy resin system developed for the fabrication of primary aircraft and space structures. 108 has excellent hot wet properties and exhibits low viscosity

HexPly® M901 is a hotmelt, thermosetting, high-tack epoxy resin matrix, suitable for prepreg applications at which cure cycles of 130°C and above are required. HexPly® M901 is specifically designed for manufacture of structural composites that are exposed to harsh thermal and environmental conditions.

HexPly® M26 is an advance modified epoxy resin developed for aerospace and industrial markets.Its controlled flow, high peel strength on honeycomb cores and excellent fire behavior give it a cost saving potential for interior and secondary sandwich structures. Combined with HexPly® M25 glass phenolic prepregs, it is qualified to Airbus specifications.

HexPly® 916 is a self-extinguishing modified epoxy matrix system with very high self adhesive properties. It is an ideal system for single shot honeycomb sandwich manufacture, with good drape characteristics. HexPly® 916 exhibits excellent environmental resistance, and good service temperature capability. HexPly® 916 prepregs are only available in fabric form.

HexPly® M18/1 is a high performance, self extinguishing, tough epoxy matrix for use in primary aerospace structures. It exhibits low moisture absorption at saturation. HexPly® M18/1 is a toughened epoxy resin system supplied with unidirectional and woven carbon fibers. HexPly® M18/1 was developed as a controlled flow system to operate in environments up to 135ºC.

HexPly® 6376 is a high performance tough matrix formulated for the fabrication of primary aircraft structures. It offers high impact resistance and damage tolerance for a wide range of high temperature applications.

HexPly® 954-2A is a 350ºF (177ºC) curing toughened cyanate resin with low moisture absorption, and excellent microcracking resistance. HexPly® 954-2A is formulated for autoclave or press molding. Recommended cure is two hours at 350ºF (177ºC). The recommended lay-up procedure is HSP-L3. The recommended cure procedure is HSP-C1 or HSP-C3. Typical applications for HexPly® 954-2A include primary and secondary aircraft structure, space structures, cryogenic tanks, or any application where impact resistance, light weight and excellent dielectric properties are required. HexPly® 945-2A can be impregnated via hot melt or solution techniques on all available fibers and fabrics.

HexPly 260 is a phenolic resin developed to meet such F.S.T. (Fire, Smoke, Toxicity) regulations and the 1990 O.S.U. index (65/65), for aircraft interior parts as: side wall panels, floor panel, galleys, ceiling panels and lavatories. HexPly 260 prepreg is available in various fabric reinforcements.

HexPly® M81 is a high performance tough epoxy matrix for use in industrial applications requiring good impact resistance and damage tolerance, such as the automotive industry. HexPly® M81 is based on the highly successful HexPly® 8552 toughened epoxy resin system, used widely around the world for the manufacture of aircraft structures. Non-aerospace customers now have the opportunity to benefit from the excellent performance of this resin system presented with reinforcements specially adapted for industrial markets.

HexPly® 954-3 is a 350ºF (177ºC) curing cyanate resin with excellent resistance to moisture absorption, outgassing and microcracking. HexPly® 954-3 is formulated for autoclave or press molding using a standard cure of two hours at 350ºF (177ºC). Glass transition temperature can be maximized by post curing at 450ºF (232ºC). The recommended lay-up procedure is HSP-L3. The recommended cure procedure is HSP-C1 or HSP-C2.

HexPly® F655™ is a bismaleimide resin that cures via an addition reaction in a toughened two-phase thermoset matrix with no condensation by-products. HexPly® F655™ is a controlled flow polyimide resin system designed for alternative processing capabilities such as co-curing over honeycomb core, compression molding, as well as standard autoclave processing.

HexPly® 1454 is a self-extinguishing epoxy resin system with very high self adhesion properties. It has good handling and is tolerant of a wide range of processing conditions. HexPly® 1454 is ideal for the fabrication of honeycomb sandwich structures when high peel strength and good impact properties are required. HexPly® 1454 prepregs are only available with fabric reinforcements.

HexPly® F652 is a bismaleimide resin that cures via an addition reaction with no condensation by-products. HexPly® F652 is a controlled flow polyimide resin system designed for alternative processing capabilities such as co-curing over honeycomb core, compression molding, as well as standard autoclave processing.

HexPly 1458 is a self-extinguishing and self-adhesive modified epoxy resin system for monolithic and sandwich structures. HexPly 1458 has excellent temperature and moisture resistance. It has a versatile cure cycle at 160°C to 180°C and it has an excellent shelf life at room temperature. HexPly 1458 prepregs are only available in fabric form.

HexPly® M56 is a high performance epoxy matrix developed for out-of-autoclave curing of composite aircraft structures.

HexPly® EH25 is a high performance, tough 180°C curing matrix for use in Aerospace primary structures. HexPly® EH25 is a self-extinguishing epoxy resin with controlled flow. HexPly® EH25 prepregs are available with fabric and UD tape.

HexPly® F263 is a structural, heat resistant epoxy resin formulated for excellent translation of high modulus carbon fiber properties in typical aerospace applications. HexPly® F263 is a high temperature, aerospace grade, epoxy resin for HMG with a 350°F (177°C) core.

HexPly® M12 is a good performance, tough epoxy matrix for use in helicopter blades. It exhibits good fatigue life and hot/wet performances up to 100°C. HexPly® M12 is supplied with R-glass UD tape, glass and carbon woven fibers. HexPly® M12 was developed for low exotherm curing, so parts with thickness above 10 cm can be cured directly to 135°C without any exothermal risks.

HexPly® F185™ is an advanced epoxy formulation designed for autoclave curing to offer very high sandwich and metal bonding strengths with moderate laminate strengths. HexPly® F185™ is a structural adhesive and cocuring grade epoxy resin with a 250°F (121°C) cure. This system offers the highest available fracture toughness and strain to failure of the 250°F (121°C) cure resins.

HexPly® 954-6 is a 250ºF (121ºC) curing toughened cyanate resin with 300ºF (149ºC) Tg. HexPly® 954-6 is formulated for autoclave curing. Recommended cure is three hours at 250 F (121ºC). Service temperatures are maximized by a post cure of 350ºF - 450ºF (177ºC - 205ºC). The recommended lay-up procedure is HSP-L3. The recommended cure procedure is HSP-C4. Typical applications for HexPly® 954-6 include space structures, such as solar arrays, antennae and support structures, or any application where impact resistance, light weight, excellent dielectric and low outgassing properties are required. HexPly® 954-6 can be impregnated on all available fibers and fabrics.