- Polymer Name:Thermoset Polyimide (PI)
- Functions:Prepreg
HexPly® F650 is a bismaleimide resin that cures via an additional/free radical mechanism resulting in a crosslinked thermoset system with no condensation by-products. HexPly® F650 was developed by Hexcel to overcome existing limitations for use on complex structures and ducting in advanced military aircraft, helicopters, and many other high temperature applications. HexPly® F650 simplifies fabrications and delivers a more costeffective end product.